JPS60200412A - Method of producing electrically laminated board - Google Patents
Method of producing electrically laminated boardInfo
- Publication number
- JPS60200412A JPS60200412A JP59056906A JP5690684A JPS60200412A JP S60200412 A JPS60200412 A JP S60200412A JP 59056906 A JP59056906 A JP 59056906A JP 5690684 A JP5690684 A JP 5690684A JP S60200412 A JPS60200412 A JP S60200412A
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- prepreg
- laminate
- resin
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、電子機器等に用いられる電気用積層板に関
する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used in electronic equipment and the like.
電気用積層板をプリント配線板等に加工する場合、積層
板のパンチング性の良し悪しが得られるプリント配線板
の性能に大きな影響を与える。When an electrical laminate is processed into a printed wiring board or the like, the punchability of the laminate has a great influence on the performance of the printed wiring board.
フッ素樹脂は、本質的に熱可塑性樹脂であるので、これ
を用いた積層板は熱硬化性樹脂積層板に比べ、パンチン
グ性が優れている。Since fluororesin is essentially a thermoplastic resin, a laminate using this resin has better punching properties than a thermosetting resin laminate.
そこで、発明者は、フッ素樹脂積層板を作ることを考え
た。しかしながら、フッ素樹脂は接着性が悪（、プリプ
レグにすると樹脂量が少な（なりいっそう接着性が低下
するので、フッ素樹脂積層板は、パンチング時に眉間剥
離を起こすという問題があった。Therefore, the inventor thought of making a fluororesin laminate. However, fluororesin has poor adhesion (and when prepreg is used, the amount of resin is small), which further reduces adhesion, so fluororesin laminates have the problem of peeling between the eyebrows during punching.
この発明は、このような事情に鑑みてなされたもので、
パンチング性が良く、がっ、パンチング時に眉間剥離が
起こる恐れの少ないものを得ることのできる電気用積層
板の製法を提供することを目的としている。This invention was made in view of these circumstances,
The object of the present invention is to provide a method for producing an electrical laminate that has good punching properties and is less likely to cause peeling between the eyebrows during punching.
前記のような目的を達成するため、この発明は、フッ素
樹脂を基材に含浸させてなるプリプレグの少なくとも片
面にフッ素樹脂フィルムを熱溶着させたのち、フッ素樹
脂が基材間にはさまれるようにして所定枚のプリプレグ
を積層成形することを特徴とする電気用積層板の製法を
その要旨としている。以下に、この発明の詳細な説明す
る。In order to achieve the above object, the present invention heat-welds a fluororesin film to at least one side of a prepreg made by impregnating a base material with a fluororesin, and then heat-welds a fluororesin film to at least one side of the prepreg, and then heat-welds the prepreg so that the fluororesin is sandwiched between the base materials. The gist of this invention is a method of manufacturing an electrical laminate, which is characterized by laminating and molding a predetermined number of sheets of prepreg. The present invention will be explained in detail below.
ここで、フッ素樹脂としては、３フッ化エチレン樹脂、
４フッ化エチレン樹脂、２フツ化エチレン樹脂等が用い
られ、基祠としては、紙、ガラス布、ナイロン布、テ１
−ロン布等、無機あるいは有機繊維からなり、積層板製
造に一般に用いられるものが用いられる。Here, as the fluororesin, trifluoroethylene resin,
Tetrafluoroethylene resin, difluoroethylene resin, etc. are used, and the base materials include paper, glass cloth, nylon cloth, and tetrafluoroethylene resin.
- Materials made of inorganic or organic fibers, such as lon cloth, which are commonly used in the manufacture of laminates are used.
この発明にかかる電気用積層板の製法は、前記のような
フッ素樹脂および基材を用い、っぎのようにして実施さ
れる。まず、基材にフッ素樹脂を含浸させ、さらに、乾
燥させてプリプレグをつくる。つぎに、プリプレグの少
なくとも片面（湿潤面ないしは乾燥面）にフッ素樹脂フ
ィルムを熱溶着させて、プリプレグにフッ素樹脂層を形
成さる。フッ素樹脂フィルムの厚みは１〜１００μｍが
好ましく、１８〜７０μｍがより好ましい。１μｍ未満
では、熱溶着時に破断する恐れが多くなり、１００μｍ
を超えると積層成形時間を長くする必要が生じる傾向に
あるからである。熱溶着は、プレス成形、ガス溶射等の
方法により行われる。The method for manufacturing an electrical laminate according to the present invention is carried out as described below using the above-mentioned fluororesin and base material. First, a base material is impregnated with a fluororesin and then dried to create a prepreg. Next, a fluororesin film is thermally welded to at least one side (wet side or dry side) of the prepreg to form a fluororesin layer on the prepreg. The thickness of the fluororesin film is preferably 1 to 100 μm, more preferably 18 to 70 μm. If it is less than 1 μm, there is a high risk of breaking during thermal welding, and if it is less than 100 μm,
This is because if it exceeds 100%, it tends to be necessary to lengthen the lamination molding time. Thermal welding is performed by methods such as press molding and gas spraying.
