JPS60195465A - Characteristic inspecting device and characteristic inspecting method - Google Patents

Abstract

PURPOSE:To execute a measurement of a large quantity and a high accuracy at a low cost by supporting plural electronic parts by a lead frame, pressing it against a jig body provided with a contact terminal, and executing the measurement simultaneously in a lump. CONSTITUTION:In a characteristic inspecting device consisting of a measuring part 1 and a tester 2 for analyzing and processing a signal, the measuring part 1 consists of a jig body 3, a lead frame 4 placed on the main face of the jig body 3, and a frame holder 5 for pressing the frame 4 against the jig body 3. Also, this device is constituted by providing a hanging lead 8 which extends to the inside from a longitudinal frame 7 and supports plural ICs 9, on the frame 4, incorporating a socket 17 having a contact terminal 16 of a reed 14 of the IC9, in the jig body 3, and connecting it to the tester 2 through a coaxial cable 18. In such a way, a positioning can be executed with a high dimension accuracy, and a measurement of a large quantity and a high accuracy can be executed simultaneously.

Description

[Detailed description of the invention] 〔Technical field] The present invention relates to a characteristic testing system for electronic components [K].

[Background technology]

Inspection of the characteristics of electronic components such as semiconductor devices and ICs (integrated circuit devices) is carried out by, for example, testing the characteristics of electronic components such as semiconductor devices and ICs (integrated circuit devices) by suspending tabs 11 - from the frame of the lead 71 norm in the case of resin packaged ICs.
By cutting the C and T('single item and 1 ~, this [C single item, e.g., Electronic Materials, 1983).

Separate issue, 177-1s 7 Negative (Random logic tester, linear IC tester)
It is carried out in +M+ using a socket as shown in 2006, July issue, 27-30 Tei (Socket).

By the way, in recent years, as semiconductor devices have become smaller and smaller, the pitch between leads of TC has been reduced.
.

It has become clear to the inventors that problems occur in the percentage testing technique for the following reasons.

In other words, the problem with the smaller, lighter TC inspection f1 is,
In the case of manual measurement, the single product was set at 10 points in a bottle set or vacuum bottle set and measured, so the positioning accuracy between the IC+1- cord and the socket was poor, and it was difficult to determine the +1 position. From a lot of AC
(This may result in increased handling time and characteristic testing costs.) Furthermore, even if automatic inspection is available, the equipment used to handle single ICs is expensive due to the ease of processing.

[Object of the invention] The object of the present invention is to provide electronic devices such as small and darkened ICs+11
The purpose of this invention is to provide a % f/f inspection device that can inspect products with high fN degree and high efficiency.

The above and other objects and novel features of the present invention include:
7fI) will become obvious from the description in this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

In other words, the characteristic testing device of the present invention tests each characteristic of a plurality of 1M1 child parts supported by a lead frame.
Utilizing the precision of the shape and dimensions of the lead frame, positioning is carried out using the lead frame, and each electronic component is placed in the lead frame and measured at the same time.
Since it is possible to measure the characteristics, it is possible to reduce the number of man-hours for characteristic testing, improve yield, and reduce the cost of characteristic testing.

[Example] The drawings show an overview of the atomic sAt device ν as an example of the present invention.

Characteristics inspection man-hours of the example 1 to 1 Fig. 1'
tC' from the L' section 1 and the electric characteristic test equipment temporary body (tester) 2 which analyzes and processes the signals input into the measuring section 1.
)ing. The measuring section 1 has the role of pressing the ft3 shell body 3 and the lead frame 4 placed on the work surface of the jig body 3 against the jig body 3 (71/-).
From t (going. 11- Drum 1/-m 4 ke ichi 111
The outer frame part 6 consists of a long rectangular frame, and the J
:For example, there are 7 1's ('9^・menji17-(there).

Further, the lead frame 4 is provided with a horizontal frame 1 ( ) connected to both long frames 7 VC between the IC 9 and the IC 9 .
; - The lead frame 4 is reinforced. Also, the four corners of the lead frame 4 are provided with ginoid holes 11. These kite holes 11 are used for winter production such as assembly of IC9 and resin packages. Kt, ; is used as a guide for positioning the lead frame 4, etc., but in this embodiment, the positioning pin 1 provided on the jig main body 3, which will be described later, is used as a guide.
2 is inserted, and the jig body 3! 11-D frame 4 is not positioned relative to /r. The TC 9 has a plurality of glueds 14 protruding from the circumferential surface of the single nozzle package 13. Each IJ-do 14 is a resin package.The attachment point 3 is bent downward near the root.

10,000, the jig main body 3 is attached to the jetty 15 along both 111J gauze.
It has a structure with a shoulder of 15flJ.
Place the lead frame 4 on the soil surface of the jig main body 3 in #1.2. J is becoming a sea urchin. And the lead frame 4
A positioning pin 12 is installed in the machined surface of the jig main body 3 corresponding to the kite hole 11. Further, in the center of the jig main body 3, contact terminals 16 are installed in sockets 17, for example seven in number, corresponding to the number of ICs 9 supported on the lead frame 4. The contact terminal 16 is 1 of IC9.
- A coaxial cable 18 is connected to the lower part of the jig main body 3, and is electrically connected to the 1° test device main body 2. The socket 17 is attached to the jig main body 3, and if the handle 8 (flexible) is attached, the socket 17 must be replaced if the quality of the IC 9, which is the object to be measured, is damaged.

