JPS60184674A - Vacuum device for forming continuous thin film - Google Patents

Abstract

PURPOSE:To provide a titled device which forms a uniform thin film having high adhesion and good quality by installing an electron ray accelerator in addition to a heating source to the inside of a vacuum vessel and irradiating an electron ray to the surface of a substrate prior to formation of the thin film thereby making pretreatment. CONSTITUTION:A vacuum device for forming a continuous thin film heats a metal such as Co contained in a crucible 19 to evaporate by a heating source 21 and deposits the same by evaporation on a substrate 16 of a high polymer molding such as PE which is unrolled from a core 10 and is moved by a free roller 11 while said substrate is wound on a vapor deposition roller 12 in a vacuum vessel 1. An electron ray accelerator for pretreatment of the substrate consisting of a cathode 23, an anode 24 and an electron reflecting plate 22, etc. is installed to the above-mentioned vacuum device, in addition to the above-mentioned heating source 21. The cathode 23 which faces the substrate 16 consists of a wire having >=1mm. diameter longer than the width thereof and is preferably impressed with about -30kV acceleration voltage which is of the same potential as the potential of the above-mentioned plate 22. Electrons are irradiated to the substrate surface just prior to formation of the thin film to remove oil, etc. from the substrate surface and to charge electrostatically said surface by the above-mentioned constitution by which the adhesion strength between the substrate and the roller 12 is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to the production of polymer molded substrates (
This invention relates to a vacuum device for continuously forming thin films of metals and metal oxides on the surface (hereinafter referred to as a substrate).

Conventional Structures and Their Problems Techniques for continuously forming thin films on a substrate have come into widespread use in industry in recent years. Thin films such as aluminum and zinc for capacitors, decorations, and packaging 9 reflective films, copper thin films for flexible electronic circuit boards, cobalt for magnetic recording media, etc.
Nickel, chrome.

It is used in many fields to form thin films of iron, etc.

Long substrates are generally used as substrates on which thin films are continuously formed, such as the above-mentioned capacitors, decorations, packaging 1 reflective films, and magnetic recording media. The conventional method of forming a thin film on a long substrate is as follows.

FIG. 1 shows the main parts of an apparatus used for forming a long substrate by vacuum evaporation. The board 41 is in a wound state on the unwinding shaft 40.
is set to The substrate 41 passes through a free roller (not shown) and an expander, and then is wound around the take-up shaft 44 along the outer periphery of the vapor deposition roller 42 (17) 71J-roller (not shown), and an expander. The formation of a thin film is
While the substrate 41 is running in synchronization with the vapor deposition roller 42, evaporated atoms from the evaporation source 43 are deposited on the surface of the substrate 41. Ion blating is almost the same method for vacuum evaporation equipment, and for sputtering, the evaporation source 43 is the target.

These vacuum evaporation methods, ion blating.

Conventional thin film forming methods such as sputtering have problems with the adhesion between the substrate and the thin film, as well as thermal damage to the substrate due to radiant heat from evaporation sources and targets.0 To strengthen adhesion, it is necessary to clean the substrate surface and , plasma irradiation, etc.
In addition, methods used to reduce radiant heat include placing a cooling roller in contact with the back of the board to absorb the heat from the board, but this is still not sufficient, especially for materials with high melting points such as iron, cobalt, and nickel. This was an important problem in the formation of magnetic thin films using the method.Objective of the InventionThe present invention solves the above problems, and provides a vacuum for forming thin films that eliminates thermal damage to the substrate and strengthens the adhesion between the substrate and the thin film. It provides equipment.

Structure of the Invention The present invention is a vacuum evaporation device, an ion blating device, or a sputtering device equipped with an electron beam accelerator for treating the surface of a substrate. It consists of a long cathode, an anode, and an electron reflection plate, and is installed to irradiate the substrate surface with electrons before the process of forming a thin film on the substrate surface. The overall structure also includes a substrate transport system, a vacuum evacuation system, an accelerator power supply 1, etc.