このあと、プリプレグ間にフッ素樹脂層がはさまれるよ
うにして所定枚のプリプレグを積層成形して積層板を得
る。必要に応して、プリプレグと共に銅箔やアルミニウ
ム箔等の金属箔を重ね合わせて積層成形する場合もある
。Thereafter, a predetermined number of prepregs are laminated and molded so that a fluororesin layer is sandwiched between the prepregs to obtain a laminate. If necessary, a metal foil such as a copper foil or an aluminum foil may be laminated together with the prepreg to form a laminate.
このようにして得られた積層板は、フッ素樹脂層により
堅く樹脂含浸基材同志が接着されているので、パンチン
グ時に眉間剥離を起こす恐れが非常に少ない。樹脂とし
て本質的に熱可塑性のフッ素樹脂が用いられているので
、従来のごとき熱硬化性樹脂積層板に比しパンチング性
にすぐれている。In the thus obtained laminate, since the resin-impregnated base materials are firmly adhered to each other by the fluororesin layer, there is very little risk of peeling between the eyebrows during punching. Since fluororesin, which is essentially thermoplastic, is used as the resin, it has superior punching properties compared to conventional thermosetting resin laminates.
なお、プリプレグ間にフッ素樹脂フィルムをはさむよう
にして積層成形することにより基材間にフッ素樹脂層を
備えた積層板を得ることができる。しかし、このように
して得られる積層板は、予めプリプレグにフッ素樹脂フ
ィルムを熱溶着させていないので、基材間の接着力が不
充分である。Note that a laminate having a fluororesin layer between base materials can be obtained by laminating and molding a fluororesin film between prepregs. However, the laminate thus obtained has insufficient adhesion between the base materials because the fluororesin film is not heat-welded to the prepreg in advance.
つぎに、実施例および比較例について説明する（実施例
１）
厚み０．２ｎ＋ｍのガラス布に樹脂量が４５重量％とな
るよう４フツ化エチレン樹脂エマルジヨン溶液を含浸さ
せたあと、乾燥させてプリプレグを得た。つぎに、この
プリプレグの片面に厚み１８μｍの４フツ化エチレン樹
脂フイルムを置き、４ｏ。Next, Examples and Comparative Examples will be explained (Example 1) A glass cloth with a thickness of 0.2n+m was impregnated with a tetrafluoroethylene resin emulsion solution so that the resin amount was 45% by weight, and then dried to form a prepreg. I got it. Next, a tetrafluoroethylene resin film with a thickness of 18 μm was placed on one side of this prepreg, and 4o.
℃、３０ ｋｇ／ｃｒＡの条件で１分間加熱加圧するこ
とにより熱溶着させて、フッ素樹脂層の付いたプリプレ
グを得た。フッ素樹脂層が各プリプレグの間にはさまれ
るようにして６枚のプリプレグを重ね合わせ、さらに、
厚み３５μｍの接着剤層付銅箔を接着剤層が内側になる
ようにして６枚のプリプレグの表裏に重ね合わせて積層
体とした。この積層体を４００℃、６０ｋｇ／ｃｏｔの
条件で１５分間加圧して成形することにより金属箔張フ
ッ素樹脂積層板を得た。The prepreg with the fluororesin layer was obtained by heat welding by heating and pressurizing for 1 minute at 30 kg/crA at 30°C. Six prepregs are stacked so that the fluororesin layer is sandwiched between each prepreg, and further,
Copper foil with an adhesive layer having a thickness of 35 μm was laminated on the front and back sides of six sheets of prepreg with the adhesive layer facing inside to form a laminate. This laminate was molded under pressure at 400° C. and 60 kg/cot for 15 minutes to obtain a metal foil-clad fluororesin laminate.
