JPS60207349A - Selection and extraction device for pellet - Google Patents

Abstract

PURPOSE:To enable to perform the selection and extraction work of pellet rapidly and securely by a method wherein the confirmatory work of the position of a pellet, which is made an object of extraction, is automized by the identification of its coordinate position on the table. CONSTITUTION:An angle, which is formed by the dicing line 39 of a wafer 35 detected by a detecting camera 77 to the X-Y direction, is compared with the reference alignment angle for enabling a collet 23 to select and extract a necessary pellet 22, and after the comparison was made, a correction value (thetaK1) for the angle needed for enabling the angle, which is formed by the dicing llne 39 of the wafer 35, to conform to the reference alignment angle, is contrived so as to be worked out in the calculating part 81 of the detecting camera 77. Moreover, a supporting ring 30 is made to rotatingly driven on the basis of the correction value (thetaK1) for the above-mentioned angle. When a table 21 is made to shift while being controlled to the necessary coordinate position in such a way, the necessary pellet 22 is made to position at the adsorption site of the collect 23 and can be classified and extracted.

Description

[Detailed description of the invention] "Technical field] The present invention relates to a pellet sorting and extraction device.

[Background Art 1] A pellet sorting and extraction device is capable of handling a wafer on which a group of elements such as semiconductor elements are two-dimensionally arranged and formed on its surface.
It is a device that cuts and separates each pellet as an element piece, sorts and adsorbs each divided pellet with a collet, and then mounts the sorted pellets on a board such as a lead frame or header. There is. That is, this device uses a collet to sort and extract pellets that are divided and arranged on the top of an xY table that moves in the plane XY direction.Then, the pellets are placed at a mounting position on a substrate that is transported onto a transport line. move it,
It is to be mounted at that position. At this time, a defective mark is displayed in advance on a defective pellet in the divided and aligned pellet group. This defective mark is displayed before the wafer is supported on the top of the XY table, and before the wafer is cut and separated from each other. The probe of the semiconductor inspection equipment is brought into contact with each element group, and a current is passed through the probe to test whether each element is good or bad.Based on these results, those determined to be defective are tested. I am trying to display a defective mark.

The devices arranged and formed on the surface of the wafer are determined to be good or bad.The wafer is then scribed with a diamond point or the like to break and separate each device into pellets. I'm trying to line it up at the top of the table. The aligned pellets are extracted by the collet by moving the XY table by pitch in the XY direction so that the pellets to be extracted are sequentially positioned directly below the collet. Select only the pellets that have been
In order to extract pellets, a sensor is provided above the XY table to detect defective marks on the pellets, and as a result of detecting pellets with the sensor, only pellets without defective marks are extracted.

In other words, in such a pellet sorting and extraction device, each time a sensor is used to confirm whether or not the pellet should be sorted and extracted, the XY table is moved in pitch and the collet is used to sort and extract the pellet, which reduces the overall operation of the device. The efficiency is low, and it has been desired to develop a pellet sorting and extraction device that solves this problem.

[Purpose of the invention] To automate the work of confirming the position of the pellet to be extracted from among the wafers on the table to be divided into pellets by recognizing the coordinate position on the table, and to select and extract only the necessary pellets. The purpose is to quickly and reliably carry out the process and improve the operating efficiency of the pellet sorting and extraction device.

[Structure of the Invention #t,] In order to achieve the above object, the present invention provides a support ring for supporting a wafer, which has a dicing line divided into each pellet and has a coordinate position set for each pellet, and a support ring. a table that rotatably supports the wafer; a support ring rotating means that adjusts the rotational position of the support ring to freely adjust the angle that the dicing line of the wafer makes with respect to the XY direction; a detection camera that detects the angle that the dicing line makes with respect to the XY direction; a reference alignment angle setting means that sets a reference alignment angle that serves as a reference for certifying the coordinate position of each pellet to be divided and aligned; means for outputting a drive signal to the support ring rotating means based on the alignment angle and the die size of the wafer detected by the detection camera, and identifying the coordinate position of a necessary pellet among the pellets aligned at the reference alignment angle; A pellet sorting and extraction device includes a collet that allows the pellets to be sorted and extracted.

