JPS60250656A - Mounting method of ic chip - Google Patents

Mounting method of ic chip

Info

Publication number
JPS60250656A
JPS60250656A JP10689284A JP10689284A JPS60250656A JP S60250656 A JPS60250656 A JP S60250656A JP 10689284 A JP10689284 A JP 10689284A JP 10689284 A JP10689284 A JP 10689284A JP S60250656 A JPS60250656 A JP S60250656A
Authority
JP
Japan
Prior art keywords
chip
hole
substrate
electric circuit
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10689284A
Other languages
Japanese (ja)
Inventor
Shigenari Takami
茂成 高見
Tatsuhiko Irie
達彦 入江
Jiro Hashizume
二郎 橋爪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10689284A priority Critical patent/JPS60250656A/en
Publication of JPS60250656A publication Critical patent/JPS60250656A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To readily mount on a flexible electric circuit substrate by forming the substrate in a hole formed at a hard insulating plate, mounting an IC chip in the hole, and separating it from the peripheral edge of the hole except part. CONSTITUTION:A punched hole 2 is formed at a hard insulating substrate 1, and a flexible circuit substrate 3 is mounted. An IC chip 6 is bonded on the hole 2, wired at 4 and sealed with resin 5. The substrate 3 is separated from the periphery of the hole 2 except part to hold conductive state. The circuit of the separated part has flexibility, is cut or bent as required, and can be readily connected with other circuit. According to this configuration, the substrate can be secured at the IC chip mounting time, wire bonding can be stably performed, the mount of the chip is erected at using time as a flexible electric circuit, and particularly advantageous to be associated with a product of thin and small size.

Description

【発明の詳細な説明】 〔技術分野」 この発明はＩＣチップの電気回路基板への実装方法番ζ
関する。[Detailed Description of the Invention] [Technical Field] This invention relates to a method for mounting an IC chip onto an electric circuit board.
related.

〔背景技術〕[Background technology]

従来、ＩＣチップのフレキシブルな電気回路基板への実
装は、柔らかな基板の固定が困難で、ホゞンディングで
きたとしても、その後の取り扱い蒔に基板が曲かったり
して、ポンディングワイヤーにストレスがかかり、断線
に至ることが多い。Conventionally, when mounting IC chips on flexible electrical circuit boards, it is difficult to fix the soft board, and even if the board can be bonded, the board may bend during subsequent handling, resulting in stress on the bonding wire. This often results in disconnection.

そ♀為一般的には、ＩＣチップをセラミック基板、ガラ
スエポキシ基板等のリジッドな電気回路基板に、ボンデ
ィングし、封止した後フレキシブルな回路部分が必要な
ときは必要に応じフレキシブルな電気回路基板をはんだ
付は等で接続接合して−）る。Therefore, in general, if an IC chip is bonded to a rigid electrical circuit board such as a ceramic substrate or a glass epoxy board, and then sealed, if a flexible circuit part is required, a flexible electrical circuit board is attached as needed. For soldering, etc., connect and join.

マン、一部、ハ、ＩＣ−１−，７プ側’ＩＣ／＜　７ブ
を設け、そのバンプで直接フレキシブルな電気回路基板
に接合する方法（フリップチップ）も考案されているが
、バンプの形成には特殊な技術を必要とし、高価につく
ので、まだ一般的ではない。A method (flip chip) has also been devised in which a bump is provided on the IC-1-,7 side and the bump is directly bonded to a flexible electrical circuit board. It is not yet common because it requires special techniques to form and is expensive.

〔発明の目的〕[Purpose of the invention]

この発明はフレキシブルな電気回路基板へＩＣチップを
直接実装する方法を提供せんとするものである。This invention aims to provide a method for directly mounting an IC chip on a flexible electric circuit board.

〔発明の開示〕[Disclosure of the invention]

この発明の要旨とするところは硬質の絶縁板に孔を設け
、鎖孔の上にフレキシブルな電気回路基板を張設し、鎖
孔の上において該基板にＩＣチップを実装し、該基板を
電気的導通状態が維持できるように一部分を残して抜孔
の周囲より切り離すことを特徴とするＩＣチップの実装
方法である。The gist of this invention is to provide a hole in a hard insulating plate, stretch a flexible electric circuit board over the chain hole, mount an IC chip on the board above the chain hole, and connect the board with electricity. This IC chip mounting method is characterized in that the IC chip is separated from the periphery of the hole, leaving only a portion so as to maintain electrical conductivity.

以下この発明を図示せる一実施例に基づいて説明する。The present invention will be described below based on an illustrative embodiment.

まず、硬質の絶縁板（１）に打抜きの孔（２）を設け、
この絶縁板（１）にフレキシブルな電気回路基板（３）
を打抜き孔（２）をふさぐように張設しておく。First, punch holes (2) are made in a hard insulating plate (1),
A flexible electric circuit board (3) is attached to this insulating board (1).
Stretch it so as to cover the punched hole (2).

この状態で、フレキシブルな電気回路基板（３）の孔（
２）上の部分にＩＣチップ（６）をダイボンドし、つい
でワイヤー（４）を９イヤーボンドし、最後に樹脂（５
）で封止す名。In this state, hold the hole (
2) Die-bond the IC chip (6) to the upper part, then 9-year bond the wire (4), and finally attach the resin (5).
).