（実施例２）
ガス溶射により、プリプレグの片面に４フツ化エチレン
樹脂フイルムを熱溶着させてフッ素樹脂層を設けるよう
にしたほかは、実施例１と同じようにして、金属箔張フ
ッ素樹脂積層板を得た。(Example 2) A metal foil-clad fluororesin laminate was prepared in the same manner as in Example 1, except that a fluororesin layer was provided by thermally welding a tetrafluoroethylene resin film to one side of the prepreg by gas spraying. Got the board.
（比較例）
４フツ化エチレン樹脂フイルムを用いてプリプレグにフ
ッ素樹脂層を設けるようにしなかったほかは実施例１と
同じようにして、金属箔張フッ素樹脂積層板を得た。(Comparative Example) A metal foil-clad fluororesin laminate was obtained in the same manner as in Example 1, except that a fluororesin layer was not provided on the prepreg using a tetrafluoroethylene resin film.
実施例１．２および比較例のフッ素樹脂積層板のパンチ
ング加工を行い層間剥離の発生の有無を調べた。また、
當態および吸湿処理後の電気絶縁抵抗を調べた。いずれ
もパンチング性が良かった。ただし、吸湿処理として、
２時間の１００℃煮沸水中処理を行った。The fluororesin laminates of Example 1.2 and Comparative Example were punched to examine whether or not delamination occurred. Also,
The electrical insulation resistance in its natural state and after moisture absorption treatment was investigated. All had good punching properties. However, as a moisture absorption treatment,
Treatment was performed in boiling water at 100°C for 2 hours.
結果を第１表に示す。The results are shown in Table 1.
（以 下 余 白）
第 １ 表
第１表より、実施例１および２の積層板は比較例のもの
に比べて層間剥離の発生ずる恐れが少なく、そのうえ、
電気絶縁抵抗も優れていることがわかる。(Margins below) Table 1 From Table 1, the laminates of Examples 1 and 2 have less risk of delamination occurring than those of the comparative examples, and, in addition,
It can be seen that the electrical insulation resistance is also excellent.
この発明にかかる電気用積層板の製法は、フッ素樹脂を
基材に含浸させてなるプリプレグの少なくとも片面にフ
ッ素樹脂フィルムを熱溶着させたのち、フッ素樹脂が基
相聞にはさまれるようにして所定枚のプリプレグを積層
成形するので、パンチング性が良く、かつ、パンチング
時に眉間剥離が起こる恐れが少ない電気用積層板を得る
ことができる。The method for manufacturing an electrical laminate according to the present invention is to thermally weld a fluororesin film to at least one side of a prepreg made by impregnating a base material with a fluororesin, and then to place the fluororesin in a predetermined manner so that the fluororesin is sandwiched between the base layers. Since the sheets of prepreg are laminated and molded, it is possible to obtain an electrical laminate that has good punching properties and is less likely to cause peeling between the eyebrows during punching.
代理人 弁理士 松 本 武 彦Agent: Patent Attorney Takehiko Matsumoto
Claims (2)
の少なくとも片面にフッ素樹脂フィルムを熱溶着させた
のら、フッ素樹脂が基材間にはさまれるようにして所定
枚のプリプレグを積層成形することを特徴とする電気用
積層板の製法。(1) After heat-welding a fluororesin film to at least one side of a prepreg made by impregnating a base material with a fluororesin, a predetermined number of sheets of prepreg are laminated and molded so that the fluororesin is sandwiched between the base materials. A method for producing electrical laminates characterized by:
のものである特許請求の範囲第１項記載の電気用積層板
の製法。(2) The fluororesin film has a thickness of 1 to 100 μm
A method for producing an electrical laminate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59056906A JPS60200412A (en) | 1984-03-24 | 1984-03-24 | Method of producing electrically laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59056906A JPS60200412A (en) | 1984-03-24 | 1984-03-24 | Method of producing electrically laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60200412A true JPS60200412A (en) | 1985-10-09 |
Family
ID=13040490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59056906A Pending JPS60200412A (en) | 1984-03-24 | 1984-03-24 | Method of producing electrically laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60200412A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62140843A (en) * | 1985-12-14 | 1987-06-24 | タキロン株式会社 | Manufacture of vinylidene fluoride resin composite board |
-
1984
- 1984-03-24 JP JP59056906A patent/JPS60200412A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62140843A (en) * | 1985-12-14 | 1987-06-24 | タキロン株式会社 | Manufacture of vinylidene fluoride resin composite board |
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