JPS60209886A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPS60209886A JPS60209886A JP59066353A JP6635384A JPS60209886A JP S60209886 A JPS60209886 A JP S60209886A JP 59066353 A JP59066353 A JP 59066353A JP 6635384 A JP6635384 A JP 6635384A JP S60209886 A JPS60209886 A JP S60209886A
- Authority
- JP
- Japan
- Prior art keywords
- input
- output terminals
- card
- substrate
- card substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は電気絶縁性の合成樹脂製のカード基材の内部に
情報の記憶および処理を行なうICチップを実装し、表
面に入出力端子を露出さけ−CなるICカードに関する
。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention mounts an IC chip for storing and processing information inside a card base material made of electrically insulating synthetic resin, and exposes input/output terminals on the surface. This relates to an IC card called Sake-C.
[発明の技術的背景とその問題点]
従来から、例えば金融機関における金銭出入れ時の証明
用のデータカード等として、塩化ビニル樹脂等の合成樹
脂製のカード基材の表面にストライプ状に磁気コートを
施し、この磁気ストライプに口座番号や暗唱番号等の各
種データを磁気記録した、いわゆる磁気カードが広く用
いられている。[Technical background of the invention and its problems] Conventionally, magnetic stripes have been applied to the surface of a card base material made of synthetic resin such as vinyl chloride resin as data cards for proof of money withdrawals and withdrawals at financial institutions. So-called magnetic cards, which are coated with magnetic stripes and have various data such as account numbers and password numbers magnetically recorded, are widely used.
この磁気カードはWi造が単純で耐久性が高く、しかも
大量生産に向い°(いることからサービス産業分野等に
おいて広く用いられている。This magnetic card has a simple structure, is highly durable, and is suitable for mass production, so it is widely used in the service industry.
しかしながらこのような磁気カードは、情報の記憶容ω
が小さいために、口座番号、暗唱番号等、ごく少数の情
報しか記録することができず、したかって例えば預金の
預は入れ、引出しの記録等の多種類の情報の記録は金融
機関における預金通帳の如く別に記録台帳を設ける必要
があり、情報処理の高能率化に対する障害となっていた
。However, such magnetic cards have a limited information storage capacity ω
Because it is small, only a small amount of information, such as account numbers and password numbers, can be recorded. Therefore, many types of information, such as deposits and withdrawals, can only be recorded in a bankbook at a financial institution. It was necessary to set up a separate record ledger, which was an obstacle to increasing the efficiency of information processing.
さらに、この磁気カードは、外部から情報を比較的簡単
に読取れるため、気密保持や盗用防止等の点で問題があ
った。Furthermore, since information on this magnetic card can be read relatively easily from the outside, there are problems in maintaining airtightness and preventing theft.
このJ、うな事情から、近年カード内部に記憶素子おに
びその制御系子を内蔵させて情報の記憶容量を飛躍的に
向上させた、ICカードと呼ばれるデータカードが開発
されつつある。In view of these circumstances, in recent years data cards called IC cards have been developed, which have a storage element and its control system built into the card to dramatically improve its information storage capacity.
このICカードは、電気絶縁性の合成樹脂製のh−ド基
板の内部に情報の記憶および処理を行なうICチップを
実装し、入出力端子をカード表面から露出させたもので
、金融機関等に設置されたカードリーダー/ライターの
カード処理部にヒツトすることにより、カード処理部内
の入出力端子とICカードの入山ツノ端子とを電気的に
接続して、内蔵するICチップへの情報の書込みまたは
読出しを可能としたものである。This IC card has an IC chip for storing and processing information mounted inside an electrically insulating synthetic resin HD board, and has input/output terminals exposed from the card surface. By hitting the card processing section of the installed card reader/writer, the input/output terminal in the card processing section and the input terminal of the IC card are electrically connected, and information can be written to the built-in IC chip or This makes reading possible.