[Detailed description of the invention] Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing the entire pellet pumping device equipped with a pellet sorting and extracting device according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view taken along line II-II in FIG. Figure 3 is a cross-sectional view showing the adhesive sheet before being stretched, Figure 4 is a cross-sectional view showing the adhesive sheet being stretched by the chuck/stretching means, and Figure 5 is a cross-sectional view showing the adhesive sheet stretched between the broken and separated pellets. FIG. 6 is a cross-sectional view showing the state before gaps are formed, FIG. 6 is a cross-sectional view showing the state with gaps formed between each pellet, and FIG. 7 is a plan view showing the state before correcting the angle of the dicing line of the wafer. , Figure 8 is a plan view showing the state in which the wafer's dicing line has been corrected based on the angle correction value (+ for θ), and Figures 9 and 10 are monitor views of a portion of the dicing line detected by the detection camera. Regarding this, Fig. 9 shows the state before the angle of the dicing line is corrected, Fig. 1θ shows the state after correction based on the angle correction value (+ for θ), and Fig. 11 shows the state of the dicing line detected on the wafer. A plan view showing the part detected by the camera, and Fig. 12 is a monitor diagram showing the state in which the detection camera detects a given dicing line and other parts on the same dicing line, and the state before angle correction is performed. FIG. 13 is a monitor diagram showing the state after the angle has been corrected based on the angle correction value (θKa), and FIG. 14 is a plan view showing the state in which the center of the wafer is detected.

This pellet pounding device transfers each pellet 22 divided and arranged on an XY table 21 to a collet 23.
After sorting, extracting, and transferring the pellets 22 extracted by the collet 23 onto the positioning table 25 of the positioning device 24, the pellets 23 are aligned on the positioning table 25, and the aligned pellets 22 are further driven in the X and Y directions. The substrate 27 is mounted at a mounting position 28 on a substrate 27 transported onto the transport line E by a mounting unit 26 that can be mounted.

The XY table 21 of the pellet pounding device is movable in the XY directions on a pedestal 29, and a support frame 32 having a support frame portion 31 that rotatably supports a support ring 30 is placed on the XY table 21. It is fixed by 33. The support ring 30 supported by the support frame part 31 includes a support part 34, and an adhesive sheet 36 on which a wafer 35 on which a group of elements such as semiconductor elements are arranged and formed is adhered. The outer periphery of the wafer 35 is supported.

The wafer 35 adhered to the adhesive sheet 36 has a circular shape, and each of the element groups arranged and formed on the surface thereof is inspected one by one using a semiconductor inspection device (not shown), and the temperature is The quality and operation characteristics of each element are determined to be good or bad, and the quality of the specific element is determined by ranks such as A, B, C, etc., and the results are transferred to the floppy disk by setting the coordinate position in the x and y force directions relative to the center of the wafer 35. The information is stored on a storage medium such as a desk or magnetic tape. The wafer 35 that has been inspected is placed on an adhesive sheet 36, and then
As shown in FIG. 5, each element is scribed using a diamond point 38, and dicing lines 39 are carved in the xy direction of the wafer 35 as shown in FIG. 11. The wafer 35 is broken and separated along this dicing line 39 to be divided into pellets 22 as a plurality of element group side element pieces. A collet 23 is provided on the top of the adhesive sheet 36 on which the wafer 35 is attached so as to be able to move up and down in the direction of arrow F, and the collet 23 sucks air through a vacuum pipe (not shown) to open the opening 41 at the tip.
The divided and aligned pellets 22 are sorted and extracted.

When each pellet 22 is sucked by the opening 41, the collet 23 moves downward, and at the same time, a needle 42 movable up and down in the direction of arrow G from the back surface of the adhesive sheet 36 is able to push up the pellet 22. The shape of the opening 41 is rectangular in accordance with the shape of each pellet 22, and the cross section is approximately trapezoidal.

A wafer ring 43 is attached to the outer periphery of the portion of the adhesive sheet 36 that is supported by the support ring 30 and the support portion 34 while holding the outer periphery. At the outer peripheral position of the support part 34 of the support ring 30, the outer peripheral parts of the wafer ring 43 and the adhesive sheet 36 are chucked, and the support surface 44 of the support part 34 of the support ring 30 is placed in a direction substantially perpendicular to the support surface 44 [H direction]. A chuck/stretching means 45 is provided which allows the adhesive sheet 36 to be stretched by relative movement.

