JPH0222559B2 - - Google Patents

Info

Publication number
JPH0222559B2
JPH0222559B2 JP59220347A JP22034784A JPH0222559B2 JP H0222559 B2 JPH0222559 B2 JP H0222559B2 JP 59220347 A JP59220347 A JP 59220347A JP 22034784 A JP22034784 A JP 22034784A JP H0222559 B2 JPH0222559 B2 JP H0222559B2
Authority
JP
Japan
Prior art keywords
package
heat sink
source
substrate
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59220347A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60214598A (ja
Inventor
Toomasu Baato Rodonii
Maaku Suteitsuto Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Tucson Corp
Original Assignee
Burr Brown Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Corp filed Critical Burr Brown Corp
Publication of JPS60214598A publication Critical patent/JPS60214598A/ja
Publication of JPH0222559B2 publication Critical patent/JPH0222559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP59220347A 1984-04-05 1984-10-19 精密電子部品におけるノイズを最少とする装置 Granted JPS60214598A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59702784A 1984-04-05 1984-04-05
US597027 1984-04-05

Publications (2)

Publication Number Publication Date
JPS60214598A JPS60214598A (ja) 1985-10-26
JPH0222559B2 true JPH0222559B2 (enExample) 1990-05-18

Family

ID=24389768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59220347A Granted JPS60214598A (ja) 1984-04-05 1984-10-19 精密電子部品におけるノイズを最少とする装置

Country Status (4)

Country Link
JP (1) JPS60214598A (enExample)
DE (1) DE3512453A1 (enExample)
FR (1) FR2562750B1 (enExample)
GB (1) GB2157077B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140264047A1 (en) * 2012-06-01 2014-09-18 Landauer, Inc. Geometry Layout for System for Wireless, Motion and Position-Sensing, Integrating Radiation Sensor for Occupational and Environmental Dosimetry
GB2516797B8 (en) 2012-06-01 2015-12-30 Landauer Inc Wireless, motion and position-sensing, integrating radiation sensor for occupational and environmental dosimetry
CN103500947B (zh) * 2013-07-10 2016-01-06 浙江首航实业有限公司 多功能智慧光电箱

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB877481A (en) * 1956-11-13 1961-09-13 Ass Elect Ind Improvements relating to electronic equipment
NL260951A (enExample) * 1960-03-07
US3185756A (en) * 1960-05-02 1965-05-25 Cool Fin Electronics Corp Heat-dissipating tube shield
US3313339A (en) * 1965-03-15 1967-04-11 Wakefield Engineering Company Heat transfer apparatus
DE2601035A1 (de) * 1976-01-13 1977-07-21 Bosch Gmbh Robert Elektrische schaltungsanordnung
DE7818810U1 (de) * 1978-06-23 1978-10-05 Schroff & Co Gesellschaft Fuer Messtechnik Mbh, 7541 Straubenhardt Kuehleinrichtung fuer halbleiter
DE3025964A1 (de) * 1980-07-09 1982-02-04 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur elektrischen isolation von halbleiterbauelementen
US4454481A (en) * 1982-03-04 1984-06-12 Rockwell International Corporation Shielded amplifier
JPS5825249A (ja) * 1982-07-28 1983-02-15 Hitachi Ltd ヒ−トシンク

Also Published As

Publication number Publication date
GB2157077B (en) 1987-10-21
DE3512453A1 (de) 1985-11-28
JPS60214598A (ja) 1985-10-26
DE3512453C2 (enExample) 1993-04-29
GB8423790D0 (en) 1984-10-24
GB2157077A (en) 1985-10-16
FR2562750A1 (fr) 1985-10-11
FR2562750B1 (fr) 1987-02-27

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