JPS60189815A - Method of producing nickel-plated wire and strand - Google Patents

Method of producing nickel-plated wire and strand

Info

Publication number
JPS60189815A
JPS60189815A JP4620084A JP4620084A JPS60189815A JP S60189815 A JPS60189815 A JP S60189815A JP 4620084 A JP4620084 A JP 4620084A JP 4620084 A JP4620084 A JP 4620084A JP S60189815 A JPS60189815 A JP S60189815A
Authority
JP
Japan
Prior art keywords
nickel
plated
strand
producing nickel
plated wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4620084A
Other languages
Japanese (ja)
Inventor
中村 一宣
豊張 小泉
修 吉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP4620084A priority Critical patent/JPS60189815A/en
Publication of JPS60189815A publication Critical patent/JPS60189815A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の背景と目的〕 本発明は、電子機器および耐熱電線等に使用されるニッ
ケルめっき線及びリードフレーム等のニッケルめっき条
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Background and Objectives of the Invention] The present invention relates to nickel-plated wires and nickel-plated strips for lead frames and the like used in electronic devices, heat-resistant electric wires, and the like.

ニッケルめっきは一般的に耐変色性に優れるため装飾品
などに利用されるばかりでなく耐熱性も高く、高融点金
属の中においても半田付が可能な稀少価値の高い部類に
属する。
Nickel plating generally has excellent color fastness, so it is not only used for decorative items, but also has high heat resistance, and is a rare and valuable class of high-melting point metals that can be soldered.

そのために、電子機器忙おいてもニッケルめっきは広い
範囲に応用されている。
For this reason, nickel plating is widely used in electronic devices.

しかしながら、ニッケルめっきした金属線の表面部分は
安定した酸化膜(保護膜となる)が素だ形成されていな
いだめ、可酷な条件下、即ち腐蝕性ガス等の環境によシ
異状酸化変色して電子部品としての価値を低減させてし
まう問題がある。
However, because the surface of nickel-plated metal wire does not have a stable oxide film (which acts as a protective film), it may undergo abnormal oxidation and discoloration under harsh conditions, i.e., environments such as corrosive gases. There is a problem in that the value as an electronic component is reduced.

上記の如き条件下においてニッケルめっき線及び条の半
田付は性そして異状酸化による変色性を改善する余地が
残される。
Under the above conditions, there remains room for improving the soldering properties of nickel-plated wires and strips and the discoloration caused by abnormal oxidation.

従来、金属線に錫めっき、半田めっきした表面に高級脂
肪酸溶液で塗布処理したものは知られているが、これら
は耐熱温度が低く(溶融点が錫は231.8℃で、半田
は通常の鉛と錫の配合物で450℃以下のものが殆んど
である)めっき線の用途によってはニッケルめっき線又
は条にニッケルの溶融点は1452℃)を用いなければ
ならない必要がある。
Conventionally, it is known that metal wires are coated with a higher fatty acid solution on the surface of tin-plated or solder-plated metal wires, but these have low heat resistance (melting point of tin is 231.8℃, and solder is Depending on the use of the plated wire (most of which are mixtures of lead and tin with a temperature below 450°C), it may be necessary to use nickel-plated wire or strip (the melting point of nickel is 1452°C).

本発明の目的は、電子機器部品としても耐熱配慮の要る
ダイオード用、トランジスタ、IC等の部品として用い
るニッケルめっき線及び条の品質の向上を目途としなさ
れたものである。
An object of the present invention is to improve the quality of nickel-plated wires and strips used as parts of electronic devices such as diodes, transistors, and ICs that require heat resistance.

〔発明の概要〕[Summary of the invention]

本発明に用いる金属線の材質としては、鋼、銅、黄銅等
で、これらは通常めっきして利用されるケースが多いが
、本発明においては、ダイオード、トランジスタ、IC
用として用いるだめ、該金属線にニッケルめっきを施し
、この商品価値と半田伺は性能、等を高めるため、飽和
脂肪酸、不飽和脂肪酸のうちの高級脂肪酸に属するもの
を用いて改質した点を要旨とする。
The metal wire used in the present invention is made of steel, copper, brass, etc., and these are often plated.
The metal wire is nickel-plated and modified with saturated fatty acids and unsaturated fatty acids belonging to higher fatty acids in order to increase its commercial value and performance. This is the summary.

本発明の構成は、鋼、銅、黄銅線及び条にニッケルめっ
きを施し、その直後の腐蝕性気体等による異状酸化を起
す前に、高級脂肪酸の溶剤溶液で薄い被覆(保護膜)を
形成させることにある。核酸としては、飽和脂肪酸Cn
H2n+I C0OHのうちnが11〜17のもの、(
ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン
酸等)、不飽和脂肪酸としてはオレイン(C+7H33
・COOH)酸を用いる。
The structure of the present invention is to apply nickel plating to steel, copper, and brass wires and strips, and then form a thin coating (protective film) with a solvent solution of higher fatty acids immediately before abnormal oxidation by corrosive gas etc. There is a particular thing. Nucleic acids include saturated fatty acids Cn
Among H2n+I C0OH, n is 11 to 17, (
lauric acid, myristic acid, palmitic acid, stearic acid, etc.), and unsaturated fatty acids such as oleic acid (C+7H33
・COOH) acid is used.