この状態で、フレキシブルな電気回路基板（３）を電気
的導通状態が維持できるよう一部分を残して孔（２）の
周囲より切り離す。In this state, the flexible electric circuit board (3) is separated from the periphery of the hole (2), leaving a portion so that electrical continuity can be maintained.

而して絶縁板α）より切り離したＩＣチップ（６）を実
装した部分の回路は柔軟渉を有している。従ってＩＣチ
ップ（６）を実装した部分のフレキシブルな電気回路基
板（３）は必要に応じて切断や曲げ加工をおこなうこと
かでき、他の電気回路基板（図示せず）への接続も容易
である。Thus, the circuit in the portion where the IC chip (6) separated from the insulating plate (α) is mounted has a flexible circuit. Therefore, the flexible electric circuit board (3) on which the IC chip (6) is mounted can be cut or bent as necessary, and it can be easily connected to other electric circuit boards (not shown). be.

尚、孔３）はカッターを入れてフレキシブルな電気回路
基板（３３を周囲より切断するためのものであるので必
ずしも打抜き孔でなくともよく、単なる四部でもよいし
、またカッターの刃先を入れるためのループ状の凹部で
もよいが、打抜き孔にして君くと切離した部分の電気回
路を裏面側に導出するのに便利である。Note that the hole 3) is for inserting a cutter to cut the flexible electric circuit board (33) from the surrounding area, so it does not necessarily have to be a punched hole, and may be just a four-part hole, or a hole for inserting the cutting edge of the cutter. A loop-shaped recess may be used, but it is convenient to make a punched hole and lead out the electrical circuit of the separated part to the back side.

フレキシブルな電気回路基板（３）はこれにＩＣチップ
（６）をグイボンドするときには絶縁板（１）の枠に支
持されているのでリジッドな電気回路基板（３）に実装
するのと同様に楽に２こなえるのである。The flexible electric circuit board (3) is supported by the frame of the insulating plate (1) when the IC chip (6) is mounted on it, so it is easy to mount it on the rigid electric circuit board (3). I can handle it.

絶縁板（１）としてはフェノール樹脂等の合成樹脂板が
、フレキシブルな電気回路基板（３）としては厚さ０．
０５１１程度のポリイミド樹脂膜に銅を積層したものが
一般的に使用される。The insulating board (1) is a synthetic resin board such as phenol resin, and the flexible electric circuit board (3) is a board with a thickness of 0.
A polyimide resin film of about 0511 and copper laminated thereon is generally used.

〔発明の効果〕〔Effect of the invention〕

叙上の如くこの発明によればＩＣチップの実装時にはフ
レキシブルな電気回路基板が固定でき、ボンディング・
ワイヤボンディングが安定してお仁なえる利点がある。As described above, according to this invention, a flexible electric circuit board can be fixed when mounting an IC chip, and bonding and
It has the advantage that wire bonding is stable and easy to use.

そして使用時にはＩＣチップの実装部分を切り＄こして
フレキシブルな電気回路として使用することができ、特
に薄型、小型When in use, the mounting part of the IC chip can be cut and used as a flexible electrical circuit, making it particularly thin and compact.

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第５図に示すのはこの発廟の一実施例で、第
１図乃至第４図は断面図、！１８５図は斜視図である。 特許出願人 松下電工株式会社 代理人弁理士　竹　元　敏　丸 （ほか２名） 第２図 第５図Figures 1 to 5 show one embodiment of this mausoleum, and Figures 1 to 4 are cross-sectional views. Figure 185 is a perspective view. Patent applicant Matsushita Electric Works Co., Ltd. Patent attorney Toshimaru Takemoto (and 2 others) Figure 2 Figure 5

Claims (1)

【特許請求の範囲】[Claims] （１）硬質の絶縁板に孔を設け、鎖孔の上にフレキシブ
ルな電気回路基板を張設し、鎖孔の上において該基板に
ＩＣチップを実装し、該基板を電気的導通状態が維持で
きるように一部分を残して鎖孔の周囲より切り離すこと
を特徴とするＩＣチップの実装方法。(1) A hole is made in a hard insulating plate, a flexible electric circuit board is stretched over the chain hole, an IC chip is mounted on the board above the chain hole, and the electrical continuity of the board is maintained. A method for mounting an IC chip, which is characterized in that the IC chip is separated from the periphery of the chain hole, leaving a part so that the IC chip can be removed.
JP10689284A 1984-05-25 1984-05-25 Mounting method of ic chip Pending JPS60250656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10689284A JPS60250656A (en) 1984-05-25 1984-05-25 Mounting method of ic chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10689284A JPS60250656A (en) 1984-05-25 1984-05-25 Mounting method of ic chip

Publications (1)

Publication Number Publication Date
JPS60250656A true JPS60250656A (en) 1985-12-11

Family

ID=14445123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10689284A Pending JPS60250656A (en) 1984-05-25 1984-05-25 Mounting method of ic chip

Country Status (1)

Country Link
JP (1) JPS60250656A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0852397A1 (en) * 1997-01-02 1998-07-08 Texas Instruments Incorporated Cantilevered ball connection for integrated circuit chip package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0852397A1 (en) * 1997-01-02 1998-07-08 Texas Instruments Incorporated Cantilevered ball connection for integrated circuit chip package
US6064576A (en) * 1997-01-02 2000-05-16 Texas Instruments Incorporated Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board

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