CN219201407U - Spherical defect detector - Google Patents
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- CN219201407U CN219201407U CN202223284401.3U CN202223284401U CN219201407U CN 219201407 U CN219201407 U CN 219201407U CN 202223284401 U CN202223284401 U CN 202223284401U CN 219201407 U CN219201407 U CN 219201407U
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Abstract
The utility model discloses a spherical defect detector in the technical field of spherical detection equipment, which comprises a sample placing table, a sample clamping assembly and a supporting frame, wherein a three-dimensional positioning mechanism is arranged on the sample placing table and drives a hemispherical product to move along an X axis and a Y axis and rotate along an R axis, the sample clamping assembly clamps the hemispherical product to enable the outer surface or the inner surface of the hemispherical product to face outwards, a lifting mechanism is arranged on the supporting frame, photographing mechanisms and defect marking mechanisms are arranged on two sides of a lifting end of the lifting mechanism, the lifting mechanism drives the photographing mechanisms and the defect marking mechanisms to lift, the photographing mechanisms detect defects on the surface of the hemispherical product, and the defect marking mechanisms mark defects on the surface of the hemispherical product. The problem that the defect detection equipment of the conventional hemispherical product cannot detect defects on the outer spherical surface of the hemispherical product is solved, the defect detection equipment is suitable for detecting defects on the inner surface and the outer surface of the hemispherical product, the universality is good, and the detection cost is reduced.
Description
Technical Field
The utility model relates to the technical field of spherical surface detection equipment, in particular to a spherical surface defect detector.
Background
In the production process of hemispherical products, defects such as surface roughness, gravity center deviation and the like appear on the surfaces of partial hemispherical products due to the influence of various factors, so that the hemispherical products with the defects need to be screened out.
In order to solve the technical problem, currently, flaw detection equipment is generally adopted to detect a hemispherical surface, for example, in Chinese patent literature with the application number of CN202010400484.4, a rotary deflection type shooting imaging robot applied to detecting defects of an internal spherical surface is disclosed, and the rotary deflection type shooting imaging robot comprises a bottom plate, a top plate, a lifting displacement device, a base, a rotary deflection imaging device and a workpiece fixing seat, wherein the top plate, the lifting displacement device, the base, the rotary deflection imaging device and the workpiece fixing seat are connected to the bottom plate through four support columns, the internal spherical surface is subjected to equal-height rotary shooting imaging through the rotary deflection imaging device, and the height difference between the bottom and the top of a workpiece of the internal spherical surface is divided into a plurality of groups during primary imaging, so that the defects of the internal spherical surface are detected.
However, the above-mentioned rotary pendulum type shooting imaging robot applied to the defect detection of the inner sphere is only suitable for detecting the defect of the inner sphere of the hemispherical product, and is not suitable for detecting the defect of the outer sphere of the hemispherical product, because the imaging unit for shooting is arranged at the end of the rotary pendulum type imaging device, and the defect detection of the outer sphere of the hemispherical product cannot be performed when the rotary pendulum type imaging device rotates. Therefore, in order to realize defect detection on the inner spherical surface and the outer spherical surface of the semi-spherical product, the detection can be completed by adding another even more equipment, and the detection cost is high.
Disclosure of Invention
The utility model provides a spherical defect detector, which aims to solve the problem that the existing hemispherical product defect detection equipment cannot detect defects on the outer spherical surface of a hemispherical product.
The technical scheme of the utility model is as follows:
a spherical defect detector comprising:
the sample placing table is provided with a three-dimensional positioning mechanism which is used for driving the hemispherical product to move along an X axis and a Y axis and rotate along an R axis;
a sample holding assembly for holding the hemispherical product such that an outer surface of the hemispherical product faces outwardly or an inner surface thereof faces outwardly;
the sample placing table comprises a sample placing table, and is characterized in that a supporting frame is arranged above the sample placing table, a lifting mechanism, shooting mechanisms and defect marking mechanisms are arranged on the supporting frame, the shooting mechanisms and the defect marking mechanisms are located on two sides of a lifting end of the lifting mechanism, the lifting mechanism is used for driving the shooting mechanisms to lift the defect marking mechanisms, the shooting mechanisms are used for detecting defects on the surface of a hemispherical product, and the defect marking mechanisms are used for marking defects on the surface of the hemispherical product.
