JPS60225444A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS60225444A JPS60225444A JP59081055A JP8105584A JPS60225444A JP S60225444 A JPS60225444 A JP S60225444A JP 59081055 A JP59081055 A JP 59081055A JP 8105584 A JP8105584 A JP 8105584A JP S60225444 A JPS60225444 A JP S60225444A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- transistors
- transistor
- circuit
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Logic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59081055A JPS60225444A (ja) | 1984-04-24 | 1984-04-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59081055A JPS60225444A (ja) | 1984-04-24 | 1984-04-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60225444A true JPS60225444A (ja) | 1985-11-09 |
| JPH0369176B2 JPH0369176B2 (https=) | 1991-10-31 |
Family
ID=13735722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59081055A Granted JPS60225444A (ja) | 1984-04-24 | 1984-04-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60225444A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210366902A1 (en) * | 2019-03-15 | 2021-11-25 | Socionext Inc. | Semiconductor integrated circuit device |
-
1984
- 1984-04-24 JP JP59081055A patent/JPS60225444A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210366902A1 (en) * | 2019-03-15 | 2021-11-25 | Socionext Inc. | Semiconductor integrated circuit device |
| US12159866B2 (en) | 2019-03-15 | 2024-12-03 | Socionext Inc. | Semiconductor integrated circuit device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0369176B2 (https=) | 1991-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |