JPS60196994A - Connecting system for circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Description of the Field to which the Invention Pertains] The present invention provides a method for connecting the electrode lead of a transistor to a substrate of a microwave integrated circuit (hereinafter referred to as MIC). The present invention relates to a connection method that satisfactorily absorbs mechanical stress due to thermal strain applied to the connection portion between an electrode lead and the substrate, thereby achieving stability and long life of a transistor circuit.

[Description of conventional technology]

This type of conventional connection method is used for high frequency circuits (LOOM Iz
(amplifiers, multipliers, etc.). That is, in order to improve the compatibility between the transistor and the input/output circuit, it is usually necessary to make the electrode leads of the transistor as short as possible, and the connection method shown in Figure 1 or Figure 2 is usually adopted. It is being

FIG. 1 is an example of the simplest connection method conventionally used. The figure (cL) is a top view of the connecting portion between the transistor 6 and the MIC substrates 2 and 3, and the figure (II) is a side view thereof. In this connection method, MIC boards 2 and 3
and the transistor 6 are mechanically fixed to the housing 1, and the electrode leads 7 and 8 of the transistors are directly connected to the film circuit patterns 4 and 5 formed on the MIC substrates 2 and 3 by means such as soldering. ing. In this method, the ends of the electrode leads 7 and 8 are mechanically fixed, resulting in the following drawbacks.

That is, when temperature stress is applied to the entire transistor circuit, mechanical strain is applied to the fixed portions of the electrode leads 7 and 8 due to the difference in average coefficient of thermal expansion between the housing 1 and the electrode leads 7 and 8. If this temperature stress occurs cyclically multiple times, this mechanical strain results in cumulative fatigue, which ultimately causes failure of the transistor circuit (such as cracks in the connection portion).

Figures 2 (α) and (b) show U-shaped stress reliefs 7α, 8 on the electrode leads 7 and 8 in order to improve the above drawbacks.
a.

However, this stress relief 70
L and 8 cL make the electrode lead long, which often makes it difficult to match the input and output of the transistor, and in particular, in the case of a circuit that handles frequencies of gigahertz or higher, matching may not be achieved.

[Object of the Invention] The present invention solves the above-mentioned problems, and by indirectly connecting the ends of the electrode leads, etc. of a transistor to the film circuit pattern, etc., it is possible to absorb thermal stress occurring in the electrode leads, etc. The object of the present invention is to provide a circuit connection method that achieves this.

[Structure of the invention]

The present invention provides a system for electrically connecting terminals, component leads, etc. that are mechanically fixedly installed, with mechanical rigidity to the extent that the terminals, component leads, etc. deform due to thermal stress generated in the terminals, component leads, etc. (Young's modulus) and at least a sufficiently low surface resistivity is interposed between electrically connected terminals, component leads, etc., and the ends of the terminals, component leads, etc. This is a circuit connection method characterized in that a section is connected to the connection piece.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

Figures 3 (α) and (b) are examples of the present invention, and numbers 1 to 8 are Figure 1 (α), (b) and Figure 2 (α).
, The components are the same as those described in (b). Further, 9 and 10 are connecting pieces for absorbing thermal stress. The connecting pieces 9 and IO are soldered to the ends of the membrane circuit patterns 4 and 5 and the ends of the electrode leads 7 and 8. This connection piece connects a material (e.g. epoxy resin) with a smaller value than the mechanical stiffness (Young's modulus) of a gold FfS 4'A material such as aluminum or a porcelain material such as ceramic to a desired size (e.g. 4'
x 2
．． 8 is deformed by the thermal stress generated on the surface, and at least the specific resistance of its surface is made sufficiently low to provide electrical conductivity.

In the connection method having the above structure, the thermal stress generated in the electrode lead portion due to the above-mentioned temperature stress can be completely absorbed by the connection pieces 9 and 10, and at the same time,
This solves the drawback of poor matching as a transistor circuit, as seen in the conventional embodiments shown in FIGS. 2(α) and 2(b). In addition, since the connection piece can be attached at the same time as other parts on the MIC board, the positioning accuracy of the connection piece is increased, which has the advantage of improving the yield during circuit adjustment. (Figure 2) (α), (b)
With this method, it takes time and effort to process a U-shaped lead with high precision.

4(G) and (b) show another embodiment "c" in which the present invention is used to connect the center conductor (terminal) 12 of the connector 11 and the membrane circuit pattern 4. In this embodiment, However, the thermal stress generated in the center conductor 12 of the connector 11 can be absorbed by deforming the connecting piece 9.

[Detailed description of the invention]

As explained above, according to the present invention, it is possible to prevent cracks in the connection part due to thermal stress with a simple structure without providing stress relief to the electrode leads of the transistor or the center conductor of the connector, etc. It is.

Note that these examples show typical application examples and are not limited to these examples.

[Brief explanation of the drawing]

Figures 1 (a) and 2 (α) are top views of conventional connection systems, Figures 1 (b) and 2 (b) are side views, and Figures 3 (a,
), FIG. 4(α) is a top view showing an embodiment of the present invention, and FIG.
Figures (6) and 4(b) are side views. In the figure, 1 is a housing, 2 and 3 are ceramic substrates, 4 and 5 are film circuit patterns, 6 is a transistor, 7 and 8 are transistor electrode leads, 9 and 10 are connection pieces, and 11
is the connector, and 12 is inside the connector. It is a heart conductor. Patent Applicant NEC Corporation Figure 1 <a) Figure 2 (α) Figure 3 (α9

Claims (1)

[Claims] (1) In a method for electrically connecting mechanically fixed terminals, component leads, etc., the terminals,
Electrically connect a conductive connection piece that is made of a material that has enough mechanical rigidity (Young's modulus) to deform in response to thermal stress generated in component leads, etc., and that has at least a sufficiently low surface resistivity. A circuit connection method characterized in that the circuit is interposed between terminals, component leads, etc., and the ends of the terminals, component leads, etc. are connected to the connection piece.