JPS6018939A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS6018939A
JPS6018939A JP58126080A JP12608083A JPS6018939A JP S6018939 A JPS6018939 A JP S6018939A JP 58126080 A JP58126080 A JP 58126080A JP 12608083 A JP12608083 A JP 12608083A JP S6018939 A JPS6018939 A JP S6018939A
Authority
JP
Japan
Prior art keywords
header
chip
bolt
section
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58126080A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0522391B2 (enrdf_load_stackoverflow
Inventor
Tomoo Sakamoto
友男 坂本
Takashi Nakagawa
隆 中川
Hiroyuki Iinuma
飯沼　宏之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Microcomputer Engineering Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Microcomputer Engineering Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP58126080A priority Critical patent/JPS6018939A/ja
Publication of JPS6018939A publication Critical patent/JPS6018939A/ja
Publication of JPH0522391B2 publication Critical patent/JPH0522391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58126080A 1983-07-13 1983-07-13 樹脂封止型半導体装置 Granted JPS6018939A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58126080A JPS6018939A (ja) 1983-07-13 1983-07-13 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58126080A JPS6018939A (ja) 1983-07-13 1983-07-13 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6018939A true JPS6018939A (ja) 1985-01-31
JPH0522391B2 JPH0522391B2 (enrdf_load_stackoverflow) 1993-03-29

Family

ID=14926110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58126080A Granted JPS6018939A (ja) 1983-07-13 1983-07-13 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6018939A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234058A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体装置
JPS63110045U (enrdf_load_stackoverflow) * 1987-01-09 1988-07-15
JPS6484651A (en) * 1987-09-26 1989-03-29 Toshiba Corp Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5585046A (en) * 1978-12-22 1980-06-26 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5585046A (en) * 1978-12-22 1980-06-26 Hitachi Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234058A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体装置
JPS63110045U (enrdf_load_stackoverflow) * 1987-01-09 1988-07-15
JPS6484651A (en) * 1987-09-26 1989-03-29 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPH0522391B2 (enrdf_load_stackoverflow) 1993-03-29

Similar Documents

Publication Publication Date Title
JPH08139223A (ja) 半導体装置
KR930007518B1 (ko) 반도체장치
JP4416140B2 (ja) 樹脂封止型半導体装置
JPS6018939A (ja) 樹脂封止型半導体装置
JPS6180842A (ja) 半導体装置
JP2532826B2 (ja) 樹脂封止型半導体装置の製造方法
JP3871587B2 (ja) 樹脂封止型半導体装置
JPH0318741B2 (enrdf_load_stackoverflow)
JPS5925384B2 (ja) 電子装置
JP2713141B2 (ja) 半導体装置
JPS59152653A (ja) レジンパツケ−ジ型半導体装置
JP2561470Y2 (ja) 絶縁封止電子部品
JPH0870087A (ja) リードフレーム
JP2512289B2 (ja) 樹脂封止型半導体装置
JPS6112682Y2 (enrdf_load_stackoverflow)
JPS6246268Y2 (enrdf_load_stackoverflow)
JP2604885B2 (ja) 樹脂封止型半導体装置
JPS6018848Y2 (ja) 樹脂モ−ルド型半導体装置用リ−ドフレ−ム
JPS6130426B2 (enrdf_load_stackoverflow)
JP3732604B2 (ja) 樹脂パッケージ型半導体装置、およびその製造方法
JPS6234452Y2 (enrdf_load_stackoverflow)
JPH0693482B2 (ja) 樹脂封止型半導体装置
JPH0351977Y2 (enrdf_load_stackoverflow)
JPH08204099A (ja) 半導体装置の構造及び形成方法
JPH0338837Y2 (enrdf_load_stackoverflow)