Further, the sample clamping assembly comprises an outer surface clamping assembly and an inner surface clamping assembly, wherein the outer surface clamping assembly is used for clamping the hemispherical product so as to detect defects on the outer surface of the hemispherical product, and the inner surface clamping assembly is used for clamping the hemispherical product so as to detect defects on the inner surface of the hemispherical product.
Further, the surface clamping assembly comprises a base, a plurality of fixing blocks are arranged on the base, clamping portions are arranged at the tops of the fixing blocks, and the clamping portions are clamped with the inner side edges of the hemispherical product, so that the center of the hemispherical product coincides with the center of the base.
Further, the outer surface clamping assembly further comprises a long sliding block, the fixed block is in sliding connection with the long sliding block, and scales corresponding to the length of the long sliding block are arranged on the base.
Further, the internal surface clamping assembly comprises a bottom plate, two side plates and a top plate, wherein a jacking assembly is arranged on the bottom plate, a through hole matched with the bottom of the hemispherical product is formed in the top plate, the bottom of the hemispherical product is upwards placed on the jacking assembly, and the bottom of the hemispherical product is clamped into the through hole by adjusting the jacking assembly.
Further, the three-dimensional positioning mechanism comprises a Y-axis moving module, an X-axis moving module arranged at the moving end of the Y-axis moving module, an R-axis rotating module arranged at the moving end of the X-axis moving module, the sample clamping component is arranged at the rotating end of the R-axis rotating module,
the X-axis moving module is used for driving the X-axis moving module to move in the Y-axis direction, the X-axis moving module is used for driving the R-axis rotating module to move along the X-axis direction, and the R-axis rotating module is used for driving the sample clamping assembly and the hemispherical product to rotate along the R-axis.
Further, the lifting mechanism comprises a Z-axis lifting module and a lifting cross beam arranged at the lifting end of the lifting module, the shooting mechanism is arranged on one side of the lifting cross beam, and the defect marking mechanism is arranged on the other side of the lifting cross beam.
Further, the shooting mechanism comprises a first deflection module and a shooting assembly arranged at the moving end of the first deflection module, and the first deflection module drives the shooting assembly to deflect, so that the shooting direction of the shooting assembly is perpendicular to the tangential direction of a shooting point corresponding to the hemispherical product.
Further, the defect marking mechanism comprises a second deflection module and a laser marking assembly arranged at the moving end of the second deflection module, and the second deflection module drives the laser marking assembly to deflect, so that the laser marking assembly marks the defects of the hemispherical product.
Further, the outer diameter of the hemispherical product is 120-300 mm.
The utility model according to the scheme has the beneficial effects that:
according to the spherical defect detector, the outer surface or the inner surface of the hemispherical product faces outwards through the sample clamping assembly, the three-dimensional positioning mechanism is arranged on the sample placing table and drives the hemispherical product to move along the X axis and the Y axis and rotate along the R axis, so that the shooting mechanism carries out omnibearing defect detection on the surface of the hemispherical product, the detection precision is high, and the detection efficiency is high; the flaw detection device is not only suitable for flaw detection of the inner surface of the hemispherical product, but also can detect the flaws of the outer surface of the hemispherical product, and one device can detect the flaws of the inner surface and the outer surface of the hemispherical product, so that the universality is good, and the detection cost is reduced.
In addition, the spherical defect detector is further provided with a defect marking component, when the shooting mechanism detects that defects exist on the surface of the hemispherical product, the defect marking mechanism marks the defects, so that the first hemispherical product is conveniently screened, and the hemispherical product is conveniently repaired in the subsequent process.
Drawings
FIG. 1 is a schematic diagram of a structure for detecting defects on the outer surface of a hemispherical product;
FIG. 2 is a schematic diagram of a structure for detecting defects on the inner surface of a hemispherical product;
FIG. 3 is a schematic structural view of a three-dimensional positioning mechanism;
FIG. 4 is a schematic view of the structure of the outer surface gripping assembly;
fig. 5 is a schematic view of the structure of the inner surface clamping assembly.
