JPS60200514A - チップ形フィルムコンデンサの製造方法 - Google Patents
チップ形フィルムコンデンサの製造方法Info
- Publication number
- JPS60200514A JPS60200514A JP5599984A JP5599984A JPS60200514A JP S60200514 A JPS60200514 A JP S60200514A JP 5599984 A JP5599984 A JP 5599984A JP 5599984 A JP5599984 A JP 5599984A JP S60200514 A JPS60200514 A JP S60200514A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- film capacitor
- type film
- resin
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 66
- 238000000034 method Methods 0.000 title claims description 16
- 239000010408 film Substances 0.000 claims description 54
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 9
- 239000002390 adhesive tape Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011104 metalized film Substances 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 3
- 239000002985 plastic film Substances 0.000 claims 3
- 229920006255 plastic film Polymers 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- -1 molding Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5599984A JPS60200514A (ja) | 1984-03-26 | 1984-03-26 | チップ形フィルムコンデンサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5599984A JPS60200514A (ja) | 1984-03-26 | 1984-03-26 | チップ形フィルムコンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60200514A true JPS60200514A (ja) | 1985-10-11 |
| JPH0332907B2 JPH0332907B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-05-15 |
Family
ID=13014774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5599984A Granted JPS60200514A (ja) | 1984-03-26 | 1984-03-26 | チップ形フィルムコンデンサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60200514A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4888942U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-01-31 | 1973-10-26 | ||
| JPS58142929U (ja) * | 1982-03-19 | 1983-09-27 | 富士通株式会社 | チツプ形フイルムコンデンサ |
| JPS5933202U (ja) * | 1982-08-27 | 1984-03-01 | 株式会社指月電機製作所 | チツプ形状電子部品 |
-
1984
- 1984-03-26 JP JP5599984A patent/JPS60200514A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4888942U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-01-31 | 1973-10-26 | ||
| JPS58142929U (ja) * | 1982-03-19 | 1983-09-27 | 富士通株式会社 | チツプ形フイルムコンデンサ |
| JPS5933202U (ja) * | 1982-08-27 | 1984-03-01 | 株式会社指月電機製作所 | チツプ形状電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0332907B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-05-15 |