The chuck/stretcher 45 supports the outer circumferential parts of the wafer ring 43 and the adhesive sheet 36 from below, and the inner ring 48 and the wafer ring 43 and the inner ring 48 move up and down while in contact with the outer circumferential side surface 47 of the support part 34 of the support ring 30. A clamper 4 that presses the outer peripheral part of the adhesive sheet 36 from above and can clamp it between it and the inner ring 48.
9, and an outer ring 51 that moves up and down while coming into contact with the outer peripheral side surface 50 of the inner ring 48.

The inner ring 48 has a port 5 with respect to the support ring 30.
2, the inner ring 48 and the support ring 3
A compression spring 54 is attached to the shaft 53 of the port 52 between the
is interposed. That is, the shaft 53 of the port 52 serves as a guide shaft for vertically moving the inner ring 48 with respect to the support ring 30. The outer ring 51 has an inner peripheral side surface 5
7 is a contact surface with the outer peripheral side surface 50 of the inner ring 48,
Four portions 59 are formed on the outer peripheral side surface 58 .

The concave portion 59 is designed such that a convex portion 63 formed at the tip of a clamp arm 62 that moves up and down by the driving force of a cylinder 61 attached to a cylinder bracket 60 supported and fixed to the support frame 32 can be inserted into the concave portion 59. There is. The clamp arm 62 is rotatably supported by a bearing part 64 supported by the support frame 32, and the clamp arm 62 is formed along the outer peripheral side surface 58 of the outer ring 51. The convex portions 63 formed at two locations on the tip of the outer ring 51 are located within the four portions 59 on the center line M of the outer ring 51. The clamp arm 62 has an engaging arm part 66 that can be engaged with the cylinder rod 65 of the cylinder 61 on the opposite side of the convex part 63 with the bearing part 64 as the center, and the engagement arm part 66 has a cylinder rod at the tip. A long hole 68 into which the engagement convex portion 67 formed at the tip of the hole 65 can be inserted.
is formed, and an engagement arm 66 engages the cylinder rod 65. The cylinder 61 enables the cylinder rod 65 to be driven in the vertical direction [J direction].
The engaging protrusion 67 formed at the tip of the vertical direction [J direction]
It is possible to move to. The cylinder bracket 60 includes
A stopper 69 is provided to prevent the cylinder rod 65 from moving upward more than necessary. The vertical movement of the cylinder rod 65 is transmitted to the clamp arm 62 side by the engagement between the engagement protrusion 67 and the elongated hole 68, and the protrusion 63 at the tip of the clamp arm 62 is made vertically movable in the direction of the arrow. There is.

That is, the clamp arm 62 makes a lever movement using the bearing part 64 as a fulcrum, so to speak, with the engagement convex part 67 of the cylinder rod 65 as the point of force and the convex part 63 of the clamp 7-162 as the point of action, the vertical movement of the cylinder rod 65 is second. As shown by two-dot chain lines P and Q7 in the figure, the convex portion 63 of the clamp arm 62 is moved up and down, and the outer ring 51 is moved up and down by the engagement of the convex portion 63 and the concave portion 59. .

As a result, as shown in FIG. 3, the wafer ring 43 and the outer periphery of the adhesive sheet 36 are positioned in the gap W between the inner ring 48 and the clamper 49, and then the cylinder 61 is driven and the cylinder rod 65 is moved upward. If so, the convex part 63 of the clamp arm 62 moves downward around the bearing part 64, and the outer ring 51 can move downward in a direction [H direction] substantially orthogonal to the support surface 47 of the support part 34 of the support ring 30. becomes. As a result, the outer circumferential portions of the wafer ring 43 and the adhesive sheet 36 are first clamped between the inner ring 48 and the clamper 49, making it possible to chuck them.Furthermore, by driving the cylinder 61 and moving the convex portion 63 downward, the outer ring 43 and the adhesive sheet 36 are clamped. 51 and the inner ring 48 move downward as shown in FIG. 4, and the chucked adhesive sheet 36 is stretched outward from the center in the direction of arrow R [FIG. Spaces are formed between the pellets 22, and each pellet 22 is placed on the adhesive sheet 36.
can be divided and arranged at equal intervals.