In the figure, 1, a sample placing table;
21. an outer surface clamping assembly; 211. a base; 212. a fixed block; 2121. a clamping part; 213. a long slide block; 214. a scale; 22. an inner surface clamping assembly; 221. a bottom plate; 222. a side plate; 223. a top plate; 2231. a through hole; 224. a jacking assembly;
3. a support frame;
4. a three-dimensional positioning mechanism; 41. a Y-axis moving module; 42. an X-axis moving module; 43. an R-axis rotating module;
5. a lifting mechanism; 51. a lifting module; 52. lifting the cross beam;
6. a photographing mechanism; 61. a first deflection module; 62. a shooting assembly;
7. a defect marking mechanism; 71. a second deflection module; 72. a laser marking assembly;
8. hemispherical product.
Detailed Description
The utility model is further described below with reference to the drawings and embodiments:
as shown in fig. 1 to 2, the present utility model provides a spherical defect detecting machine, comprising: the sample placing table 1, the sample clamping assembly and the supporting frame 3 are arranged on the sample placing table 1, and the three-dimensional positioning mechanism 4 is used for driving the hemispherical product 8 to move along the X axis and the Y axis and rotate along the R axis; the sample clamping assembly is used for clamping the hemispherical product 8, and the outer surface of the hemispherical product 8 faces outwards or the inner surface of the hemispherical product 8 faces outwards; the support frame 3 sets up in the top of sample placement platform 1, is equipped with elevating system 5 on the support frame 3, and elevating system 5's lift end both sides are equipped with shooting mechanism 6, defect marking mechanism 7, and elevating system 5 is used for driving shooting mechanism 6, defect marking mechanism 7 and goes up and down, and shooting mechanism 6 is used for carrying out the defect detection to hemisphere product 8 surface, and defect marking mechanism 7 is used for marking hemisphere product 8 surface's defect.
According to the spherical defect detector, the outer surface or the inner surface of the hemispherical product 8 is outwards arranged through the sample clamping assembly, and the omnibearing defect detection on the outer surface or the inner surface of the hemispherical product 8 is realized through the three-dimensional positioning mechanism 4, so that the detection precision is high and the detection efficiency is high; the flaw detection device is not only suitable for flaw detection of the inner surface of the hemispherical product 8, but also can detect the flaws of the outer surface of the hemispherical product 8, and one device can detect the flaws of the inner surface and the outer surface of the hemispherical product 8, so that the universality is good, and the detection cost is reduced.
As shown in fig. 2 and 3, in the present embodiment, the three-dimensional positioning mechanism 4 includes a Y-axis moving module 41, an X-axis moving module 42, and an R-axis rotating module 43, the X-axis moving module 42 is disposed at the moving end of the Y-axis moving module 41, the R-axis rotating module 43 is disposed at the moving end of the X-axis moving module 42, and the sample clamping assembly is disposed at the rotating end of the R-axis rotating module 43. When the defects on the surface of the hemispherical product 8 are detected, the Y-axis moving module 41 drives the X-axis moving module 42 to move in the Y-axis direction, and the distance from the X-axis moving module 42 to the shooting mechanism 6 is adjusted, so that the focal length of the shooting mechanism 6 falls on the surface of the hemispherical product 8; meanwhile, the X-axis moving module 42 drives the R-axis rotating module 43 to move along the X-axis direction, so that the center of the hemispherical product 8 and the shooting center of the shooting mechanism 6 are ensured to be on the same plane, and the measurement precision is improved; the R-axis rotating module 43 drives the sample clamping assembly and the hemispherical product 8 to rotate along the R axis, so that the shooting mechanism 6 carries out omnibearing defect detection on the outer surface or the inner surface of the hemispherical product 8.
In the present embodiment, the lifting mechanism 5 includes a Z-axis lifting module 51, a lifting beam 52 provided at the lifting end of the lifting module 51, the photographing mechanism 6 is provided at one side of the lifting beam 52, and the flaw marking mechanism 7 is provided at the other side of the lifting beam 52. When the semi-spherical product 8 is detected for defects, the Z-axis lifting module 51 drives the lifting cross beam 52 to ascend or descend at the same height, namely when the defects are detected, the lifting cross beam 52 ascends or descends at the same distance each time, so that the shooting mechanism 6 shoots the surface of the semi-spherical product 8 in the same area, the defect detection is realized on the whole surface of the semi-spherical product 8, and the detection precision is improved.
