JPS6018942A - 電子部品用放熱部材 - Google Patents

電子部品用放熱部材

Info

Publication number
JPS6018942A
JPS6018942A JP58127492A JP12749283A JPS6018942A JP S6018942 A JPS6018942 A JP S6018942A JP 58127492 A JP58127492 A JP 58127492A JP 12749283 A JP12749283 A JP 12749283A JP S6018942 A JPS6018942 A JP S6018942A
Authority
JP
Japan
Prior art keywords
electronic components
thermally conductive
conductive rubber
heat dissipation
mold release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58127492A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131700B2 (enExample
Inventor
Kiyoshi Nojima
野島　清
Kiyoshi Itou
伊藤　喜代之
Kiyoshi Hani
羽仁　潔
Takahiko Ubabe
姥辺　隆比古
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58127492A priority Critical patent/JPS6018942A/ja
Publication of JPS6018942A publication Critical patent/JPS6018942A/ja
Publication of JPH0131700B2 publication Critical patent/JPH0131700B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58127492A 1983-07-13 1983-07-13 電子部品用放熱部材 Granted JPS6018942A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58127492A JPS6018942A (ja) 1983-07-13 1983-07-13 電子部品用放熱部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58127492A JPS6018942A (ja) 1983-07-13 1983-07-13 電子部品用放熱部材

Publications (2)

Publication Number Publication Date
JPS6018942A true JPS6018942A (ja) 1985-01-31
JPH0131700B2 JPH0131700B2 (enExample) 1989-06-27

Family

ID=14961293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58127492A Granted JPS6018942A (ja) 1983-07-13 1983-07-13 電子部品用放熱部材

Country Status (1)

Country Link
JP (1) JPS6018942A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289847A (ja) * 1987-05-21 1988-11-28 Nec Corp Ｌｓｉパッケ−ジの放熱構造
US5285108A (en) * 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits
JP2003101270A (ja) * 2001-09-27 2003-04-04 Toshiba Corp 電子部品の冷却構造、これを備えた磁気ディスク装置、および冷却構造の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57146347U (enExample) * 1981-03-06 1982-09-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57146347U (enExample) * 1981-03-06 1982-09-14

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289847A (ja) * 1987-05-21 1988-11-28 Nec Corp Ｌｓｉパッケ−ジの放熱構造
US5285108A (en) * 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits
JP2003101270A (ja) * 2001-09-27 2003-04-04 Toshiba Corp 電子部品の冷却構造、これを備えた磁気ディスク装置、および冷却構造の製造方法

Also Published As

Publication number Publication date
JPH0131700B2 (enExample) 1989-06-27

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