JPH0131700B2 - - Google Patents
Info
- Publication number
- JPH0131700B2 JPH0131700B2 JP58127492A JP12749283A JPH0131700B2 JP H0131700 B2 JPH0131700 B2 JP H0131700B2 JP 58127492 A JP58127492 A JP 58127492A JP 12749283 A JP12749283 A JP 12749283A JP H0131700 B2 JPH0131700 B2 JP H0131700B2
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive rubber
- electronic components
- mold release
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58127492A JPS6018942A (ja) | 1983-07-13 | 1983-07-13 | 電子部品用放熱部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58127492A JPS6018942A (ja) | 1983-07-13 | 1983-07-13 | 電子部品用放熱部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6018942A JPS6018942A (ja) | 1985-01-31 |
| JPH0131700B2 true JPH0131700B2 (enExample) | 1989-06-27 |
Family
ID=14961293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58127492A Granted JPS6018942A (ja) | 1983-07-13 | 1983-07-13 | 電子部品用放熱部材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6018942A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63289847A (ja) * | 1987-05-21 | 1988-11-28 | Nec Corp | Lsiパッケ−ジの放熱構造 |
| US5285108A (en) * | 1991-06-21 | 1994-02-08 | Compaq Computer Corporation | Cooling system for integrated circuits |
| JP2003101270A (ja) * | 2001-09-27 | 2003-04-04 | Toshiba Corp | 電子部品の冷却構造、これを備えた磁気ディスク装置、および冷却構造の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57146347U (enExample) * | 1981-03-06 | 1982-09-14 |
-
1983
- 1983-07-13 JP JP58127492A patent/JPS6018942A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6018942A (ja) | 1985-01-31 |
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