In the present embodiment, the photographing mechanism 6 includes a first deflection module 61 and a photographing assembly 62, and the photographing assembly 62 is disposed at a moving end of the first deflection module 61. When the hemispherical product 8 is subjected to defect detection, the first deflection module 61 drives the shooting assembly 62 to deflect, so that the shooting direction of the shooting assembly 62 is vertical to the tangential direction of a shooting point corresponding to the hemispherical product 8, the shooting range of the shooting assembly 62 is more accurate, the shooting effect is better, and the shooting precision is improved.
In this embodiment, the defect marking mechanism 7 includes a second deflecting module 71, and a laser marking assembly 72 disposed at a moving end of the second deflecting module 71. When the shooting mechanism 6 detects that the hemispherical product 8 has defects when the hemispherical product 8 is detected to have defects, the three-dimensional positioning mechanism 4 drives the hemispherical product 8 to move to a working area of the defect marking mechanism 7, and then the second deflection module 71 drives the laser marking assembly 72 to deflect, so that the defects of the hemispherical product 8 are marked by the laser marking assembly 72, the first hemispherical product 8 is conveniently screened, and the follow-up procedure is facilitated for repairing the hemispherical product 8. After the defect marking is completed, the three-dimensional positioning mechanism 4 drives the hemispherical product 8 to move to the original position, and the shooting assembly 62 continues to detect defects on the surface of the hemispherical product 8.
In this embodiment, the outer diameter of the hemispherical product 8 is 120 mm-300 mm, and the sample clamping assembly includes an outer surface clamping assembly 21 and an inner surface clamping assembly 22. When the defects of the outer surface of the hemispherical product 8 are detected, the outer surface clamping assembly 21 is assembled on the R-axis rotating module 43 and used for clamping the hemispherical product 8, so that the outer surface of the hemispherical product 8 faces outwards. When detecting defects on the inner surface of the hemispherical product 8, the inner surface clamping assembly 22 is assembled on the R-axis rotating module 43 for clamping the hemispherical product 8 so that the inner surface of the hemispherical product 8 faces outwards.
As shown in fig. 1 and 4, in the present embodiment, the outer surface clamping assembly 21 includes a base 211, a plurality of fixing blocks 212 disposed on the base 211, and a clamping portion 2121 disposed on top of the fixing blocks 212, where the clamping portion 2121 is clamped to an inner edge of the hemispherical product 8, so that a center of the hemispherical product 8 coincides with a center of the base 211, and fixing the hemispherical product 8 on the base 211 is achieved. In addition, the outer surface clamping assembly 21 further comprises a long sliding block 213, the fixed block 212 is slidably connected with the long sliding block 213, and the base 211 is further provided with scales 214 corresponding to the length of the long sliding block 213, so that the position of the fixed block 212 can be conveniently adjusted. When the defect detection is performed on the outer surface of the hemispherical product 8, the outer surface of the hemispherical product 8 is placed outwards on the clamping portion 2121, and then each fixing block 212 is adjusted to the same scale 214, so that the hemispherical product 8 is fixed on the fixing block 212, and the center of the hemispherical product 8 coincides with the center of the base 211.
As shown in fig. 2, 3 and 5, in the present embodiment, the bottom plate 221 of the inner surface clamping assembly 22, two side plates 222 and the top plate 223, the bottom plate 221 is provided with a jacking assembly 224, and the top plate 223 is provided with a through hole 2231 matching with the bottom of the hemispherical product 8. When the defects of the inner surface of the hemispherical product 8 are detected, the hemispherical product 8 is placed on the jacking component 224 with the bottom upwards, the jacking component 224 is adjusted to ascend, the bottom of the hemispherical sample 8 is clamped in the through hole 2231, and the hemispherical product 8 is fixed on the inner surface clamping component 22. In addition, the diameter of the through hole 2231 is equal to the inner diameter of the hemispherical sample 8, so that the stability of the assembly of the top plate 223 and the hemispherical sample 8 is improved.
