JPS60214596A - 電気回路板の製造法 - Google Patents
電気回路板の製造法Info
- Publication number
- JPS60214596A JPS60214596A JP7013084A JP7013084A JPS60214596A JP S60214596 A JPS60214596 A JP S60214596A JP 7013084 A JP7013084 A JP 7013084A JP 7013084 A JP7013084 A JP 7013084A JP S60214596 A JPS60214596 A JP S60214596A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electric circuit
- resin
- copper powder
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000007747 plating Methods 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000002265 prevention Effects 0.000 claims description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- -1 ]-tanol Chemical compound 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7013084A JPS60214596A (ja) | 1984-04-10 | 1984-04-10 | 電気回路板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7013084A JPS60214596A (ja) | 1984-04-10 | 1984-04-10 | 電気回路板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60214596A true JPS60214596A (ja) | 1985-10-26 |
| JPH0410754B2 JPH0410754B2 (enrdf_load_stackoverflow) | 1992-02-26 |
Family
ID=13422668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7013084A Granted JPS60214596A (ja) | 1984-04-10 | 1984-04-10 | 電気回路板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60214596A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123193A (ja) * | 1984-11-20 | 1986-06-11 | アルプス電気株式会社 | 印刷配線板 |
| JPH03141683A (ja) * | 1989-10-27 | 1991-06-17 | Furukawa Electric Co Ltd:The | プリント配線板 |
| US10264673B2 (en) | 2016-07-20 | 2019-04-16 | Fujitsu Limited | Board and electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5824032A (ja) * | 1981-08-03 | 1983-02-12 | Shirakawa Denki Doboku Kk | 充填モルタル漏出防止工法 |
| JPS5897892A (ja) * | 1981-12-07 | 1983-06-10 | 三井東圧化学株式会社 | 導電回路の形成方法 |
-
1984
- 1984-04-10 JP JP7013084A patent/JPS60214596A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5824032A (ja) * | 1981-08-03 | 1983-02-12 | Shirakawa Denki Doboku Kk | 充填モルタル漏出防止工法 |
| JPS5897892A (ja) * | 1981-12-07 | 1983-06-10 | 三井東圧化学株式会社 | 導電回路の形成方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61123193A (ja) * | 1984-11-20 | 1986-06-11 | アルプス電気株式会社 | 印刷配線板 |
| JPH03141683A (ja) * | 1989-10-27 | 1991-06-17 | Furukawa Electric Co Ltd:The | プリント配線板 |
| US10264673B2 (en) | 2016-07-20 | 2019-04-16 | Fujitsu Limited | Board and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410754B2 (enrdf_load_stackoverflow) | 1992-02-26 |
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