JP2518053B2 - Mounting structure of electronic parts on printed wiring board - Google Patents
Mounting structure of electronic parts on printed wiring boardInfo
- Publication number
- JP2518053B2 JP2518053B2 JP1189772A JP18977289A JP2518053B2 JP 2518053 B2 JP2518053 B2 JP 2518053B2 JP 1189772 A JP1189772 A JP 1189772A JP 18977289 A JP18977289 A JP 18977289A JP 2518053 B2 JP2518053 B2 JP 2518053B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- land
- electronic component
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は印刷配線板への電子部品の実装構造に関す
るものである。TECHNICAL FIELD The present invention relates to a mounting structure of electronic components on a printed wiring board.
［従来の技術］ 従来の印刷配線板への電子部品の実装構造を第４図に
示す。[Prior Art] FIG. 4 shows a conventional mounting structure of electronic components on a printed wiring board.
同図において、１は半導体チップを搭載した電子部品
としての半導体パッケージ、２は印刷配線板、３は半導
体パッケージ１の下面1aより下方（印刷配線板２方向）
の突出し、半導体チップからの信号を印刷配線板２のラ
ンドに導くリード、４は印刷配線板２に形成されたラン
ド、５はリード３の先端3aとランド４とを接合するハン
ダである。In the figure, 1 is a semiconductor package as an electronic component on which a semiconductor chip is mounted, 2 is a printed wiring board, 3 is below the lower surface 1a of the semiconductor package 1 (in the direction of the printed wiring board 2).
, Leads 4 for guiding signals from the semiconductor chip to the lands of the printed wiring board 2, 4 is a land formed on the printed wiring board 2, and 5 is a solder for joining the tip 3a of the lead 3 and the land 4.
上記半導体パッケージ１のリード３の先端3aをハンダ
５でランド４に接合することにより、半導体パッケージ
１は印刷配線板２に対して電気的，機械的に取付けられ
ることになる。尚、上記ハンダ付けにはリフロー法等の
技術が用いられている。また、従来の他の実装構造とし
ては、特開昭64−24434号公報に記載のように半導体素
子とプリント基板との間に舌片を配設し、はんだバンプ
が引き延ばされるようにはんだ付けがされていた。By joining the tips 3 a of the leads 3 of the semiconductor package 1 to the lands 4 with the solder 5, the semiconductor package 1 is electrically and mechanically attached to the printed wiring board 2. A technique such as a reflow method is used for the soldering. Further, as another conventional mounting structure, as described in JP-A-64-24434, a tongue piece is arranged between a semiconductor element and a printed circuit board, and soldering is performed so that solder bumps are extended. It was being done.
［発明が解決しようとする課題］ しかしながら、上記従来の印刷配線板への電子部品の
実装構造によれば、半導体パッケージ１と印刷配線板２
との間で熱膨張係数の差によって発生するハンダ接合部
の歪みを吸収するためリード３を多重構造に設計しなけ
ればならなかったり、また、ハンダ付け技術において
も、半導体パッケージ１の中心部のリード３とランド４
とのハンダ接合を良好に行うためには高精度の温度コン
トロールが必要である等の問題点があった。また、舌片
を用いた実装構造としても、はんダ接合部の剪断歪みの
発生は低減されるが、はんだ接合を行なうための高精度
の温度コントロールは必要であるといった問題点があっ
た。[Problems to be Solved by the Invention] However, according to the conventional mounting structure of the electronic component on the printed wiring board, the semiconductor package 1 and the printed wiring board 2 are mounted.
In order to absorb the distortion of the solder joint portion caused by the difference in the thermal expansion coefficient between the lead 3 and the lead 3, the lead 3 must be designed in a multiple structure. Lead 3 and land 4
However, there is a problem that high-precision temperature control is necessary to perform good solder joint with Further, even with the mounting structure using the tongue piece, the occurrence of shear strain in the solder joint is reduced, but there is a problem that highly accurate temperature control is required for soldering.
この発明は、上記のような問題点を解消するためにな
されたもので、電子部品の実装を、精度良くかつ容易に
行える印刷配線板への電子部品の実装構造を得ることを
目的としている。The present invention has been made in order to solve the above problems, and an object thereof is to obtain a mounting structure of an electronic component on a printed wiring board, which allows the electronic component to be mounted accurately and easily.
［課題を解決するための手段］ この発明における印刷配線板への電子部品の実装構造
は、電子部品と印刷配線板のランドとの間に弾性を有す
る導電材を介在させ、この導電材を介して電子部品の信
号をランドに導くとともに、上記電子部品から印刷配線
板方向に突出させた複数の取付け片の先端を印刷配線板
に固定し、この取付け片を、常温で屈曲状態となり、常
温以外で直線状態となる形状記憶合金により形成してい
る。[Means for Solving the Problems] In the mounting structure of an electronic component on a printed wiring board according to the present invention, an elastic conductive material is interposed between the electronic component and the land of the printed wiring board, and the conductive material is interposed therebetween. The signal of the electronic component to the land, and fix the tips of the mounting pieces protruding from the electronic component in the printed wiring board direction to the printed wiring board. It is made of a shape memory alloy that is in a straight line.
