JPS60194379U - 2-layer high-density printed circuit board - Google Patents

2-layer high-density printed circuit board

Info

Publication number
JPS60194379U
JPS60194379U JP8049184U JP8049184U JPS60194379U JP S60194379 U JPS60194379 U JP S60194379U JP 8049184 U JP8049184 U JP 8049184U JP 8049184 U JP8049184 U JP 8049184U JP S60194379 U JPS60194379 U JP S60194379U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
density printed
hole
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8049184U
Other languages
Japanese (ja)
Other versions
JPH027484Y2 (en
Inventor
太田　意人
Original Assignee
日立電子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立電子株式会社 filed Critical 日立電子株式会社
Priority to JP8049184U priority Critical patent/JPS60194379U/en
Publication of JPS60194379U publication Critical patent/JPS60194379U/en
Application granted granted Critical
Publication of JPH027484Y2 publication Critical patent/JPH027484Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　ｂは本考案の実施例を示し、ａは非スルー
ホールプリント基板の断面図、ｂは部品り　。 −ドの挿入とはんだ付は状態の断面図、第２図は従来の
プリント基板の寸法割付図、第３，４図は本考案の他の
実施例を示し、第３図は片面スルー　　　。 ホールのプリント基板、第４図は片面部分スルーホール
のプリント基板である。 １１ニブリント基板の絶縁層、１２：部品リード挿入穴
、１３．１３’、１３″二Ｂ面ラシド及びスルーホール
、１４：へ面配線パターン、１５゜１６：レジスト膜、
２１：部品リード、２３：はんだ。Figures 1a and 1b show an embodiment of the present invention, in which a is a cross-sectional view of a non-through-hole printed circuit board, and b is a component diagram. 2 is a dimensional layout diagram of a conventional printed circuit board, 3 and 4 are other embodiments of the present invention, and 3 is a one-sided through-hole diagram. Figure 4 shows a printed circuit board with through holes on one side. 11 Insulating layer of Niblint board, 12: Component lead insertion hole, 13.13', 13'' double B-side Rashid and through hole, 14: Bottom wiring pattern, 15° 16: Resist film,
21: Component lead, 23: Solder.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）両面銅張り積層板を用いてプリント配線を行う２
層高密度プリント基板において、前記積層板間を貫通さ
せた部品挿入穴に対するランドを前記プリント基板のは
んだ付は面側のみに設け、前記プリント基板の部品取付
面側の隣接する前記部品挿入穴間に１本又は複数本のプ
リント配線パターンを配置したことを特徴とする２層高
密度プリント基板。(1) Perform printed wiring using double-sided copper-clad laminates 2
In the layered high-density printed circuit board, lands for component insertion holes penetrating between the laminated boards are provided only on the surface side of the printed circuit board for soldering, and lands are provided between adjacent component insertion holes on the component mounting surface side of the printed circuit board. A two-layer high-density printed circuit board characterized in that one or more printed wiring patterns are arranged on the board. （２）前記部品リード挿入穴を非スルーホールにしたこ
とを特徴とする実用新案登録請求の範囲第１項記載の２
層高密度プリント基板。(2) Utility model registration claim 2, characterized in that the component lead insertion hole is a non-through hole.
Layer high density printed circuit board. （３）前記部品リード挿入穴の部品取付面側に逆ランド
を設けて、片面スルーホールにしたことを特徴とする実
用新案登録請求の範囲第１項記載の２層高密度プリント
基板。(3) The two-layer high-density printed circuit board according to claim 1, which is a registered utility model, characterized in that an inverted land is provided on the component mounting surface side of the component lead insertion hole to form a single-sided through hole. （４）前記部品リード挿入穴のはんだ付は面側を片面部
分スルーホールにしたことを特徴とする実用新案登録請
求の範囲第１項記載の２層密度プ　−リント基板。(4) The dual-layer density printed circuit board according to claim 1, wherein the component lead insertion holes are soldered so that the surface side thereof is a partial through-hole.
JP8049184U 1984-06-01 1984-06-01 2-layer high-density printed circuit board Granted JPS60194379U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8049184U JPS60194379U (en) 1984-06-01 1984-06-01 2-layer high-density printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8049184U JPS60194379U (en) 1984-06-01 1984-06-01 2-layer high-density printed circuit board

Publications (2)

Publication Number Publication Date
JPS60194379U true JPS60194379U (en) 1985-12-24
JPH027484Y2 JPH027484Y2 (en) 1990-02-22

Family

ID=30626388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8049184U Granted JPS60194379U (en) 1984-06-01 1984-06-01 2-layer high-density printed circuit board

Country Status (1)

Country Link
JP (1) JPS60194379U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4889353A (en) * 1972-02-29 1973-11-22
JPS52110472A (en) * 1976-03-11 1977-09-16 Takatsugu Komatsu Printed circuit substrate
JPS5533666U (en) * 1978-08-23 1980-03-04
JPS5616974U (en) * 1979-07-17 1981-02-14

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53118914A (en) * 1977-03-28 1978-10-17 Furukawa Electric Co Ltd:The Inductive radio wire manufacturing unit of crossing type

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4889353A (en) * 1972-02-29 1973-11-22
JPS52110472A (en) * 1976-03-11 1977-09-16 Takatsugu Komatsu Printed circuit substrate
JPS5533666U (en) * 1978-08-23 1980-03-04
JPS5616974U (en) * 1979-07-17 1981-02-14

Also Published As

Publication number Publication date
JPH027484Y2 (en) 1990-02-22

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