ところで、上述したようなICカードは、磁気カードと
同様に常時携帯される場合が多く、外力および環境変化
に対して相当の耐久力が要求される。特に入出力端子は
、ICカードをカードリーダー/ライターの入出力端子
と正確に接触させる必要があるために、カードの所定の
位置にカード表面と同一平面上に配置され、しかもその
絶縁性合成樹脂との境界部が完全に密着している必要が
あり、製造が非常に難しいという問題があった。Incidentally, the above-mentioned IC cards are often carried around all the time, like magnetic cards, and are required to have considerable durability against external forces and environmental changes. In particular, the input/output terminals are placed on the same plane as the card surface at a predetermined position on the card, and the insulating synthetic resin There was a problem in that the boundary between the two parts had to be in perfect contact with each other, making manufacturing extremely difficult.
[発明の目的]
本発明はこのような事情に対処してなされたもので、露
出した入出力端子が、カードの所定の位置にその表面と
同一面となるように配設され、しかも電気絶縁性の合成
樹脂との境界部が完全に密着されたICカードを提供す
ることを目的としている。[Object of the Invention] The present invention has been made in response to the above-mentioned circumstances, and the exposed input/output terminals are disposed at predetermined positions on the card so as to be flush with the surface thereof, and are electrically insulated. The purpose of the present invention is to provide an IC card in which the boundary part with a synthetic resin is completely adhered.
[発明の概要]
りなわら本発明のICカードは、表面に導体パターンを
形成しこの導体パターン上に複数個の入出力端子を突設
するとともにICチップを実装させてなる回路基板上に
、この回路基板の入出力端子に対応させてこれらを嵌合
可能な貫通孔を形成してなる前記入出力端子とほぼ等厚
の熱可塑性合成樹脂性のカバーシートを、前記入出力端
子が前記貫通孔に嵌合するようにして被覆し、これらを
加熱加圧により一体に融着させて成ることを特徴として
いる。[Summary of the Invention] The IC card of the present invention has a conductor pattern formed on its surface, a plurality of input/output terminals protruding from the conductor pattern, and an IC chip mounted on a circuit board. A cover sheet made of thermoplastic synthetic resin having approximately the same thickness as the input/output terminals is formed with through holes corresponding to the input/output terminals of the circuit board into which these can be fitted. It is characterized in that it is coated so as to fit into it and is fused together by heating and pressurizing.
[発明の実施例]
第1図は、本発明の一実施例のICカードの構成を示す
分解斜視図である。[Embodiment of the Invention] FIG. 1 is an exploded perspective view showing the structure of an IC card according to an embodiment of the invention.
本発明のICカードは、中火部のフレキシブル基板1を
挟んでぞの表面に、表側カード基板2、裏側カード基板
3を配置し、加熱加圧により一体に融着させて構成され
ている。The IC card of the present invention is constructed by arranging a front card board 2 and a back card board 3 on both sides of a medium-heated flexible board 1, and fusing them together by heating and pressing.
中央部のフレキシブル基板1は、片面にエッヂレグ法あ
るいは印刷法等を用いて導体パターン1aが形成された
周知の、例えばポリイミド樹脂からなるフレキシブルプ
リント基板であり、導体パターン1aが形成されている
側にICチップ4.5が搭載され、導体パターン1aと
の間に所定の電気的接続がIJ径されている。The flexible substrate 1 in the center is a well-known flexible printed circuit board made of, for example, polyimide resin, on one side of which a conductor pattern 1a is formed using an edge leg method or a printing method. An IC chip 4.5 is mounted, and a predetermined electrical connection with the conductive pattern 1a is made with an IJ diameter.
このフレキシブル基板1の、導体パターン1a上には、
さらに板面に直角方向に突出する矩形の入出力端子6が
配設されている。この入出力端子6の厚さは、表側カー
ド重板2の厚さどほぼ同一の厚さとなっている。On the conductor pattern 1a of this flexible substrate 1,
Furthermore, rectangular input/output terminals 6 are provided that protrude perpendicularly to the plate surface. The thickness of the input/output terminal 6 is approximately the same as the thickness of the front card stack 2.
表側ノj−ド基板2および裏側カード基板3は共に塩化
ビニル樹脂等の電気絶縁性の熱可塑性合成樹脂からなり
、表側カード基板2の、フレキシブル基板1の入出力端
子6に対応する位置には、これらの入出力端子6と同形
状でこれらを嵌合可能な貫通孔2aが穿設されている。Both the front side node board 2 and the back side card board 3 are made of electrically insulating thermoplastic synthetic resin such as vinyl chloride resin, and the positions of the front side card board 2 corresponding to the input/output terminals 6 of the flexible board 1 are , a through hole 2a having the same shape as these input/output terminals 6 and into which these can be fitted is bored.
