JPS60179072U - Partial multilayer printed wiring board - Google Patents

Partial multilayer printed wiring board

Info

Publication number
JPS60179072U
JPS60179072U JP6553684U JP6553684U JPS60179072U JP S60179072 U JPS60179072 U JP S60179072U JP 6553684 U JP6553684 U JP 6553684U JP 6553684 U JP6553684 U JP 6553684U JP S60179072 U JPS60179072 U JP S60179072U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
multilayer printed
partial multilayer
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6553684U
Other languages
Japanese (ja)
Inventor
福田　庄太郎
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP6553684U priority Critical patent/JPS60179072U/en
Publication of JPS60179072U publication Critical patent/JPS60179072U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面はこの考案の一実施例を示す斜視図である。 １・・・基盤となる両面プリント配線板、２・・・部分
両面プリント配線板、３・・・絶縁板、４・・・スルー
ホールメッキ部。The drawing is a perspective view showing an embodiment of this invention. DESCRIPTION OF SYMBOLS 1... Double-sided printed wiring board serving as a base, 2... Partial double-sided printed wiring board, 3... Insulating board, 4... Through-hole plating section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多層プリント配線板において、基盤となるプリント配線
板の所要部分の上層又は下層に所定の大きさ及び形状を
有するプリント配線板を絶縁板を介して重ね合わせ積層
接着し、各層回路パターンをスルーホールメッキで接続
したことを特徴とする部分多層プリント配線板。In a multilayer printed wiring board, a printed wiring board with a predetermined size and shape is laminated and bonded to the upper or lower layer of the required part of the printed wiring board that serves as the base, with an insulating board interposed therebetween, and the circuit pattern of each layer is plated with through holes. A partially multilayer printed wiring board characterized by being connected by.
JP6553684U 1984-05-07 1984-05-07 Partial multilayer printed wiring board Pending JPS60179072U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6553684U JPS60179072U (en) 1984-05-07 1984-05-07 Partial multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6553684U JPS60179072U (en) 1984-05-07 1984-05-07 Partial multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS60179072U true JPS60179072U (en) 1985-11-28

Family

ID=30597620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6553684U Pending JPS60179072U (en) 1984-05-07 1984-05-07 Partial multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS60179072U (en)

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