JPH0444420B2 - - Google Patents

Info

Publication number
JPH0444420B2
JPH0444420B2 JP59054288A JP5428884A JPH0444420B2 JP H0444420 B2 JPH0444420 B2 JP H0444420B2 JP 59054288 A JP59054288 A JP 59054288A JP 5428884 A JP5428884 A JP 5428884A JP H0444420 B2 JPH0444420 B2 JP H0444420B2
Authority
JP
Japan
Prior art keywords
wire
discharge
potential
circuit
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59054288A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60198741A (ja
Inventor
Nobuhiro Takasugi
Yasushi Ishii
Isamu Yamazaki
Ryuichi Kyomasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP59054288A priority Critical patent/JPS60198741A/ja
Publication of JPS60198741A publication Critical patent/JPS60198741A/ja
Publication of JPH0444420B2 publication Critical patent/JPH0444420B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP59054288A 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ Granted JPS60198741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59054288A JPS60198741A (ja) 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59054288A JPS60198741A (ja) 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ

Publications (2)

Publication Number Publication Date
JPS60198741A JPS60198741A (ja) 1985-10-08
JPH0444420B2 true JPH0444420B2 (https=) 1992-07-21

Family

ID=12966374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59054288A Granted JPS60198741A (ja) 1984-03-23 1984-03-23 断線検出機能を有したワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS60198741A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627968B2 (ja) * 1990-05-02 1997-07-09 株式会社カイジョー 半導体組立装置

Also Published As

Publication number Publication date
JPS60198741A (ja) 1985-10-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term