The support frame base 32 on the XY table 21 has a support frame base 32 on it.
By adjusting the rotational position of the support ring 30, the dicing line 39 of the wafer 35 attached to the adhesive sheet 36 can be rotated in the circumferential direction [S direction].
A support ring rotation means 71 is provided that allows the angle formed by the support ring with respect to the XY directions to be adjusted. The support ring rotation means 71 includes a motor bracket 7 fixed to the support frame 32.
A sector gear 74 provided on the outer periphery of the support ring 30 and a pinion 76 attached to a motor shaft 75 are engaged with each other, and the rotational force of the stellar pin motor 73 causes the support ring 3 to be supported by a stepping motor 73.
0 is rotatable with respect to the support frame 31, and the angle formed by the dicing line 3q of the wafer 35 with respect to the X and Y directions can be adjusted.

A detection camera 77 is arranged and fixed above the XY table 21 to detect a part of an arbitrary dicing line 39 on the wafer 35 and to detect the angle that the dicing line 39 makes with respect to the XY direction. ing. That is, this detection camera 77 captures the dicing line 39 of the wafer 35 from the -L direction, and for example, as shown in FIG. 7, the dicing line 39 of the wafer 35 is
If the angle is 5 degrees, a part of point T on the arbitrary dicing line 39 is detected by the detection camera 7 as shown in FIG.
The dicing line 39 is detected at the aiming point U which is the intersection of the XY aiming lines 78 and 79 on the monitor 7, and the angle θ1 of the dicing line 39 with respect to the XY aiming line is set to 45 degrees.

Each pellet 22 that is divided and arranged on the adhesive sheet 36 is determined in advance by a semiconductor inspection device (not shown) as described above, and the quality of each element is determined as good or bad and the rank of A, B, c, etc. is determined. Since the information is stored in a storage medium such as a floppy disk or magnetic tape at the coordinate position in the X and Y directions relative to the center of the wafer 35, each pellet 22
In order to make it possible to select and extract the necessary pellets 22 using the collet 23, it is necessary to set a reference alignment angle to certify the coordinate position of each pellet 22 to be divided and aligned. . In this embodiment, the results of determining whether each element on the wafer 35 is good or bad and ranks such as A, B, and C are determined by setting coordinate positions in the X and Y directions with respect to the center of the wafer 35. X of wafer 35
It is necessary to match the Y direction and the XY direction, which is the moving direction of the XY table 21. In other words, the XY direction is divided,
This is the reference alignment angle of the pellets 22 to be aligned, and the reference alignment angle is set by the moving direction of the XY table 21 and the XY sight line 78, 79 on the monitor of the detection camera 77 [Reference alignment angle setting means 2] ].

The angle that the dicing line 39 of the wafer 35 makes with respect to the XY direction detected by the detection camera 77 is compared with the reference alignment angle, and as a result of the comparison, the angle to set the dicing line 39 of the wafer 35 as the reference alignment angle is determined. The correction value (+ for θ) is calculated by the calculation unit 81 of the detection camera 77 [Means for calculating the angle correction value (+ for θ)■
].

5 Furthermore, a means for outputting a drive signal to rotate the support ring 30 based on the angle correction value (+ to θ);
A rotational drive signal is output from the support ring rotation means (2) to the support ring rotation means (2). After rotating the support ring 30 and correcting the angle of the dicing line 39 to the reference alignment angle, it is necessary to newly align the aiming point U of the detection camera 77 to any position on the dicing line 39 and check the correction state. .

At this time, since it is time-consuming to newly align the aiming point U of the monitor of the detection camera 77, which has a narrow detection range, with any arbitrary part of the dicing line 39, the arbitrary part of the dicing line 39 detected by the detection camera 77 must be adjusted before correction. The angle correction is performed while keeping a part of the point T aligned with the aiming point U.

That is, the angle is corrected while the same dicing line 39 continues to be captured in the narrow detection area of the detection camera 77. For this reason, the means (2) for outputting the drive signal includes an xY table drive 6, an actuator stage (2) and a support ring so that the angle is corrected while the point T of a part of the dicing line 39 of the wafer 22 is still being detected. X for each rotating means■
A Y drive signal and a rotation drive signal are output. This means that the wafer 35 has its center centered on the support ring 3.
This is due to the fact that it is supported by the support ring 30 at a position different from the rotation center 0.

