JPS60198895A - Method of producing multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

(Field of Industrial Application) The invention relates to a method for manufacturing multilayer printed wiring boards. (Prior art) One double-sided VC wiring pattern is applied to a multilayer printed wiring board by laminating and pressing a double-sided board and a prepreg with each other in the same manner as shown in, for example, 14977. Enclose, chemical copper plating and electric layer copper plating are applied to the entire surface, and the uneasy copper layer is etched to the layer ◇This 7J1F: Now, wiring on both sides Since a single pattern board is used, the unevenness of the inner layer circuit pattern prevents the air between the removed patterns connected to the multi-layered prepreg from being removed, resulting in contact layer voids. As a solution to this problem, JP-A-52-111
There is a n/b sword method proposed in the 66C1r publication.
Activation treatment of insulating base material 1 as shown in the figure

[Act (a),
Form a photosensitive resin 2 of the same type as the base material 1 or prepreg.b) Expose and develop to leave a luminous resin 5 in the reverse pattern of the inner no circuit.C) Perform 4-electrode electroless plating.(d) Use % pregreg. Te Makihato contact j;ij? 1 - Manufacture multilayer printed wiring board R6 (eJ) However, in this method, the activation process is performed immediately.Since the photosensitive @I) h2 is formed in the reverse pattern of the inner layer circuit, If the activator (M medium) remains in the pattern between the base material and the photosensitive resin in the opposite pattern, the loquat resistance becomes a problem. ＠Sacrilege [Since it is a lot of things to do, one large manufactured robe is safe and there is a limit to cost reduction. (Object of the Invention) The present invention has been devised in view of the above points, and provides a method for manufacturing a multi-no printed scarlet board that passes through a commercial pattern. (Structure of the Invention) Invention A is a method for manufacturing a multilayer printed wiring machine including the following steps. A, Catalyst V loquat is shaped b5c with 9 eyebrows added to the board. B. Forming 11L841 plating resist without using OC0 disinfectant J-τ roughening. D. Immerse in electroless plating, resist is formed, iLn-M is coated with black kame place OE, the whole surface is covered with non-glare resist and the resist is formed. Permanent resist 13 songs. F.Apply catalyst-containing V-coat to the entire coating area.OG, Roughen the coating agent shield. 1. Through-hole opening Oo J, Electroless drilling @ Immersion into the target, electroless drilling τ for images where no resist is formed O Below, the present invention will be explained based on Fig. 2. 0 palladium, white whistle% copper, etc. No - against copper decomposition /) Catalyst is mixed n trap result shield 5 11V this time mediator attack IJ + 2 >, (coated 7 boards τ preparation (aJ, printed on this thing, water-filled plating mask + 3'
j-heart. This resist is applied to the electroless steel plate (b). Electroless steel plating 14 is applied to the ridges where resist 16 is not formed. Since the surface is rough, it has excellent flexibility in multi-layering, and the uniform thickness allows the inner layer circuit thickness to be set boldly.Also, the resist surface and circuit surface are simple, and the thickness is one plane between the resist surface and the circuit surface. , Improve D'v, make it easy 91 Furthermore, since it is addictive to z L/'1 simple/i of the through hole, there are few copper filling, plating voids, and plating appears at each station ◎ Next, there is nothing on the entire surface. Electrolytic steel plating resist and permanent resist) 15r! to clothe Since the resist 16 and the Ic'J layer are coated with τ, the problem of the V layer not being printed is eliminated. Since the resist 13 surface curve and the roughness of the circuit surface are on the same plane,
This permanent resist) 1bH, coating case without press rJ, hot roll, etc. 〇 Next, apply the catalyst-containing dependent agent 16i, etc. It can be formed by a method that does not require a large press such as. Perform roughening τ using the cursive process lK (f ㇠ji λ t 17τ formation g), and open through hole 18. It is opened with a punch.The shape of the punch hole is complicated and plating voids are likely to occur in the holes of electroplating, but IL-free copper plating @σtsu@”
It has the advantages of good TV resistance, low cost, and no smear treatment. You can also drill through holes.Next, crush it in electroless steel plating solution to form a resist.
There is no through-hole, and there is no hole around it.
Although we have shown the lifting of 4 layers of 0 or more to be carried out at 19τ, 6 layers and 5 or more layers are also manufactured 5J rudders. (Effects of the Invention) The following effects cannot be achieved due to the above-mentioned lack of explanation. (1) Since the catalyst is not contaminated on the surface of the insulating substrate. 〇(2) Pressing is not required, so the cost can be reduced. (6) Loquat acupuncture τgane friendly care ``noso'' [It is possible to achieve the thickness of laxity, so impedance control is easy0

[Brief explanation of the drawing]

Figure 1 is a top view of the rice promotion method, and Figure 2 is a top view of the method of the present invention. Containing dust shielding agent 16, resist 14, non-copper plating 15, permanent resist 16, contact 4 south person!Fuction connection-'me award 17, resist 1a through hole 19, electroless copper plating agent Figure 1] Continuing from page 1 ■ Inventor Nobuo Uozu 41 Kugeta, Ninomiya-cho, Haga-gun, Tochigi Hitachi Capacitor Co., Ltd.

Claims (1)

[Claims] 1. A method for manufacturing a multilayer printed wiring board comprising the following 151a. A, P! Ji sister person V loquat base insulation anal enters the ship shield Hari brutality is formed. B. OC-Kidun Sosaku τ forming electroless plating resist
Become an ancestor. Add 6 to D-Kun'Metsuna and the resist is formed 2
' Perform electroless plating τ in l1Il. E21st side V Kon'ya, the permanent resist of the negative and the negative permanent resist, and the catalytic person in the coat, the rotten A is fallen. i11 Reno So? =I↓L should be changed to 10L Electroless Messa Regis Ir type kite Sui. ■Through-hole kklJ. J. During electroless plating, perform plating on B+V without resist formation. M4#Tre4(/JII-1;1111+i3=w,k
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