JPS60187564U - Mounting structure of sub-printed board - Google Patents

Mounting structure of sub-printed board

Info

Publication number
JPS60187564U
JPS60187564U JP7679184U JP7679184U JPS60187564U JP S60187564 U JPS60187564 U JP S60187564U JP 7679184 U JP7679184 U JP 7679184U JP 7679184 U JP7679184 U JP 7679184U JP S60187564 U JPS60187564 U JP S60187564U
Authority
JP
Japan
Prior art keywords
printed board
sub
mounting structure
mother
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7679184U
Other languages
Japanese (ja)
Inventor
白井　守
西村　敬治
福岡　晃
浩幸 太田黒
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP7679184U priority Critical patent/JPS60187564U/en
Publication of JPS60187564U publication Critical patent/JPS60187564U/en
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図〜第５図は本考案に係るサブプリント板の実装構
造の一実施例を説明するための第１図はマザープリント
板の平面図、第２図はザブプリント板の裏面図、第３図
はマザープリント板完成の正面図、第４図はサブプリン
ト板のバット部拡大図、第５図は接続部拡大断面図であ
る。 図において、１はマザープリント板、２，２′は実装部
品、３，５はバット、４はサブプリント板、６はスルー
ホール、７は半田をそれぞれ示す。1 to 5 are for explaining one embodiment of the mounting structure of the sub-printed board according to the present invention. FIG. 1 is a plan view of the mother printed board, FIG. 2 is a back view of the sub-printed board, and FIG. 3 is a front view of the completed mother printed board, FIG. 4 is an enlarged view of the butt part of the sub-printed board, and FIG. 5 is an enlarged sectional view of the connection part. In the figure, 1 is a mother printed board, 2 and 2' are mounted components, 3 and 5 are bats, 4 is a sub-printed board, 6 is a through hole, and 7 is solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] マザープリント板と、該マザープリント板上に実装され
るサブプリント板の相互に対抗する面の電気的接続部に
半田接続用のバットを備え、少なくとも一方のプリント
板のバットにスルーホールを設けたことを特徴とするサ
ブプリント板の実装構造。A solder connection bat is provided at the electrical connection portion of the opposing surfaces of the mother printed board and the sub-printed board mounted on the mother printed board, and a through hole is provided in the butt of at least one of the printed boards. A sub-printed board mounting structure characterized by:
JP7679184U 1984-05-24 1984-05-24 Mounting structure of sub-printed board Pending JPS60187564U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7679184U JPS60187564U (en) 1984-05-24 1984-05-24 Mounting structure of sub-printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7679184U JPS60187564U (en) 1984-05-24 1984-05-24 Mounting structure of sub-printed board

Publications (1)

Publication Number Publication Date
JPS60187564U true JPS60187564U (en) 1985-12-12

Family

ID=30619252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7679184U Pending JPS60187564U (en) 1984-05-24 1984-05-24 Mounting structure of sub-printed board

Country Status (1)

Country Link
JP (1) JPS60187564U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015159205A (en) * 2014-02-25 2015-09-03 株式会社村田製作所 Manufacturing method of multilayer substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015159205A (en) * 2014-02-25 2015-09-03 株式会社村田製作所 Manufacturing method of multilayer substrate

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