これらは常温では固体であり、アルコール、エーテル、
クロロフォルム等の有機揮発性溶剤によくとけ、その0
.6〜1.2係程度の溶剤溶液を用いてニッケルめっき
線及び条の表面に保護被膜を形成させ、商品の光沢性を
持続でき、半田付は性を改良したものである。本発明に
よる酸処理を施さない場合は、大気酸化或いは刺激性ガ
スによって変色が大きく、部品として用いたときの半田
付性が極度に劣シ、強力なフラックスを用いなければ満
足すべき半田付けができなかった。
These are solid at room temperature, such as alcohol, ether,
It dissolves well in organic volatile solvents such as chloroform, and its 0
.. A protective film is formed on the surface of the nickel-plated wires and strips using a solvent solution with a concentration of about 6 to 1.2, which maintains the gloss of the product and improves solderability. If the acid treatment according to the present invention is not performed, the discoloration will be large due to atmospheric oxidation or irritating gases, the solderability will be extremely poor when used as a component, and satisfactory soldering will not be possible unless a strong flux is used. could not.

〔発明の効果〕〔Effect of the invention〕

本発明の方法によシ、従来の錫、半田めっきした金属線
には具備しない耐熱性、耐変色性に優れた特性をニッケ
ルめっき線に与えることができ、ダイオード製造時の熱
工程(約450℃で1o分)で表面酸化皮膜は熱分解し
てダイオード特性菱は何らの悪影響を与えない。また、
酸の溶剤溶液濃度を適宜変化させることにょシ、塗布具
による塗布そして酸浴中に連続通過させて被膜を作る方
法をとることができる。
By the method of the present invention, it is possible to give nickel-plated wire excellent properties such as heat resistance and discoloration resistance that conventional tin and solder-plated metal wires do not have. The surface oxide film is thermally decomposed at 1°C (10 minutes) and does not have any adverse effect on the diode characteristics. Also,
By appropriately changing the concentration of the acid in the solvent solution, a method can be used to form a film by coating with an applicator and continuously passing through an acid bath.

〔実施例〕〔Example〕

本発明によるニッケルめっき金属線及び条は、従来のニ
ッケルめっきを施したままのものに比して下表の如き顕
著な効果を奏するもので、トランジスタ、ダイオード用
、IC等に有用で発明としての価値は高い。
The nickel-plated metal wires and strips according to the present invention have remarkable effects as shown in the table below compared to conventional nickel-plated metal wires and strips, and are useful for transistors, diodes, ICs, etc., and are useful as an invention. The value is high.

table

Claims (1)

【特許請求の範囲】[Claims] 金属材から成る導体表面にニッケルめっきした直後に、
CnH2n+t、CnH2n−1でnが11〜17の飽
、和もしくは不飽和の高級脂肪酸の溶剤液の薄い塗膜を
形成することを特徴とするニッケルめっき線及び条の製
造方法。
Immediately after nickel plating on the surface of a conductor made of metal material,
A method for producing nickel-plated wires and strips, which comprises forming a thin coating film of a solvent solution of a saturated, saturated or unsaturated higher fatty acid in which n is CnH2n+t or CnH2n-1 and n is 11 to 17.
JP4620084A 1984-03-09 1984-03-09 Method of producing nickel-plated wire and strand Pending JPS60189815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4620084A JPS60189815A (en) 1984-03-09 1984-03-09 Method of producing nickel-plated wire and strand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4620084A JPS60189815A (en) 1984-03-09 1984-03-09 Method of producing nickel-plated wire and strand

Publications (1)

Publication Number Publication Date
JPS60189815A true JPS60189815A (en) 1985-09-27

Family

ID=12740432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4620084A Pending JPS60189815A (en) 1984-03-09 1984-03-09 Method of producing nickel-plated wire and strand

Country Status (1)

Country Link
JP (1) JPS60189815A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62277755A (en) * 1986-05-26 1987-12-02 Hitachi Cable Ltd Manufacture of lead frame
JP2010209391A (en) * 2009-03-10 2010-09-24 Dowa Metaltech Kk Method of manufacturing nickel plated material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62277755A (en) * 1986-05-26 1987-12-02 Hitachi Cable Ltd Manufacture of lead frame
JPH0582973B2 (en) * 1986-05-26 1993-11-24 Hitachi Cable
JP2010209391A (en) * 2009-03-10 2010-09-24 Dowa Metaltech Kk Method of manufacturing nickel plated material

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