Dicing line 39 of wafer 35 as shown in FIG.
For example, when the angle is 45 degrees with respect to the XY direction, the detection camera 77 aligns the aiming point U with the point T of the arbitrary dicing line 39 as shown on the monitor in FIG. The angle θ1 = 45 degrees that the dicing line 39 forms with respect to the XY directions is determined, and then the calculation unit 81 of the detection camera 77 calculates an angle correction value (+ for θ). In this embodiment, the reference alignment angle is the XY direction, and the angular difference between the XY direction and the XY direction of the wafer 35 becomes the angle correction value (θK + ).

Therefore, the angle correction value θ becomes +=45 degrees, and a drive signal is output from the drive signal outputting means (■) to the support ring rotation means (■) and the xY table drive means (■), and the support ring 3
0 rotates and the dicing line 39 of the wafer 35 is detected while the arbitrary point
Angle correction is performed. The result of angle correction can be detected at any dicing line 3 as shown on the monitor in Fig. 1θ.
As a result, the angle of the dicing line 39 with respect to the XY aiming line 78, 79 is re-detected on the monitor, and the reference alignment angle, that is,
In this embodiment, the XY direction and the XY direction of the dicing line 39 are
This is done by checking the consistency of the direction [Means for checking consistency ■]. As a result of checking the consistency with the reference alignment angle, if a difference is detected in the angle that the dicing line 39 makes with respect to the X and Y directions, the calculation unit of the camera 77 detects a correction value θ of 2 for the angle that corrects the angular difference. 81 [Means for calculating the angle correction value (θK 2 )]. Furthermore, dicing line 3 of wafer 35
In order to correct the angle based on the angle correction value θ while keeping the point T of 9 aligned with the aim point U on the monitor, the support ring rotation means ■ and the xY table drive are used. From means ■ for outputting a drive signal to means ■,
A rotational drive signal and an XY drive signal are output.

When it is confirmed that the dicing line 39 is aligned at the standard alignment angle at some point T of the arbitrary dicing line 39 on the wafer 35, other points on the same dicing line 39 as the arbitrary dicing line 39 are confirmed. The consistency with the standard alignment angle is reconfirmed in some parts [Reconfirmation means for confirming consistency ■]. This reconfirmation means (2) uses the detection camera 77 to detect the angle of the arbitrary die sink line 39 and other parts on the same dicing line 39 with respect to the X and Y directions, as shown in FIG. 1O. In a state where it is confirmed that a part of the point T of the dicing line 39 and the aiming point U are aligned on the monitor and that the dicing line 39 is aligned at the standard alignment angle, for example, on the same dicing line 39 as shown in FIG. The other portion 85 is to be detected.

9 In other words, when the XY table 21 is moved in the X direction after detecting a part of the point T on the dicing line 39 and the other part 85 is detected by the detection camera 77, the angle made with respect to the XY direction is If there is a deviation from the standard alignment angle, it is the dicing line 3.
9 means that it is not aligned to the reference alignment angle.

For example, when the XY table 21 is moved in the X direction from a point T of a part of the dicing line 39 to another part 85, and the other part 85 is detected by the detection camera 77, the aim is as shown in the monitor shown in FIG. When deviations are detected between point U and point Z on the dicing line 39, it is necessary to correct these deviations. This deviation is at an angle of X with respect to point T on the dicing line 39 of the wafer 35.
This means that it is shifted by θ3 in the Y direction, and θ3 is expressed by the following equation.

0 θ3 is determined by the calculation unit 81 as a result of detection by the detection camera 77.
is calculated, and then the angle correction value (θKa
) is calculated [Angle correction value (3 for θ)
[Stock]], and the angle correction value (θKa
), a rotation drive signal is output from the drive signal outputting means 0 to the support ring rotation means (2), and the dicing lines 39 of the wafer 35 are aligned at the reference alignment angle, that is, in the XY directions, as shown on the monitor in FIG. The Rukoto.

After the dicing lines 39 of the wafer 35 are aligned at the reference alignment angle, the center position of the wafer 35 supported by the support ring 30 is detected. That is, wafer 35
Good, bad, A, B, etc. of each element arranged and formed above
Ranks such as C are stored in a storage medium such as a floppy disk or magnetic tape by setting the coordinate position in the X and Y directions relative to the center of the wafer 35, so the necessary pellets 22 are sorted and extracted based on the storage medium. If this is done, it is necessary to identify the coordinate position of each pellet 22 with respect to the center of the wafer 35 on the support ring 30. Support ring 3
Detection of the center of the wafer 35 on the wafer 35 is performed by setting two strings on the circumference of the circular wafer 35 as shown in FIG. By setting the three points 87, 88, and 89, two chords 90.91 are created, and the calculation unit of the camera 77 detects the coordinate position 95 of the intersection of the perpendicular bisector 93.94 of each chord 90.91. This is done by calculating in step 81. As a result, the center coordinates 95 of the wafer 35 on the support ring 30 are calculated.

