JPS60221233A - Method of protecting outer surface of semiconductor wafer - Google Patents

Abstract

PURPOSE:To prevent an absorbing means from being made in direct contact with the circuit forming surface of a semiconductor wafer, by disposing a plastic film formed therein with several holes between the absorbing means and the circuit forming surface of the semiconductor wafer. CONSTITUTION:The outer peripheral surface of a pan-like member 8 is formed in a taper-like shape, and the outer surface of the pan-like member 8 is covered with a porous plastic film 15 having its skirt edge is retained and secured by means of a tapered ring 16 fitted on the outer peripheral surface of the member 8. Since this film 15 is porous, when a semiconductor wafer 2 is set on the film 15 and is then absorbed, this wafer 2 is atracted to an absorbing member A through the intermediary of the film 15. Further, upon repalcement of the film 15 the tapered ring 16 is pulled up to remove the film 15 in a simple manner so that the film 15 may be easily replaced with new one. With this arrangement, it is possible to prevent the absorbing member from being made in direct contact with the circuit forming surface of the semiconductor wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION +1) B=Field of Industrial Application This invention relates to a method for protecting the surface of a semiconductor wafer during the manufacturing process of an integrated circuit using the semiconductor wafer.

(2) Conventional technology During the manufacturing process of integrated circuits, after configuring circuits such as transistors and diodes on the surface of a semiconductor wafer,
In recent years, many devices have been cut into individual elements, but before the cutting process, as shown in FIG. It has become to.

When performing this work, the circuit 3 side of the wafer 2 with its back side facing up is suctioned and fixed by the suction means A as shown in FIG. 3, and the ring frame 1 is also suctioned and fixed by the suction means B. An adhesive film 4 with the adhesive side facing down is attached to the back side of these.

As shown in FIGS. 3 and 5, the suction means A has a dish-shaped member 8 embedded with porous ceramic or sintered metal 7 fixed to the upper end of a vibro connected to a vacuum suction device (not shown). The surface of this sintered metal 87 is used as an adsorption surface, or as shown in FIG. There is one in which the groove 10 and the vibro are communicated with each other through a communication hole 11, and the upper surface of the member 9 is used as a suction surface. In addition, the suction means B is a cylindrical member 12 provided with a plurality of communication holes 13 that pass through a vacuum suction device (not shown), the upper end of which is opened at one end of the member 12. In addition, although not shown,
There are also t-air tweezers that utilize I11 empty suction.

(3) The invention is solved. L good luck! :! Point c-f When using the above-mentioned suction means, in the past, the suction surface directly leaks into the circuit 3 of the wafer 2, so that the silicon debris on the surface of the wafer 2 is absorbed by Jl,! Objects or foreign objects in the air?J, l'L 1. If foreign matter accumulates on the surface of L127 or the groove 10, it may be difficult to assemble it into U-[C-2]. There is a risk of damaging circuit 3! There is 111'l.

(4) In order to solve the problems described in Means for Solving Problems, the present invention (J. Circuit formation on semiconductor wafers'+f11 is carried out by suction and holding with one stage of suction blades, half of 29 wafers are A plastic film having a large number of rl is interposed between the circuit formation surface and the suction means to prevent the suction means from directly touching the circuit formation surface of the semiconductor wafer.

(5) Function: As described in ``-'', a plastic film having a large number of holes is interposed between the suction means and the circuit-forming surface of the wafer, and the circuit-forming surface of the semiconductor wafer is attracted through the plastic film.

(6) Embodiment 11 In the 1st embodiment, the outer peripheral surface of the dish-shaped part set 8 is tapered. It is held down and fixed by a tapered ring 16 fitted around the outer periphery. Others are 3rd
This is the same as the case shown in the figure.

Since the above film 15 is porous, the film 15
-1r, and the wafer 2 is suctioned by the suction means A through the film 15.

When replacing the film 15, the film 15 can be easily removed by pulling up the taper ring 16 and replaced with a new film.

In the case of FIG. 2, the porous film 1°r is in the form of a tape and is wound around the winding shaft 18 in the form of a roll.
13 and is wound onto a winding shaft 19.

In this case, the filament 17 is wound up at one suction angle of the half'+9 suspended wafer 2 or a plurality of suction f+j so that a new filament 17 comes to the suction j1 means A1-.

In addition, since the film 15r 17i comes in contact with the adhesive film 4 for attaching the wafer 2 to the marring frame 1, it must have been treated with non-adhesive treatment such as silicone coating, or it must have been treated with a tetrafluoroethylene film. is promising.

In addition, the holes in the film 15 and 17 (J1μIn in size to a few centimeters in size are acceptable, but it is preferable that they be independent).

(7) Effects In this invention, as described in section 2, a plastic film having a large number of holes is interposed between the suction means and the circuit-forming surface of the semiconductor wafer 1, so that the suction means does not come into direct contact with the circuit-forming surface of the semiconductor wafer. .

Therefore, by replacing this plastic film with a new film frr times or multiple times fO', the suction surface of the suction means is always kept clean, eliminating the risk of damage to the circuit surface caused by foreign matter and eliminating the possibility of damage to the circuit surface formed on the surface of the wafer. It can prevent damage to complex minute circuits.

[Brief explanation of drawings]

Fig. 1 and fA+J2 are longitudinal sectional front views showing each embodiment of the method of this invention, Fig. 3 is a longitudinal sectional front view showing an example of the conventional wafer adsorption method, and Fig. 4 is a state in which the ring frame and wafer are bonded together. Figures 5 and 6 are perspective views showing each side of the suction means. 1...Ring frame, 2...Semiconductor ueno＼, 3
...Circuit, 15.17...Porous plastic film, A...Adsorption means. Patent applicant: Nitto Electric Industry Co., Ltd. Agent: Kama 1) Bun 2

Claims (1)

[Claims] A plastic film having a large number of holes between the circuit-forming surface of the semiconductor wafer and the suction means when the circuit-forming surface is suction-protected by suction means in the manufacturing process after circuits are formed on the surface of the semiconductor wafer. 1. A method for protecting the surface of a semiconductor wafer, characterized in that a suction means does not directly touch the circuit-forming surface of the semiconductor wafer by interposing the above.