The working process comprises the following steps:
when detecting defects on the outer surface of the hemispherical sample 8, firstly, the outer surface clamping assembly 21 is assembled on the R-axis rotating module 43, then the outer surface of the hemispherical sample 8 is sleeved on the clamping part 2121 of the fixing block 212 in an outward sleeved mode, and the position of the fixing block 212 is adjusted so that the hemispherical sample 8 is fixed on the outer surface clamping assembly 21, and the center of the hemispherical product 8 coincides with the center of the base 211. Then setting the height of the lifting mechanism 5 rising or falling each time, starting a spherical defect detector, driving the shooting mechanism 6 to descend to the bottom of the hemispherical product 8 by the lifting mechanism 5, driving the shooting component 62 to deflect by the first deflection module 61, enabling the shooting direction of the shooting component 62 to be vertical to the tangential direction of a shooting point corresponding to the hemispherical product 8, simultaneously driving the hemispherical product 8 to move along an X axis and a Y axis by the three-dimensional positioning mechanism 4, adjusting the X axis distance and the Y axis distance between the hemispherical product 8 and the shooting mechanism 6, enabling the shooting point of the shooting mechanism 6 to fall on the outer surface of the hemispherical product 8, enabling the hemispherical product 8 to rotate along an R axis, enabling the shooting component 62 to shoot the outer surface of the hemispherical product 8 at the same area and detect defects, enabling the Y axis movement module 41 of the three-dimensional positioning mechanism 4 to move the hemispherical product 8 to a working area of the defect marking mechanism 7 if the defects exist on the outer surface of the hemispherical product 8, enabling the laser marking component 72 to deflect, enabling the laser marking component 72 to mark the defects on the hemispherical product 8, and enabling the hemispherical product 8 to move in situ after the defect detection module 41 to continue; after the R shaft rotates for one circle, the lifting mechanism 5 drives the shooting mechanism 6 to ascend to a set height, the first deflection module 61 drives the shooting assembly 62 to deflect and detect the defects on the outer surface of the hemispherical product 8 at the height, and the cycle is performed until the defects on the outer surface of the hemispherical product 8 are detected.
When detecting defects on the inner surface of the hemispherical sample 8, firstly, the inner surface clamping assembly 22 is assembled on the R-axis rotating module 43, then the inner surface of the hemispherical sample 8 is outwards placed on the jacking assembly 224, the jacking assembly 224 is adjusted to ascend, the bottom of the hemispherical sample 8 is clamped in the through hole 2231, and the hemispherical product 8 is fixed on the inner surface clamping assembly 22. Then setting the height of the lifting mechanism 5 rising or falling each time, then starting a spherical defect detector, driving the shooting mechanism 6 to descend by the lifting mechanism 5, driving the shooting component 62 to deflect by the first deflection module 61, enabling the shooting direction of the shooting component 62 to be perpendicular to the tangential direction of a shooting point corresponding to the hemispherical product 8, simultaneously driving the hemispherical product 8 to move along an X axis and a Y axis by the three-dimensional positioning mechanism 4, adjusting the X axis distance and the Y axis distance of the hemispherical product 8 and the shooting mechanism 6, enabling the shooting point of the shooting mechanism 6 to fall on the inner surface of the hemispherical product 8, enabling the hemispherical product 8 to rotate along an R axis, enabling the shooting component 62 to shoot the outer surface of the hemispherical product 8 at the same area and detect the defects, enabling the Y axis movement module 41 of the three-dimensional positioning mechanism 4 to move the hemispherical product 8 to the working area of the point marking mechanism 7 if the defects exist on the inner surface of the hemispherical product 8, and enabling the laser marking component 72 to deflect, enabling the laser marking component 72 to mark the defects of the hemispherical product 8, and enabling the Y axis movement module 41 to continue to perform in-situ defect detection after the defects marking of the hemispherical product 8 are finished; after the R shaft rotates for one circle, the lifting mechanism 5 drives the shooting mechanism 6 to ascend to a set height, the first deflection module 61 drives the shooting assembly 62 to deflect and detect defects on the inner surface and the outer surface of the hemispherical product 8 at the height, and the cycle is performed until the defects on the inner surface of the hemispherical product 8 are detected.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the implementation of the utility model is not limited by the above manner, and it is within the scope of the utility model to apply the inventive concept and technical solution to other situations as long as various improvements made by the inventive concept and technical solution are adopted, or without any improvement.