本発明のICカードは、次のようにして製造される。The IC card of the present invention is manufactured as follows.
すなわら、まずフレキシブル基板1の導体パターン1a
側に、貫通孔2aに入出力端子6が嵌合り゛るようにし
て表側カード基板2を載せ、かつその反対面に裏側カー
ド基板3を当接させて、これらをプレス加工により加熱
加圧する。That is, first, the conductor pattern 1a of the flexible substrate 1
The front card board 2 is placed on the side so that the input/output terminals 6 fit into the through holes 2a, and the back card board 3 is brought into contact with the opposite side, and these are heated and pressed by press working. .
このようにすると、第2図に示すように、入出力端子6
の頂部が表側カード基板2の表面から露出した状態で全
体が一体に融着し、表面が平滑なICカードが得られる
。この後必要に応じて周辺の不整部分が打抜きにより除
去される。In this way, as shown in FIG. 2, the input/output terminal 6
The whole is fused together with the top part exposed from the surface of the front card substrate 2, and an IC card with a smooth surface is obtained. Thereafter, peripheral irregularities are removed by punching if necessary.
このように構成されたICカードでは、プレス時に入出
力端子6の表面がプレス面で覆われた状態でプレス加工
が行なわれるので、この面に表側カード基板2の素材が
流れ込むようなことがなく、またカード前面が均一に押
圧されて合成樹脂の流れが均一に行なわれ、表面平滑で
、かつ入出力端子6と表側基板2との境界が密着したI
Cカードが得られる。In the IC card configured in this manner, the surface of the input/output terminal 6 is covered with the press surface during pressing, so the material of the front card substrate 2 does not flow into this surface. In addition, the front surface of the card is pressed uniformly, the synthetic resin flows uniformly, the surface is smooth, and the interface between the input/output terminal 6 and the front substrate 2 is in close contact with each other.
You will get a C card.
なお以上の実施例では、入出力端子を四角形とした例に
ついて説明したが、本発明はかかる実施例に限定される
ものではなく、他の形状、例えば円形としてもよい。In the above embodiments, the input/output terminals are rectangular, but the present invention is not limited to such embodiments, and may have other shapes, such as circles.
さらに、入出力端子6の露出する面に金等の耐蝕性の良
好な金属による被覆を施すようにすれば、入出力端子表
面の酸化を防ぐことができ、処1!l!装置の人出ノj
端子との電気接続の信頼性が一層向上する。Furthermore, if the exposed surface of the input/output terminal 6 is coated with a metal with good corrosion resistance such as gold, oxidation of the input/output terminal surface can be prevented. l! Equipment turnout
The reliability of the electrical connection with the terminal is further improved.
[発明の効果]
以上説明しノこように本発明のICカードは、回路基板
の複数の入出力端子に対応させてこれらを1■合可能な
貫通孔を形成してなる前記入出力端子とほぼ等厚の熱可
塑性合成樹脂性のカバーシートを、前記入出力端子が前
記貫通孔に嵌合するようにして被覆し、これらを加熱加
圧により一体に融6ざぜて構成したから、入出力端子の
露出面がカード表面と完全に同一面となってカードリー
ダー/ライターとの入出力端子との整合性が向上し、か
つ入出力端子とカバーシートとの境界部が完全に密着す
るのでICチップの保護効果が向上し外観上も良好なも
のとなる。[Effects of the Invention] As explained above, the IC card of the present invention has input/output terminals formed by forming through-holes that can correspond to a plurality of input/output terminals of a circuit board and connect these terminals into one. A thermoplastic synthetic resin cover sheet of approximately equal thickness was covered so that the input/output terminals fit into the through holes, and these were fused together by heat and pressure. The exposed surface of the terminal is completely flush with the card surface, improving the alignment of the input/output terminal with the card reader/writer, and the border between the input/output terminal and the cover sheet is in perfect contact with the IC. The protection effect of the chip is improved and the appearance is also good.
