JPS60214598A - 精密電子部品におけるノイズを最少とする装置 - Google Patents

精密電子部品におけるノイズを最少とする装置

Info

Publication number
JPS60214598A
JPS60214598A JP59220347A JP22034784A JPS60214598A JP S60214598 A JPS60214598 A JP S60214598A JP 59220347 A JP59220347 A JP 59220347A JP 22034784 A JP22034784 A JP 22034784A JP S60214598 A JPS60214598 A JP S60214598A
Authority
JP
Japan
Prior art keywords
package
heat sink
electronic component
substrate
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59220347A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222559B2 (enExample
Inventor
ロドニー　トーマス　バート
ロバート　マーク　ステイツト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Tucson Corp
Original Assignee
Burr Brown Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Corp filed Critical Burr Brown Corp
Publication of JPS60214598A publication Critical patent/JPS60214598A/ja
Publication of JPH0222559B2 publication Critical patent/JPH0222559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP59220347A 1984-04-05 1984-10-19 精密電子部品におけるノイズを最少とする装置 Granted JPS60214598A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59702784A 1984-04-05 1984-04-05
US597027 1984-04-05

Publications (2)

Publication Number Publication Date
JPS60214598A true JPS60214598A (ja) 1985-10-26
JPH0222559B2 JPH0222559B2 (enExample) 1990-05-18

Family

ID=24389768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59220347A Granted JPS60214598A (ja) 1984-04-05 1984-10-19 精密電子部品におけるノイズを最少とする装置

Country Status (4)

Country Link
JP (1) JPS60214598A (enExample)
DE (1) DE3512453A1 (enExample)
FR (1) FR2562750B1 (enExample)
GB (1) GB2157077B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140264047A1 (en) * 2012-06-01 2014-09-18 Landauer, Inc. Geometry Layout for System for Wireless, Motion and Position-Sensing, Integrating Radiation Sensor for Occupational and Environmental Dosimetry
WO2013179273A1 (en) 2012-06-01 2013-12-05 Landauer, Inc. Wireless, motion and position-sensing, integrating radiation sensor for occupational and environmental dosimetry
CN103500947B (zh) * 2013-07-10 2016-01-06 浙江首航实业有限公司 多功能智慧光电箱

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB877481A (en) * 1956-11-13 1961-09-13 Ass Elect Ind Improvements relating to electronic equipment
NL260951A (enExample) * 1960-03-07
US3185756A (en) * 1960-05-02 1965-05-25 Cool Fin Electronics Corp Heat-dissipating tube shield
US3313339A (en) * 1965-03-15 1967-04-11 Wakefield Engineering Company Heat transfer apparatus
DE2601035A1 (de) * 1976-01-13 1977-07-21 Bosch Gmbh Robert Elektrische schaltungsanordnung
DE7818810U1 (de) * 1978-06-23 1978-10-05 Schroff & Co Gesellschaft Fuer Messtechnik Mbh, 7541 Straubenhardt Kuehleinrichtung fuer halbleiter
DE3025964A1 (de) * 1980-07-09 1982-02-04 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur elektrischen isolation von halbleiterbauelementen
US4454481A (en) * 1982-03-04 1984-06-12 Rockwell International Corporation Shielded amplifier
JPS5825249A (ja) * 1982-07-28 1983-02-15 Hitachi Ltd ヒ−トシンク

Also Published As

Publication number Publication date
GB8423790D0 (en) 1984-10-24
DE3512453C2 (enExample) 1993-04-29
GB2157077A (en) 1985-10-16
GB2157077B (en) 1987-10-21
DE3512453A1 (de) 1985-11-28
FR2562750B1 (fr) 1987-02-27
JPH0222559B2 (enExample) 1990-05-18
FR2562750A1 (fr) 1985-10-11

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