Information regarding the coordinate position of each pellet 22 stored in a storage medium such as a floppy disk or a magnetic tape, whether good or bad, or classified by rank such as A, B, C, etc., is transferred to the XY table driving means (2) from the storage medium. The XY table driving means (2) can recognize the coordinate position of each pellet 22 while recognizing the center coordinate 95 of the wafer 35. This makes it possible to identify the coordinate positions of the required pellets 22 among the pellets 22 aligned at the standard alignment angle on the adhesive sheet 36, and by controlling the movement of the table 21 to the required coordinate positions, the required pellets 22 can be located. It becomes possible to position it at the suction point of the collet 23, and it becomes possible to sort and extract the necessary good quality pellets or the pellets 22 of the necessary rank.

Next, the operation of the above embodiment will be explained.

Each element on the wafer 35 is checked in advance by a semiconductor inspection device to ensure that the temperature characteristics and operating characteristics of each element are good.

Ranks such as A, B, and C are determined based on defects or the superiority or inferiority of the characteristics, and such information is stored, for example, on the wafer 35.
It is stored in a storage medium such as a floppy disk or magnetic tape in the x and y coordinates relative to the center position. The wafer 35 adhered to the adhesive sheet 36 is broken and separated along the dicing lines 39 carved in the X and Y directions, and is supported on the support ring 30 in a state where it is divided into pellets 22 as element pieces. be done. In this state, the adhesive sheet 36 and the wafer ring 43 attached to the adhesive sheet 36 are chucked by the chuck/stretcher 45, and the detection camera 77 detects the angle that the dicing line 39 of the wafer 35 makes with respect to the XY direction. Then, the reference alignment angle [XYY direction comparison is performed. That is, when certifying the coordinate position of each pellet 22 stored in the storage medium and for which coordinates have been set in advance on the XY table 21, the wafer 35 is placed at the reference alignment angle [in the XYY direction where the coordinates have been set]. need to be aligned. Therefore, the dicing line 39 of the wafer 35 is detected by the detection camera 77, the angle of the dicing line 39 made with respect to the XY direction is compared with the reference alignment angle, and the angle correction value (θKl) is calculated. Align to the standard alignment angle.

The angle correction is performed in a state where a part of the arbitrary dicing line 39 can be detected by the detection camera 77, so that after the angle correction, the angle between the dicing line 39 in the XY direction and the reference alignment angle is determined. When checking consistency,
New detection range of detection camera 77, specifically aiming point U
It is no longer necessary to match Guisin 4 and Grine 39.

After correction is made based on the angle correction value (+ for θ), the consistency with the standard alignment angle is checked.As a result of checking the consistency, the angle between the standard alignment angle and the dicing line 39 with respect to the XY direction If a difference is detected between them, an angle correction value (θK 2 ) is calculated, and the angle correction is performed based on the correction value (θ = 2). As a result, the wafer 35
can be reliably and precisely aligned on the XY table 21.

Further, after confirming that a part of the arbitrary dicing line 39 is aligned at the reference alignment angle, move the XY table 21 to align other parts on the same dicing line 39 as the arbitrary dicing line 39. Consistency with the reference alignment angle is confirmed by the detection camera 77. In other words, even if there is an angular difference from the reference alignment angle that cannot be detected by the detection camera 77 in a part of the arbitrary dicing line 39, it can be detected by moving the XY table 21 and detecting other parts. The angular difference is enlarged to be detectable by the detection camera 77, and in order to correct the angular difference in this state, an angular correction value (3 for θ) is calculated, and the support ring 30 is rotated. If the angle is corrected, the wafer 35 can be moved more reliably and with high precision to the XY tenable 2.
It becomes possible to align on 1.