Claims (10)
1. A spherical defect detector, comprising:
the sample placing table is provided with a three-dimensional positioning mechanism which is used for driving the hemispherical product to move along an X axis and a Y axis and rotate along an R axis;
a sample holding assembly for holding the hemispherical product such that an outer surface of the hemispherical product faces outwardly or an inner surface thereof faces outwardly;
the sample placing table comprises a sample placing table, and is characterized in that a supporting frame is arranged above the sample placing table, a lifting mechanism, shooting mechanisms and defect marking mechanisms are arranged on the supporting frame, the shooting mechanisms and the defect marking mechanisms are located on two sides of a lifting end of the lifting mechanism, the lifting mechanism is used for driving the shooting mechanisms to lift the defect marking mechanisms, the shooting mechanisms are used for detecting defects on the surface of a hemispherical product, and the defect marking mechanisms are used for marking defects on the surface of the hemispherical product.
2. A spherical flaw detector according to claim 1 wherein the sample holding assembly comprises an outer surface holding assembly for holding the hemispherical product for flaw detection of an outer surface of the hemispherical product, and an inner surface holding assembly for holding the hemispherical product for flaw detection of an inner surface of the hemispherical product.
3. A spherical spot detector according to claim 2, wherein the outer surface clamping assembly comprises a base, a plurality of fixing blocks arranged on the base, and a clamping portion arranged at the top of each fixing block and clamped with the inner side edge of the hemispherical product, so that the center of the hemispherical product coincides with the center of the base.
4. A spherical spot detector according to claim 3, wherein the outer surface gripping assembly further comprises a long slide, the fixed block being slidably connected to the long slide, and the base being provided with graduations corresponding to the length of the long slide.
5. A spherical spot detector according to claim 2, wherein the inner surface holding assembly comprises a bottom plate, two side plates and a top plate, wherein the bottom plate is provided with a jacking assembly, the top plate is provided with a through hole matched with the bottom of the hemispherical product, the bottom of the hemispherical product is upwards placed on the jacking assembly, and the bottom of the hemispherical product is clamped into the through hole by adjusting the jacking assembly.
6. The spherical spot detector according to claim 1, wherein the three-dimensional positioning mechanism comprises a Y-axis moving module, an X-axis moving module disposed at a moving end of the Y-axis moving module, an R-axis rotating module disposed at a moving end of the X-axis moving module, the sample holding member being disposed at a rotating end of the R-axis rotating module,
the X-axis moving module is used for driving the X-axis moving module to move in the Y-axis direction, the X-axis moving module is used for driving the R-axis rotating module to move along the X-axis direction, and the R-axis rotating module is used for driving the sample clamping assembly and the hemispherical product to rotate along the R-axis.
7. A spherical defect detector as claimed in claim 1, wherein the lifting mechanism comprises a Z-axis lifting module and a lifting beam arranged at the lifting end of the lifting module, the photographing mechanism is arranged at one side of the lifting beam, and the defect marking mechanism is arranged at the other side of the lifting beam.
8. A spherical defect detector as claimed in claim 1, wherein the photographing mechanism comprises a first deflection module and a photographing assembly arranged at a moving end of the first deflection module, and the first deflection module drives the photographing assembly to deflect, so that a photographing direction of the photographing assembly is perpendicular to a tangential direction of a photographing point corresponding to the hemispherical product.
9. A spherical defect detector as in claim 1 wherein the defect marking mechanism comprises a second deflection module and a laser marking assembly disposed at a moving end of the second deflection module, the second deflection module driving the laser marking assembly to deflect so that the laser marking assembly marks the defect of the hemispherical product.
10. A spherical spot detector as claimed in claim 1, wherein the hemispherical product has an outer diameter of 120mm to 300mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223284401.3U CN219201407U (en) | 2022-12-07 | 2022-12-07 | Spherical defect detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223284401.3U CN219201407U (en) | 2022-12-07 | 2022-12-07 | Spherical defect detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219201407U true CN219201407U (en) | 2023-06-16 |
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ID=86719052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223284401.3U Active CN219201407U (en) | 2022-12-07 | 2022-12-07 | Spherical defect detector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219201407U (en) |
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2022
- 2022-12-07 CN CN202223284401.3U patent/CN219201407U/en active Active
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