On the other hand, the frame holder is lowered from the top to the bottom. r sea urchin 7j
When the lead frame 4 is placed on the ft3 sail body 3, the T is lowered and the IC9 is inserted. / Functions to press against the plate 17.

Note that the measuring section Ji1. In this case, the jig 1 main body 3 and the frame holder 5 are made of metal in order to shield disturbance noise during the 6111 setting and to prevent electrostatic discharge damage to the IC 9.

When testing the characteristics of IC9, such a characteristic testing device can:
The guide hole 111C of the lead frame 4 (lead 71 so that the pin 12 is inserted into the guide hole 1711) is attached to the jig main body 3VC, and the frame retainer 5 is lowered and the valley IC 9 is inserted into the main body 3. This binding ensures that the leads 14 and contact terminals 16 are in contact with each other, and the side measurements of Pfr of IC9 on the seven-dot chain line are measured.

What should be noted here is that -i is checked, +1-F71
This means that the characteristics of all three ICs 9 formed in the node 4 are tested at the same time. This means that KJ can perform inspections with high workability. ``Wat〕, Conventional]
For example, a 711@o) T
This means that all of the characteristics of C9 can be tested at the same time.

Further, the positioning of the lead frame 4 for inspection is performed using the guide hole 11 already provided in the lead frame 4 to ensure dimensional accuracy.
Since this method is carried out using the provided positioning bin 12, it is simple and takes a short time, and is easy to use. l It can be done very well. Further, the positioning of the lead frame 4 is accurate, and the positioning of the leads 14 and the terminals 16, which protrude from the IC 9, can be made extremely precisely.

Furthermore, since the structure of the measuring section 1 is simple, the cost of the device i itself does not increase. Furthermore, by replacing the socket 1 with another IC, it is possible to test other ICs. 1 (, the effect of being able to do it, Kei 41
ing.

1. The characteristic testing device of the present invention includes, for example, seven ICs 9 supported by the lead frame 4, or a 6111 constant time tester 6111 supported by the lead frame 4. Nitori 1
・It is divided, and all IC9 are at once [7 and tactile 41 at the same time]
1 constant, the 6111 constant time per piece is shortened and the measurement efficiency is improved.

2. On the other side of the characteristic testing device of the present invention, the guide hole 11 of the old lead frame 4 with high dimensional accuracy is used for positioning during measurement setup. Even if it is 9, the contact between the lead 14 and the contact terminal 16 can be made accurately, allowing high degree measurements to be made and improving the steel axis of the measurement.

3. In the characteristic testing device of the present invention, the structure of the measuring section 1 is simple, and the manufacturing cost of the device can be reduced.

4. The characteristic testing device of the present invention has a simple structure of the measuring section 1, and the measuring operation is easy, so that it has the effect of high workability.

5. From notes 1 to 4, a synergistic effect can be obtained in that it is possible to reduce the cost of electronic and electronic devices, which are small and lightweight, by σ)%.

Hereinafter, the present invention has been described in a weak manner based on examples, but the present invention is limited to the illustrated examples. Needless to say, there are various types of fψ.

[Used amount! lI de]

In the above explanation, the invention made by the present inventor is applied to the field of application which is the background of the invention, which is a technology for simultaneously measuring multiple characteristics of resin package type semiconductor devices, but the invention is not limited to this. For example, the present invention can be applied to a technique for simultaneously measuring multiple characteristics of electronic devices such as semiconductor devices such as ceramic shoe cages manufactured using lead frames.

[Brief explanation of the drawing]

The drawing is an exploded perspective view showing an outline of a characteristic inspection device jk according to an embodiment of the present invention. 1...Measuring part, 2...Electricity! Time testing device 1 main body (
Tester), 3...Member body, 4...Leader 1 gnome, 5...Frame holder, 6...Outer frame part, 7...
Ten frame, 8...Tab hanging lead, 9...]C110
...Horizontal frame, 1]...Guide hole, 12...Positioning pin, 13...1/Jinhatsu cage, 14...Lead, 1
5... Jetty, 16... Contact terminal, 17... Sokerito, 18... rrsl 4jl + cable. Agent Patent Attorney Akio Takahashi

Claims (1)

[Scope of Claims] 1. A jig main body in which contact terminals corresponding to the respective leads of WI number 1h child parts supported by r on the lead 71 norm are arranged on the main surface, and the jig main body q of the lead frame mounted on the main surface of the q! A characteristic testing device comprising: a frame holder for holding electronic components firmly against the main body; and the contact terminal is electrically connected to the main body of the device. 1. A characteristic testing method for parts, characterized by simultaneously measuring the characteristics of a plurality of electronic and electronic parts formed in a lead 71)-me.