第1図は本発明のICカードの一実施例を示ザ分解斜視
面図、第2図はその横断面図である。
1・・・・・・・・・・・・フレキシブル回路基板1a
・・・・・・・・・導体パターン
2・・・・・・・・・・・・表側カード基板3・・・・
・・・・・・・・裏側カード基板4.5・・・・・・I
Cチップ
6・・・・・・・・・・・・入出力端子代理人弁理士
須 山 佐 −FIG. 1 is an exploded perspective view of an embodiment of the IC card of the present invention, and FIG. 2 is a cross-sectional view thereof. 1...Flexible circuit board 1a
......Conductor pattern 2...Front side card board 3...
・・・・・・・・・Back side card board 4.5・・・・・・I
C chip 6・・・・・・・・・Input/output terminal agent patent attorney
Suyama Sa −
Claims (2)
に複数個の入出力端子を突設するとともにICチップを
実装させてなる回路基板上に、この回路基板の入出力端
子に対応させてこれらを嵌合可能な18通孔を形成して
なる前記入出力端子とほぼ等厚の熱可塑性合成樹脂性の
カバーシートを、前記入出力端子が前記貫通孔に嵌合す
るようにして被覆し、これらを加熱加圧により一体に融
着させて成ることを特徴とするICカード。(1) A conductor pattern is formed on the surface, a plurality of input/output terminals are protruded from the conductor pattern, and on a circuit board on which an IC chip is mounted, these terminals are arranged in correspondence with the input/output terminals of the circuit board. Covering the input/output terminal with a thermoplastic synthetic resin cover sheet having approximately the same thickness as the input/output terminal and forming 18 through holes into which the input/output terminal can be fitted, An IC card characterized in that these are fused together by heat and pressure.
請求の範囲第1項記載のICカード。(2) The IC card according to claim 1, wherein the circuit board is a flexible circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59066353A JPS60209886A (en) | 1984-04-02 | 1984-04-02 | Ic card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59066353A JPS60209886A (en) | 1984-04-02 | 1984-04-02 | Ic card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60209886A true JPS60209886A (en) | 1985-10-22 |
Family
ID=13313403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59066353A Pending JPS60209886A (en) | 1984-04-02 | 1984-04-02 | Ic card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60209886A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0193856A2 (en) * | 1985-03-04 | 1986-09-10 | Casio Computer Company Limited | IC card |
JPS62212196A (en) * | 1986-03-14 | 1987-09-18 | カシオ計算機株式会社 | Integrated circuit card |
US4909742A (en) * | 1986-01-20 | 1990-03-20 | Itt Corporation | IC card and mating socket |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
-
1984
- 1984-04-02 JP JP59066353A patent/JPS60209886A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0193856A2 (en) * | 1985-03-04 | 1986-09-10 | Casio Computer Company Limited | IC card |
US4909742A (en) * | 1986-01-20 | 1990-03-20 | Itt Corporation | IC card and mating socket |
JPS62212196A (en) * | 1986-03-14 | 1987-09-18 | カシオ計算機株式会社 | Integrated circuit card |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4719140A (en) | Electronic memory card | |
JPS5856447A (en) | Identification card and method of producing same | |
JPS6211696A (en) | Integrated circuit card | |
JPS6313840B2 (en) | ||
JPH0678038B2 (en) | Method for manufacturing microminiature electronic circuit card | |
JPS6347265B2 (en) | ||
JPS60209886A (en) | Ic card | |
JPS5892597A (en) | Manufacture of identification card | |
JPS60209883A (en) | Ic card | |
JPH0241073B2 (en) | ||
JPH0521759B2 (en) | ||
JPS60209884A (en) | Ic card | |
JPS6153096A (en) | Identification card | |
JPS61154938A (en) | Integrated circuit card and manufacture thereof | |
JPS6188382A (en) | Manufacture of card | |
JPH0324383Y2 (en) | ||
JPH0416836B2 (en) | ||
JPH0416837B2 (en) | ||
JPS60142489A (en) | Ic card | |
JPS60209889A (en) | Ic card | |
JPS6134687A (en) | Ic card | |
JPS60141256U (en) | thermal printing equipment | |
JPS60209888A (en) | Manufacture of ic card | |
JPH07164787A (en) | Manufacture of ic card | |
JP2002133385A (en) | Noncontact/contact ic module and ic card |