［作用］ 形状記憶合金で形成される取付け片を、常温以外では
直線形状に、常温においては屈曲するよう形状を記憶さ
せておく。そして、まず常温以外の環境で電子部品のリ
ードの先端をランドに対向させた状態で、取付け片をラ
ンドにハンダ付けする。この状態で常温になると、取付
け片が、記憶している形状に屈曲することにより、リー
ドの先端とランドが圧接し、電子部品は印刷配線板に電
気的に接続される。[Operation] The attachment piece formed of the shape memory alloy is memorized in a linear shape at a temperature other than room temperature and in a shape to be bent at room temperature. Then, first, the mounting piece is soldered to the land in a state other than room temperature with the tip of the lead of the electronic component facing the land. When the temperature reaches room temperature in this state, the mounting piece bends into a memorized shape, and the tip of the lead and the land come into pressure contact, and the electronic component is electrically connected to the printed wiring board.
［発明の実施例］ 以下、この発明の一実施例を第１図及び第２図に基づ
いて説明する。尚、第４図の従来例と同一部分は同一符
号を付してその説明を省略する。[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. The same parts as those in the conventional example shown in FIG. 4 are designated by the same reference numerals and the description thereof will be omitted.
各図において、11は本発明における半導体チップを搭
載した電子部品としての半導体パッケージ、12は半導体
パッケージ11の下面11aより下方（印刷配線板２方向）
に突出し、半導体チップの信号をランド４に導く導電性
ゴムより成るリード、13は半導体パッケージ11の下面11
aの４隅より下方（印刷配線板２方向）に突出した形状
記憶合金より成るリードを兼ねる取付け片で、これは常
温以外では第１図に示すような直線形状で、常温になる
と第２図に示すような“く”の字形状になるように形状
を記憶させたものである。尚、上記リード12の長さは、
常温以外時の取付け片13の長さH1よりも短く、常温時の
取付け片13の長さH2より若干長く設定されている。In each figure, 11 is a semiconductor package as an electronic component on which the semiconductor chip according to the present invention is mounted, and 12 is lower than the lower surface 11a of the semiconductor package 11 (in the printed wiring board 2 direction).
A lead made of conductive rubber that projects to the land and guides the signal of the semiconductor chip to the land 4, and 13 is the lower surface 11 of the semiconductor package 11.
It is a mounting piece that also serves as a lead and is made of a shape memory alloy that protrudes below the four corners of a (in the direction of the printed wiring board 2). It has a linear shape as shown in FIG. The shape is memorized so that the shape becomes a V shape as shown in FIG. The length of the lead 12 is
It is set to be shorter than the length H1 of the mounting piece 13 at times other than room temperature and slightly longer than the length H2 of the mounting piece 13 at room temperature.
上記構成により、先ず常温以外の環境において半導体
パッケージ11のリード12の先端12aをランド４に対向さ
せた状態で、取付け片13の先端13a側を所定のランド４
にハンダ付けする。この状態で常温になると取付け片13
が、第２図に示すように、記憶している“く”の字形状
に屈曲してリード12の先端12aとランド４が圧接し、電
気的に接続されることになる。With the above-described structure, first, the tip 12a of the lead 12 of the semiconductor package 11 is made to face the land 4 in an environment other than room temperature, and the tip 13a side of the mounting piece 13 is placed on the predetermined land 4.
Solder to. When the temperature reaches room temperature in this state, the mounting piece 13
However, as shown in FIG. 2, the tip 12a of the lead 12 and the land 4 are pressed into contact with each other by bending in a memorized "V" shape to be electrically connected.
本実施例によれば、取付け片13をランド４にハンダ付
けするだけで容易に半導体パッケージ11を印刷配線板２
に実装することができる。また、取付け片13とランド４
とのハンダ接合部において、常温時に取付け片13が
“く”の字形状に屈曲することにより、この“く”の字
形状部分Ａで半導体パッケージ11と印刷配線板２との間
の熱膨張係数の差による歪みを吸収するので、ハンダ接
合部には歪みが生じず、精度良い実装が行える。According to this embodiment, the semiconductor package 11 can be easily mounted on the printed wiring board 2 simply by soldering the mounting pieces 13 to the lands 4.
Can be implemented in. Also, the mounting piece 13 and the land 4
Since the mounting piece 13 is bent in a "V" shape at the solder joint portion with the normal temperature, the thermal expansion coefficient between the semiconductor package 11 and the printed wiring board 2 is increased in the "A" shape portion A. Since the distortion due to the difference is absorbed, the distortion does not occur in the solder joint portion and the mounting can be performed with high accuracy.
尚、上記実施例によれば、リード12の１本１本を導電
性ゴムより形成したが、異方導電性ゴム、すなわち第３
図に示す如く、一枚の導電性ゴムに導電粉末を添加し、
半導体パッケージ11の端子15からランド４方向に延長す
る導電層Ｓを設けて成る異方導電性ゴムシート14を使用
して全信号をシート１枚で接続しても良い。According to the above-mentioned embodiment, each of the leads 12 is made of the conductive rubber, but the anisotropic conductive rubber, that is, the third conductive rubber is used.
