JPS60223125A - ドライ・プロセス装置における被処理基板の電極上への着脱装置 - Google Patents

ドライ・プロセス装置における被処理基板の電極上への着脱装置

Info

Publication number
JPS60223125A
JPS60223125A JP7843984A JP7843984A JPS60223125A JP S60223125 A JPS60223125 A JP S60223125A JP 7843984 A JP7843984 A JP 7843984A JP 7843984 A JP7843984 A JP 7843984A JP S60223125 A JPS60223125 A JP S60223125A
Authority
JP
Japan
Prior art keywords
wafer
elastic support
electrode
dry
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7843984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527258B2 (enExample
Inventor
Masayoshi Serizawa
芹澤　正芳
Toru Otsubo
徹 大坪
Susumu Aiuchi
進 相内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7843984A priority Critical patent/JPS60223125A/ja
Publication of JPS60223125A publication Critical patent/JPS60223125A/ja
Publication of JPH0527258B2 publication Critical patent/JPH0527258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP7843984A 1984-04-20 1984-04-20 ドライ・プロセス装置における被処理基板の電極上への着脱装置 Granted JPS60223125A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7843984A JPS60223125A (ja) 1984-04-20 1984-04-20 ドライ・プロセス装置における被処理基板の電極上への着脱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7843984A JPS60223125A (ja) 1984-04-20 1984-04-20 ドライ・プロセス装置における被処理基板の電極上への着脱装置

Publications (2)

Publication Number Publication Date
JPS60223125A true JPS60223125A (ja) 1985-11-07
JPH0527258B2 JPH0527258B2 (enExample) 1993-04-20

Family

ID=13662065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7843984A Granted JPS60223125A (ja) 1984-04-20 1984-04-20 ドライ・プロセス装置における被処理基板の電極上への着脱装置

Country Status (1)

Country Link
JP (1) JPS60223125A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02228035A (ja) * 1989-03-01 1990-09-11 Hitachi Ltd 真空処理装置
JPH02268427A (ja) * 1989-04-11 1990-11-02 Tokyo Electron Ltd プラズマ処理装置
JP2005276886A (ja) * 2004-03-23 2005-10-06 Nikon Corp 静電チャックおよび露光装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02228035A (ja) * 1989-03-01 1990-09-11 Hitachi Ltd 真空処理装置
JPH02268427A (ja) * 1989-04-11 1990-11-02 Tokyo Electron Ltd プラズマ処理装置
JP2005276886A (ja) * 2004-03-23 2005-10-06 Nikon Corp 静電チャックおよび露光装置

Also Published As

Publication number Publication date
JPH0527258B2 (enExample) 1993-04-20

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