JPS6078140U - Hybrid IC mounting structure - Google Patents

Hybrid IC mounting structure

Info

Publication number
JPS6078140U
JPS6078140U JP16846383U JP16846383U JPS6078140U JP S6078140 U JPS6078140 U JP S6078140U JP 16846383 U JP16846383 U JP 16846383U JP 16846383 U JP16846383 U JP 16846383U JP S6078140 U JPS6078140 U JP S6078140U
Authority
JP
Japan
Prior art keywords
hybrid
mounting structure
board
support plate
pwb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16846383U
Other languages
Japanese (ja)
Inventor
悟 田崎
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP16846383U priority Critical patent/JPS6078140U/en
Publication of JPS6078140U publication Critical patent/JPS6078140U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例を示す正面図、第２図はこの考案に係る
ハイブリッドＩＣ実装構造の実施例を示す斜視図、第３
図は同上実施例の組付過程を示す分解斜視図である。 １：ＨＩｃ基板、２ａ〜２ｄ１５ａ〜５ｄ：ピン、３，
４：支持板。Fig. 1 is a front view showing a conventional example, Fig. 2 is a perspective view showing an embodiment of the hybrid IC mounting structure according to this invention, and Fig. 3 is a front view showing a conventional example.
The figure is an exploded perspective view showing the assembly process of the above embodiment. 1: HIc board, 2a-2d15a-5d: pin, 3,
4: Support plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板をＰＷＢ等に縦形に実装するハイブリッドＩＣ実装
構造において、前記基板の板面に支持板を垂設し、該支
持板および前記基板をＰＷＢ等に縦形に装着するととも
に、当該支持板にも電子部品の搭載を可能としたことを
特徴とするハイブリッドＩＣ実装構造。In a hybrid IC mounting structure in which a board is mounted vertically on a PWB, etc., a support plate is vertically provided on the surface of the board, and the support plate and the board are mounted vertically on the PWB, etc., and electronics are also mounted on the support plate. A hybrid IC mounting structure characterized by the ability to mount components.
JP16846383U 1983-11-01 1983-11-01 Hybrid IC mounting structure Pending JPS6078140U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16846383U JPS6078140U (en) 1983-11-01 1983-11-01 Hybrid IC mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16846383U JPS6078140U (en) 1983-11-01 1983-11-01 Hybrid IC mounting structure

Publications (1)

Publication Number Publication Date
JPS6078140U true JPS6078140U (en) 1985-05-31

Family

ID=30368281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16846383U Pending JPS6078140U (en) 1983-11-01 1983-11-01 Hybrid IC mounting structure

Country Status (1)

Country Link
JP (1) JPS6078140U (en)

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