JPS60234334A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable to secure an excellent heat radiating property and to enhance the reliability of a semiconductor chip by a method wherein the electric connection wire attached to the semiconductor chip is connected to a mounting substrate by bending it property and, at the same time, the semiconductor chip is bonded to the mounting substrate through the intermediary of a metal connecting member. CONSTITUTION:The conductive connection wire 2, one side of which is attached to the bonding pad 3 of a semiconductor chip 1, is bent along the side face of the semiconductor chip 1 isolated from the side face of the semiconductor chip, and the other end part positioned on the reverse side of the semiconductor chip is connected to the conductive part 5 which is multiple-arrangement patterned on a mounting substrate 4 using a connecting material 6. When said mounting substrate 4 is constituted by a material having excellent heat radiating property and the semiconductor chip 1 is constituted by a silicon substrate, the difference of thermal expansion coefficient of the connection part between the substrate 1 and the mounting substrate 4 can be absorbed by the elasticity of the connecting wire 2, and the trouble pertaining to the thermal distortion caused by the difference in thermal expansion coefficient of the connection part can be dissolved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a semiconductor device, and particularly to a technique for mounting a semiconductor chip onto a substrate.

[Background technology]

In this flip-chip method, the semiconductor chip is face-down bonded to the mounting board using hemispherical solder bump electrodes formed on the semiconductor chip.However, according to this flip-chip method, the semiconductor chip is separated from the mounting board by solder bumps. Since it is in a floating state, it is difficult for the heat generated from the semiconductor chip to escape, and its heat dissipation is limited.

On the other hand, according to this flip-chip method, thermal strain due to the difference in coefficient of thermal expansion between the semiconductor chip (usually a silicon substrate is used) and the mounting substrate (usually a ceramic substrate is used) concentrates on the solder bumps. When the solder bump reaches its thermal fatigue limit, mechanical and electrical connections will fail.

This will significantly reduce the reliability of the semiconductor device. (The flip-chip method is shown, for example, in IP 8 of RRC ``Kisho Shohoro Shizushin'' published by the Industrial Research Association, ``4I Plans ≦ Mother) Shen Subin; Mounting Technology''. ) [Objective of the Invention] The present invention provides a semiconductor device that ensures good heat dissipation of a semiconductor chip, ensures reliability of the connection portion between the semiconductor chip and the mounting board, and enables high-density packaging. The purpose is to

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, electrical connection wires are attached to the semiconductor chip, and these connection wires are bent appropriately and connected to the mounting board, and the semiconductor chip is bonded to the mounting board via a metal connection member, so that the heat of the semiconductor chip is reduced. The heat dissipation of the semiconductor chip is good, and the difference in thermal expansion coefficient between the semiconductor chip and the mounting board is absorbed by the connection wire. Therefore, the reliability of the connection part is improved, and since a plurality of semiconductor chips can be arranged in a relatively narrow area, high-density packaging is possible.

〔Example〕

Next, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 1 is a plan view of the main parts of the semiconductor device of the present invention, and FIG.
FIG. 1 shows a sectional view taken along line 1-T.

In FIG. 1, numeral 1 denotes a semiconductor chip, which is made of, for example, a silicon single crystal substrate. By well-known techniques, a large number of circuit elements are formed within this semiconductor chip to provide a single circuit function. The circuit elements are made of, for example, MOS or bipolar, and these circuit elements form, for example, a logic circuit and a memory circuit function.

One end portion of a large number of striped electrical connection lines 2 is connected to the periphery of the rectangular semiconductor chip 1 at appropriate intervals.

This connection may be made, for example, by connecting the connection wire 2 to a large number of bonding pads 3 arranged around the semiconductor chip 1 by a method similar to wire bonding, such as ultrasonic bonding, or by connecting the connection wire 2 to a large number of bonding pads 3 arranged around the semiconductor chip 1. Bump electrodes may be formed in advance and connected by a film carrier method such as bonding to finger leads on a polyimide film (tape).

The striped electrical connection line 2 is made of a conductive material such as metal. A specific example of metal is copper (Cu
) and aminium (AQ).

This striped electrical connection line 2 needs to have a certain degree of mechanical strength so that it can be bent.

That is, as mentioned above, the semiconductor chip (pellet 1-)
This connecting wire 2, one side of which is attached to the bonding pad 3 of ], is bent along the side surface of the semiconductor chip 1 and away from the side surface of the semiconductor chip 1, as shown in FIG. As shown in FIG.
This is done so that the other end of the shifted connection line 2 is located on the back surface of the semiconductor chip 1.

The other end of the connection line 2 is connected to a plurality of conductor parts 5 patterned on the mounting board 4 by a connection material 6.

The mounting board 4 is preferably made of a material with good heat dissipation properties, such as a ceramic substrate or a silicon carbide substrate. When the semiconductor chip 1 is made of a silicon substrate, the difference in thermal expansion coefficient at the connection between the substrate 1 and the mounting board is absorbed by the elasticity of the connection wire 2, and the difference is based on the difference in the thermal expansion coefficient at the connection. It can solve the problem of thermal distortion.

Although not shown in FIG. 2, the mounting board 4 is preferably a multilayer wiring board formed by laminating a large number of ceramic wiring boards from the viewpoint of high-density mounting.

A conductor pattern 5 is formed on the surface of the mounting board 4, and this patterning is performed by a well-known printed wiring technique, and the conductor pattern 5 is made of, for example, tungsten or an AQ metallized layer.