As shown in the figure, add conductive powder to one conductive rubber,
All signals may be connected by one sheet using the anisotropic conductive rubber sheet 14 provided with the conductive layer S extending from the terminal 15 of the semiconductor package 11 toward the land 4.
また、リード12は導電性ゴムではなく、リン青銅等の
バネ性を有する形状の金属リードでもよい。The lead 12 may be a metal lead having a spring property such as phosphor bronze, instead of the conductive rubber.
また、取付け片13はリードを兼ねるものでなく、固定
専用とし、ハンダでなく接着剤で固着させてもよい。Further, the mounting piece 13 does not also serve as a lead, but may be dedicated for fixing and fixed by an adhesive instead of solder.
また、リード12を導電性ゴムで形成したが、これを普
通の導電材で形成し、ランド４上に導電性ゴムを取付け
ておくようにしてもよい。Although the lead 12 is made of conductive rubber, it may be made of an ordinary conductive material and the conductive rubber may be attached on the land 4.
また、上記実施例では取付け片13を半導体パッケージ
11の下面11aの４隅に設けたが、下面11aの周辺部より数
本設けるようにしても良い。Further, in the above embodiment, the mounting piece 13 is the semiconductor package.
Although it is provided at the four corners of the lower surface 11a of 11, the number may be several from the peripheral portion of the lower surface 11a.
［発明の効果］ 以上説明したように、この発明における印刷配線板へ
の電子部品の実装構造によれば、電子部品と印刷配線板
のランドとの間に弾性を有する導電材を介在させ、この
導電材を介して電子部品の信号をランドに導くととも
に、上記電子部品から印刷配線板方向に突出させた複数
の取付け片の先端を印刷配線板に固定し、この取付け片
を、常温で屈曲状態となり、常温以外で直線状態となる
形状記憶合金により形成したので、電子部品の実装を、
精度良くかつ容易に行える。As described above, according to the mounting structure of the electronic component on the printed wiring board of the present invention, the conductive material having elasticity is interposed between the electronic component and the land of the printed wiring board. The signal of the electronic component is guided to the land through the conductive material, and the tips of a plurality of mounting pieces protruding from the electronic component in the printed wiring board direction are fixed to the printed wiring board, and the mounting pieces are bent at room temperature. Since it is made of a shape memory alloy that is in a linear state at other than room temperature, mounting of electronic parts
It can be done accurately and easily.
第１図乃至第２図は本発明の印刷配線板への電子部品の
実装構造の一実施例を示す説明図、第３図は本発明の他
の実施例を示す図、第４図は従来の印刷配線板への電子
部品の実装構造の一例を示す図である。 ２……印刷配線板、４……ランド、11……半導体パッケ
ージ（電子部品）、12……導電性ゴム（弾性を有する導
電材）より成るリード、13……形状記憶合金より成るコ
ードを兼ねる取付け片（取付け片）。1 and 2 are explanatory views showing an embodiment of a mounting structure of electronic parts on a printed wiring board according to the present invention, FIG. 3 is a view showing another embodiment of the present invention, and FIG. It is a figure which shows an example of the mounting structure of the electronic component on the printed wiring board of FIG. 2 ... Printed wiring board, 4 ... Land, 11 ... Semiconductor package (electronic component), 12 ... Lead made of conductive rubber (conductive material having elasticity), and 13 ... Code made of shape memory alloy Mounting piece (mounting piece).
Claims (1)
性を有する導電材を介在させ、この導電材を介して電子
部品の信号をランドに導くとともに、上記電子部品から
印刷配線板方向に突出させた複数の取付け片の先端を印
刷配線板に固定し、この取付け片を、常温で屈曲状態と
なり、常温以外で直線状態となる形状記憶合金により形
成したことを特徴とする印刷配線板への電子部品の実装
構造。1. A conductive material having elasticity is interposed between an electronic component and a land of a printed wiring board, a signal of the electronic component is guided to the land through the conductive material, and a direction of the printed wiring board is directed from the electronic component. The printed wiring board is characterized in that the tips of a plurality of mounting pieces that are protruded in the direction are fixed to the printed wiring board, and that the mounting pieces are made of a shape memory alloy that bends at room temperature and becomes linear at temperatures other than room temperature. Mounting structure of electronic parts on the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1189772A JP2518053B2 (en) | 1989-07-21 | 1989-07-21 | Mounting structure of electronic parts on printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1189772A JP2518053B2 (en) | 1989-07-21 | 1989-07-21 | Mounting structure of electronic parts on printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0354899A JPH0354899A (en) | 1991-03-08 |
| JP2518053B2 true JP2518053B2 (en) | 1996-07-24 |
Family
ID=16246936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1189772A Expired - Lifetime JP2518053B2 (en) | 1989-07-21 | 1989-07-21 | Mounting structure of electronic parts on printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2518053B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3013682B2 (en) * | 1993-12-28 | 2000-02-28 | 日本電気株式会社 | Solder bump and connection structure and method for electronic component using the same |
-
1989
- 1989-07-21 JP JP1189772A patent/JP2518053B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354899A (en) | 1991-03-08 |
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