JPS60198741A - 断線検出機能を有したワイヤボンダ - Google Patents

断線検出機能を有したワイヤボンダ

Info

Publication number
JPS60198741A
JPS60198741A JP59054288A JP5428884A JPS60198741A JP S60198741 A JPS60198741 A JP S60198741A JP 59054288 A JP59054288 A JP 59054288A JP 5428884 A JP5428884 A JP 5428884A JP S60198741 A JPS60198741 A JP S60198741A
Authority
JP
Japan
Prior art keywords
discharge
wire
coupler
photo
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59054288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0444420B2 (https=
Inventor
Nobuhiro Takasugi
高杉　信博
Yasushi Ishii
康 石井
Isamu Yamazaki
勇 山崎
Ryuichi Kyomasu
隆一 京増
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP59054288A priority Critical patent/JPS60198741A/ja
Publication of JPS60198741A publication Critical patent/JPS60198741A/ja
Publication of JPH0444420B2 publication Critical patent/JPH0444420B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP59054288A 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ Granted JPS60198741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59054288A JPS60198741A (ja) 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59054288A JPS60198741A (ja) 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ

Publications (2)

Publication Number Publication Date
JPS60198741A true JPS60198741A (ja) 1985-10-08
JPH0444420B2 JPH0444420B2 (https=) 1992-07-21

Family

ID=12966374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59054288A Granted JPS60198741A (ja) 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS60198741A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412544A (ja) * 1990-05-02 1992-01-17 Kaijo Corp 半導体組立装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412544A (ja) * 1990-05-02 1992-01-17 Kaijo Corp 半導体組立装置

Also Published As

Publication number Publication date
JPH0444420B2 (https=) 1992-07-21

Similar Documents

Publication Publication Date Title
JPS6338549B2 (https=)
US9419523B2 (en) Method for identifying a short-line fault or a line interruption for a switched inductive load
US7138804B2 (en) Automatic transmission line pulse system
CN106990344B (zh) 监测装置和监测方法
US5381105A (en) Method of testing a semiconductor device having a first circuit electrically isolated from a second circuit
US5646434A (en) Semiconductor component with protective structure for protecting against electrostatic discharge
JP2013257177A (ja) 半導体試験装置
US4802054A (en) Input protection for an integrated circuit
JPH08503333A (ja) 地絡検出器付き安定回路
JPS60198741A (ja) 断線検出機能を有したワイヤボンダ
US5910873A (en) Field oxide transistor based feedback circuit for electrical overstress protection
JPH08205516A (ja) 電子回路
JPS62267080A (ja) プラズマト−チしや断回路
CN115177036A (zh) 咪头电路的漏油检测方法、咪头电路、咪头及电子产品
JP3335043B2 (ja) 半導体デバイスの状態判定方法及び状態判定装置
US9648420B2 (en) Rectifier circuit for monitoring dc offset of a single-supply audio power amplifier
CN115666998A (zh) 用于检测车辆车载电网中的绝缘故障的方法
JP4336573B2 (ja) 高電圧パルス発生回路
JPS6149433A (ja) ワイヤボンデイングにおけるボ−ル形成不良検出方法
JP3908640B2 (ja) ワイヤボンディング方法及び装置
KR20000069907A (ko) 강제동작기능 부착의 제어장치 및 반도체 집적회로장치
JPH06289942A (ja) 定電流源の保護回路
JPH0422886A (ja) 半導体入出力回路
JPH0253106B2 (https=)
JPH0734622B2 (ja) インバータの接地保護装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term