JPS60189951A - 方形体のエツジ検出方法 - Google Patents

方形体のエツジ検出方法

Info

Publication number
JPS60189951A
JPS60189951A JP4748884A JP4748884A JPS60189951A JP S60189951 A JPS60189951 A JP S60189951A JP 4748884 A JP4748884 A JP 4748884A JP 4748884 A JP4748884 A JP 4748884A JP S60189951 A JPS60189951 A JP S60189951A
Authority
JP
Japan
Prior art keywords
chip
scanning
scanning lines
detected
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4748884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0139651B2 (enExample
Inventor
Yasumi Koyama
小山　保美
Naoki Sugao
直樹 菅生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4748884A priority Critical patent/JPS60189951A/ja
Publication of JPS60189951A publication Critical patent/JPS60189951A/ja
Publication of JPH0139651B2 publication Critical patent/JPH0139651B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP4748884A 1984-03-12 1984-03-12 方形体のエツジ検出方法 Granted JPS60189951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4748884A JPS60189951A (ja) 1984-03-12 1984-03-12 方形体のエツジ検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4748884A JPS60189951A (ja) 1984-03-12 1984-03-12 方形体のエツジ検出方法

Publications (2)

Publication Number Publication Date
JPS60189951A true JPS60189951A (ja) 1985-09-27
JPH0139651B2 JPH0139651B2 (enExample) 1989-08-22

Family

ID=12776500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4748884A Granted JPS60189951A (ja) 1984-03-12 1984-03-12 方形体のエツジ検出方法

Country Status (1)

Country Link
JP (1) JPS60189951A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172209A (ja) * 1986-01-25 1987-07-29 Shinetsu Eng Kk 被検査物のプロフイル検出方法
JPS63107139A (ja) * 1986-10-24 1988-05-12 Nikon Corp 感光基板のアライメント方法
EP0660656A1 (en) * 1993-12-27 1995-06-28 Yamaha Hatsudoki Kabushiki Kaisha Method and mounting device for mounting a component at a specific position
EP0660657A1 (en) * 1993-12-27 1995-06-28 Yamaha Hatsudoki Kabushiki Kaisha Method and mounting device for mounting a component at a specific position
US7746481B2 (en) 2007-03-20 2010-06-29 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
US8068664B2 (en) 2007-06-05 2011-11-29 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172209A (ja) * 1986-01-25 1987-07-29 Shinetsu Eng Kk 被検査物のプロフイル検出方法
JPS63107139A (ja) * 1986-10-24 1988-05-12 Nikon Corp 感光基板のアライメント方法
EP0660656A1 (en) * 1993-12-27 1995-06-28 Yamaha Hatsudoki Kabushiki Kaisha Method and mounting device for mounting a component at a specific position
EP0660657A1 (en) * 1993-12-27 1995-06-28 Yamaha Hatsudoki Kabushiki Kaisha Method and mounting device for mounting a component at a specific position
US7746481B2 (en) 2007-03-20 2010-06-29 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
US8068664B2 (en) 2007-06-05 2011-11-29 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging

Also Published As

Publication number Publication date
JPH0139651B2 (enExample) 1989-08-22

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