For example, solder is used as the connecting material 6. Use solder as the connecting material 6, and on the other hand, connect the bonding pad 3 of the connecting wire 2 with C.
When using solder bumps such as those used in the CB method, it is preferable to use solder bumps that have different melting points, so that the solder bumps 3 do not melt together with the melting of the solder connection material 6. .

As described above, in the present invention, the semiconductor chip 1 and the mounting board 4 are electrically connected by the connection wire 2, and
The back side of the semiconductor chip 1 is mounted on a mounting board 4 as shown in FIG.
Bond to. This bonding is performed by face-up bonding.

A metallized layer is formed on the back surface of the semiconductor chip 1 in the same manner as the conductor pattern 5, and the semiconductor chip 1 is bonded (pellet-attached) to the conductor portion 5 of the mounting board 4 via the connecting member 8.

The present invention is characterized in that the electrical connection between the semiconductor chip 1 and the mounting board 4 via the electrical connection line 2 and the bonding of the semiconductor chip 1 to the mounting board 4 can be performed simultaneously.

That is, for example, solder or silver paste is applied to the surface of the other end of the electrical connection line 2, and on the other hand, the mounting board 4 is
Solder or silver paste is also applied to the metallized layer 5-, and the solder or silver paste is thermally melted to effect the above-mentioned pellet attachment and electrical connection at the same time.

The semiconductor device of the present invention is completed by protruding external pins from the lower part of the mounting board and hermetically sealing the cap.

〔effect〕

(1) Since the electrical connection wire 2 is bent into a U-shape and the other end of the connection wire extends to the back surface of the semiconductor chip, a large number of semiconductor chips can be mounted on the mounting board. High-density packaging is possible by multi-chip. Conventional wire bonding requires a wide bonding area, which prevents the mounting of multiple conductor chips, but the present invention allows multiple pellets to be mounted.
・Can be mounted in a minimum area, making it extremely effective for high-density mounting.

(2) Electrical connection between the semiconductor chip and the mounting board and pellet attachment of the semiconductor chip can be performed simultaneously. Therefore, the semiconductor chip and the connection line can be connected to the mounting board at the same time, and the semiconductor device can therefore be manufactured relatively easily and quickly.

The present invention is also a useful technique when implementing the above-mentioned multi-chip system.

Furthermore, compared to wire bonding, it is possible to improve work efficiency and reliability of the connection portion of a semiconductor device.

(3) Heat generated from the semiconductor chip can be released to the mounting board through the electrical connection lines and the chip connection member.

Even if the semiconductor chip is an LSI with large power consumption, heat can be radiated from the semiconductor chip to the mounting board via the connection line, and good heat radiation performance can be ensured.

(4) Even if thermal strain occurs in the bonding pad of the semiconductor chip to which one end of the connecting member connecting the semiconductor chip and the mounting board and one end of the electrical connection line connects, the connection line Since the thermal strain is absorbed by the bonding pad, sufficient reliability of the connection portion can be ensured even if solder is used for these connection members and bonding pads.

Although the invention made by the present inventor has been specifically explained above based on examples, the present invention is not limited to the examples described above, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say.

For example, in the above embodiment, an example was shown in which one end of the electrical connection wire was connected (attached) to the bonding pad of the semiconductor chip and then the connection wire was bent. It may be done before installation.

Further, although the embodiment described above shows an example in which the metallized layer 7 is provided on the back surface of the semiconductor chip, this is not necessarily required.

Furthermore, in the above embodiment, an example was shown in which the bent end of the electrical connection line was located on the back surface of the semiconductor chip, but as long as it is bent along the side surface and away from the side surface,
The connection line does not necessarily need to extend all the way to the back surface of the semiconductor chip.

Further, in the above embodiment, an example was shown in which the semiconductor chip was mounted on the plane of the mounting board, but it is also possible to provide a groove on the surface of the mounting board and mount the semiconductor chip within the groove. The connection position can be changed in various ways.

Furthermore, in the above embodiment, an example was shown in which the bonding pad of the semiconductor chip and one end of the electrical connection line were connected.
A hole may be formed in the side surface of the semiconductor chip, and an electrical connection wire may be inserted into the hole and connected to internal wiring within the semiconductor chip.

[Application field]

The above explanation has mainly been about the case where the invention made by the present inventor is applied to the field of application which is the background of the invention, which is the technology for mounting a semiconductor chip on a mounting board of a semiconductor device, but the present invention is not limited thereto. .

[Brief explanation of the drawing]

FIG. 1 is a plan view of essential parts showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along line 1-1 in FIG. ■... Semiconductor chip, 2... Electrical connection line, 3... Bonding pad, 4... Mounting board, 5... Conductor part, 6... Connecting material, 7... Metallized layer, 8 ...Connection member.

Claims (1)

[Claims] 1. Connecting one end of a striped electrical connection line to a semiconductor chip, bending the connection line along and away from the side surface of the semiconductor chip; Connect the other end of the connected wire to the conductor part of the mounting board, and
A semiconductor device characterized in that the back surface of the semiconductor chip is bonded to the mounting board via a connecting member, and the semiconductor chip is bonded to the mounting board and the semiconductor chip and the mounting board are electrically connected together. . 2. The semiconductor device according to claim 1, wherein the connecting wire is bent in a U-shape so that the bent end thereof is located on the back surface of the semiconductor chip.