JPS60209883A - Ic card - Google Patents

Abstract

PURPOSE:To improve the electric insulating property to eliminate displacement of a conductor pattern or the like at a press time by forming a window part for embossing work in a circuit board and using a plastic synthetic resin as a materials of an insulating substrate for the circuit board. CONSTITUTION:A front-side card substrate 2 and a rear-side card substrate 3 are arranged with a flexible substrate 1 in the center between them and are melt-fixed by heating and pressuring to constitute an IC card. The flexible substrate 1 in the center part consists of a non-thermoplastic resin such as polyimide, and a rectangular window part W for embossing work is provided along the longer side. A conductor pattern 1a is formed in a part other than the window part W on one face of the flexible substrate 1 by the etching method, a printing method, or the like. The front-side card substrate 2 and the rear-side card substrate 3 consist of a thermoplastic synthetic resin having the electric insulating property such as a vinyl chloride resin or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention 1] The present invention includes an IC chip for storing and processing information mounted inside a 7J-board base material made of an electrically insulating synthetic resin,
This invention relates to an IC card having input/output terminals exposed on the front surface.

[Technical background of the invention and its problems] Conventionally, for example, money deposits and withdrawals in financial institutions, Bt.
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A striped magnetic code is applied to the surface of a card base made of synthetic resin such as 1 resin, and various data such as account number and recitation number 8 are magnetically recorded on this magnetic stripe.

So-called magnetic cards are widely used.

This magnetic card has a simple structure, high durability, and is suitable for mass production, so it is widely used in the service industry and the like.

However, since such magnetic cards have a small information storage capacity, they can only record a very small amount of information, such as account numbers and PIN numbers. In order to record different types of information, it is necessary to set up a separate ledger like a bankbook in a financial institution, which has been an obstacle to increasing the efficiency of information processing.

Furthermore, since information on this magnetic card can be read relatively easily from the outside, there are problems in maintaining airtightness and preventing theft.

Under these circumstances, in recent years, data cards called IC cards have been developed, which have a storage element and its control element built into the card to dramatically increase its information storage capacity.

This IC card has an IC chip that stores and processes information mounted inside an electrically insulating synthetic resin card board, and has input/output terminals exposed from the card surface. By inserting the card into the card processing section of a card reader/writer installed in It is possible to write or read data.

By the way, the above-mentioned IC cards, like magnetic cards, are often carried around at all times and require considerable durability, so thermoplastic resin such as vinyl chloride resin is used as the card material. The personal name, registered lightning name, etc. are embossed on the base of this card.

However, in general, thermoplastic resins such as vinyl chloride resins do not have very good electrical insulation properties, and there is a risk that the conductor patterns, IC chips, input/output terminals, etc. may be displaced due to softening during pressing.

[Object of the Invention] The present invention has been made to address the above-mentioned circumstances.
The purpose is to provide C cards.

[Summary of the Invention] That is, the IC card of the present invention has a conductor pattern formed on the surface of an insulating substrate made of a non-thermoplastic resin, a plurality of input/output terminals protruding from the conductor pattern, and an IC chip mounted thereon. An IC card comprising a protective coating made of thermoplastic resin with the input/output terminals exposed on both sides of a circuit board, characterized in that a window portion for embossing is formed on the circuit board. It is said that [Embodiment of the Invention] FIG. 1 is an exploded perspective view showing the structure of an IC card according to an embodiment of the invention.

In the IC card of the present invention, a front card board 2 and a back card board 3 are arranged on the surface of a central flexible board 1, and are fused together by heat and pressure (rI''
J has been completed.

The flexible substrate 1 in the center is made of a non-thermoplastic resin with good electrical insulation, heat resistance, and mechanical properties, such as polyimide resin, and has a rectangular embossing window W along its long sides. It is perforated.

On one side of the flexible substrate 1, a conductive pattern 1a is formed using an etching method or a printing method, avoiding the window portion W, and an IC chip 4.5 is formed on the side where the conductive pattern 1a is formed. is mounted, and a predetermined electrical connection is made between it and the conductor pattern 1a.

On the conductor pattern 1a of this flexible substrate 1,
Furthermore, rectangular input/output terminals 6 are provided that protrude perpendicularly to the plate surface. The thickness of the input/output terminal 6 is approximately the same as the thickness of the front card board 2.

Both the front card board 2 and the back card board 3 are made of electrically insulating thermoplastic synthetic resin such as vinyl chloride resin.
A through hole 2a having the same shape as the input/output terminals 6 and into which these input/output terminals 6 can be fitted is provided in the front card board 2 at a position corresponding to the input/output terminals 6 of the flexible board 1.

The IC card of the present invention is manufactured as follows.

That is, first, the front card board 2 is placed on the conductor pattern 1a side of the flexible board 1 with the window portion W punched out so that the input/output terminals 6 fit into the through holes 5a, and the back card board 2 is placed on the opposite side. 3 are brought into contact with each other and heated and pressurized by press working.

In this way, as shown in FIG. 2, the input/output terminal 6
With the top of the card substrate 2 exposed from the surface of the front card substrate 2, the entire portion including the window portion W is fused together to obtain an IC card with a smooth surface. Thereafter, peripheral irregularities are removed by punching if necessary.

Therefore, when embossing a card, if the embossing is performed at the position of this window W, the embossing can be easily and clearly performed without affecting the flexible substrate.

[Effects of the Invention] As explained above, the IC card of the present invention has a window for embossing formed on a circuit board, and a non-thermoplastic synthetic resin with good electrical properties is used as an insulating substrate for the circuit board. Since it is used, the electrical insulation is good, and the conductor patterns, input/output terminals, IC chips, etc. will not be displaced, and embossing can be easily performed on the window portion.

[Brief explanation of drawings]

Fig. 1 is an exploded perspective view of an embodiment of the IC card of the present invention, and Fig. 2 is a 4f along the line 1-■ after press working.
FIG. 1 is a sectional view. 1...Flexible circuit board 1a
......Conductor pattern 2...Front side card board 3...
・・・・・・・・・Back side card board 4.5・・・・・・I
C chip 6... Input/output terminal W...
・・・・・・Madado Department Patent Attorney Satoshi Suyama −

Claims (1)

[Claims] (1) A conductive pattern is formed on the surface of an insulating substrate made of non-thermoplastic resin, and a plurality of input/output terminals are provided protrudingly on this conductive pattern. 1. An IC card in which a protective coating made of thermoplastic resin is formed on exposed terminals, characterized in that a window portion for enforcing processing is formed on the circuit board.