JPS6021383A - 化学銅めつき方法 - Google Patents

化学銅めつき方法

Info

Publication number
JPS6021383A
JPS6021383A JP12542283A JP12542283A JPS6021383A JP S6021383 A JPS6021383 A JP S6021383A JP 12542283 A JP12542283 A JP 12542283A JP 12542283 A JP12542283 A JP 12542283A JP S6021383 A JPS6021383 A JP S6021383A
Authority
JP
Japan
Prior art keywords
plating
nitrogen
formaldehyde
chemical copper
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12542283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222151B2 (ko
Inventor
Akemi Kinoshita
木下　朱美
Ken Araki
荒木　建
Hidemi Nawafune
秀美 縄舟
Shozo Mizumoto
水本　省三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP12542283A priority Critical patent/JPS6021383A/ja
Publication of JPS6021383A publication Critical patent/JPS6021383A/ja
Publication of JPH0222151B2 publication Critical patent/JPH0222151B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP12542283A 1983-07-12 1983-07-12 化学銅めつき方法 Granted JPS6021383A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12542283A JPS6021383A (ja) 1983-07-12 1983-07-12 化学銅めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12542283A JPS6021383A (ja) 1983-07-12 1983-07-12 化学銅めつき方法

Publications (2)

Publication Number Publication Date
JPS6021383A true JPS6021383A (ja) 1985-02-02
JPH0222151B2 JPH0222151B2 (ko) 1990-05-17

Family

ID=14909705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12542283A Granted JPS6021383A (ja) 1983-07-12 1983-07-12 化学銅めつき方法

Country Status (1)

Country Link
JP (1) JPS6021383A (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579866A (en) * 1980-06-20 1982-01-19 Hitachi Ltd Electroless copper plating solution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579866A (en) * 1980-06-20 1982-01-19 Hitachi Ltd Electroless copper plating solution

Also Published As

Publication number Publication date
JPH0222151B2 (ko) 1990-05-17

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