Wafer 35 on the XY table 21 whose angle has been corrected
Each pellet 22 has the same coordinate arrangement as the information about each element stored in a storage medium such as a floppy disk or magnetic tape, and by setting the center 95 of the wafer 35, the necessary pellets can be determined based on the storage medium. The coordinate position of the pellet 22 can be recognized, and the pellet 22 can be sorted and extracted by the collet 23.

In this manner, according to the above embodiment, the pellets 22 to be extracted are quickly and reliably separated and arranged on the XY table 21 and the coordinate positions of the pellets 22 are recognized. Furthermore, it is now possible to perform continuous sorting and extraction, and based on information inspected in advance by semiconductor inspection equipment, for example, only good pellets can be sorted and extracted, or pellets whose temperature characteristics and operating characteristics belong to rank A. It is also possible to sort and extract only the pellet 22. This makes it possible to greatly improve the operating efficiency of the pellet sorting and extraction device.

[Effects of the Invention] As described above, the present invention includes a support ring that supports a wafer having a dicing line divided into each pellet and a coordinate position set for each pellet, and a table that rotatably supports the support ring. and adjust the rotational position of the support ring,
a support ring rotation means that can freely adjust the angle that the dicing line of the wafer makes with respect to the XY directions; a detection camera that is placed above the table and detects the angle that the dicing line of the wafer makes with the XY direction; A reference alignment angle setting means for setting a reference alignment angle that serves as a reference for certifying the coordinate position of each pellet to be divided and aligned; a means for comparing the angles formed by the angle and calculating an angle correction value; a means for outputting a drive signal to the support ring rotating means based on the angle correction value; A collet that certifies the coordinate position of a necessary pellet and allows the pellet to be sorted and extracted;
As the pellet sorting and extraction device has There is an efficiency in that the work of sorting and extracting only pellets can be performed quickly and reliably, and the operating efficiency of the pellet sorting and extracting device can be improved.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the entire pellet i-pounding device equipped with a pellet sorting and extracting device according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view taken along line II-II in FIG. 1. , Fig. 3 is a sectional view showing the state before stretching the adhesive sheet, Fig. 4 is a sectional view showing the state where the adhesive sheet is stretched by the chuck/stretching means, and Fig. 5 is a sectional view showing the state in which the adhesive sheet is stretched after being broken and separated. A cross-sectional view showing the state before forming gaps between pellets,
Fig. 6 is a cross-sectional view showing the state where intervals are formed between each pellet, Fig. 7 is a plan view showing the state before the angle of the wafer dicing line is corrected, and Fig. 8 is a cross-sectional view showing the state before the angle of the dicing line of the wafer is corrected. The plan view showing the state corrected based on the correction value (θKl), FIG. 9 and FIG.
Figure 9 shows the state before correcting the dicing line angle.
Fig. 1 θ is a diagram showing the state after correction based on the angle correction value (+ θ), Fig. 11 is a plan view showing the part of the wafer detected by the detection camera, and Fig. 12 is a diagram showing the state after correction based on the angle correction value (+ θ). Regarding the monitor diagram showing the state in which other parts on the same dicing line as the dicing line are detected, the diagram shows the state before angle correction, and Fig. 13 shows the state before angle correction is performed. FIG. 14 is a monitor diagram showing the state after correction, and FIG. 14 is a plan view showing the state in which the center of the wafer is detected. 21...XY table, 22...pellet, 23.
... Collet, 30... Support ring, 35... Wafer, 39... Dicing line, 77... Detection camera, ■... Reference alignment angle setting means, ■... Angle correction value means for calculating, ■...means for outputting a drive signal, ■...means for rotating the support ring. Agent Patent Attorney Osamu Shiokawa Fig. 12 85 2 Fig. 13 5 822 1/ri^ Fig. 14

Claims (1)

[Claims] (1) A support ring that supports the wafer, which has a dicing line divided into each pellet and has a coordinate position set for each pellet, a table that rotatably supports the support ring, and adjusts the rotational position of the support ring. and a support ring rotation means that can freely adjust the angle that the dicing line of the wafer makes with respect to the XY directions, and a detection camera that is placed above the table and detects the angle that the dicing line of the wafer makes with the XY direction. and a reference alignment angle setting means for setting a reference alignment angle that serves as a reference for certifying the coordinate position of each pellet to be divided and aligned; and a collet for identifying the coordinate position of a necessary pellet among the pellets aligned at the reference alignment angle and for sorting and extracting the pellet. Pellet sorting and extraction device.