DESCRIPTION OF THE EMBODIMENT FIG. 2 is a side view of an embodiment of the present invention. The upper part of the vacuum chamber 1 is evacuated by an evacuation pipe 4 through an on-off valve 6, and the lower part is evacuated through an evacuation pipe 7 through an on-off valve 6. The ultimate pressure of the vacuum chamber is 5×10'p@. The side walls 2.3 forming the vacuum chamber were coplanar as supporting plates for the components provided inside the vacuum chamber. Width: 500 stitches, thickness: 10 μm
The polyethylene substrate (hereinafter referred to as substrate) 16 is the core 10
It is wound up and set on the unwinding shaft 9. The unwinding shaft 9 is held by a fixture 8. The substrate 16 passes through a free roller 11 and is transferred to a deposition roller 1 with a diameter of 600 mm and a width of 700 mm.
The material runs along the outer periphery of the evaporating roller 2 in synchronization with the circumferential speed of the evaporating roller, and is wound onto the winding shaft via a free roller (not shown).

The vapor deposition roller 12 had one rotating shaft 15 fixed to the side plate 2 via a bearing 13 and the other fixed to the side plate 3 via a bearing and an oil noll 14, and the temperature of the vapor deposition roller was kept constant at 30°C. The cobalt 20 in the crucible 19 placed on the thin film formation haze 18 is heated and melted by the heat source 21 to evaporate the cobalt atoms, and the shutter 17 is opened on the surface of the substrate 16 on the continuously running vapor deposition roller 12. A thin film of cobalt is formed.

In order to irradiate the substrate surface with electrons before film formation, the electron beam accelerator is equipped with an anode 24 supported at both ends by insulators 25, and the electrons emitted from the cathode 23 are applied to the substrate 16 surface along the outer periphery of the vapor deposition roller 12. It is configured so that it is irradiated with light. FIG. 3 is a configuration diagram of the electron beam accelerator section seen from the front. 11 is a free roller. The electron beam accelerator has an anode of 24 degrees and a cathode of 23 degrees. The electron reflecting plate 22 was arranged in this order, a tungsten wire with a diameter of 0.51 m was used as the cathode 23, and the accelerator power source 3o was introduced via a high voltage cable 27 through an introduction terminal 27 into the vacuum chamber.

4 and 6 show other embodiments of the electron beam accelerator cathode. In FIG. 4, a tungsten wire 31 having a diameter of 2B was inserted into a spiral cathode 23a, and both ends of the tungsten wire 31 were fixed with insulators 26.

In FIG. 6, a straight cathode 23b is supported by a support wire 33 suspended from a tungsten wire 32 with a diameter of 2 to which both ☆:111 are fixed with an insulator 25.

In this example, the VCji7 is constructed as shown below, and the board is placed at 1012 pa by keeping the empty space in the vacuum chamber at 1012 pa.
While running continuously at a constant speed of /min, a thickness of 1.
000 cobalt thin films were formed. At this time, a power source was used that could change the current from Q to 600 mA.

Therefore, according to this embodiment, by irradiating the substrate surface with electrons immediately before forming the thin film, oil, moisture, adsorbed gas components, etc. on the substrate surface can be removed, and the adhesion between the substrate and the thin film is improved. In addition, a magnetic recording medium in which a thin film of magnetic material was formed had particularly good frequency characteristics compared to a magnetic recording medium without electron irradiation.

In addition, electron irradiation on the substrate causes the surface of the substrate to become negatively charged, which acts as an electrostatic attraction between the substrate and the deposition roller. This improves the adhesion between the substrate and the deposition roller, which increases the bonding force between the substrate and the deposition roller during the deposition process. The effect of removing the applied thermal energy from the substrate to the deposition roller by heat conduction also has the effect of preventing the substrate from becoming too hot. Therefore, 1) Thermal damage to the board is eliminated.

2) There is less substrate temperature, less outgassing from the substrate, and improvements in the direction of thin film deposition and magnetic properties.

moreover 3) The device is simple and inexpensive.

4) Since electrons can be irradiated uniformly in the width direction of the substrate, the uniformity of the thin film is good.

There are other effects.

Although the details of the vacuum evaporation method are explained in this example, the same effects as those of this example were obtained even when a similar electron beam accelerator was installed in an ion blating or sputtering device. Further, although the embodiments have been described in detail with reference to two specific shapes, two dimensions, thin film materials, etc., it is clear that the present invention is not limited to these.

Effects of the Invention The present invention is equipped with an electron beam accelerator and irradiates the substrate surface with electrons immediately before forming a thin film, thereby cleaning the substrate surface and improving the adhesion of the vapor deposited particles. Large thin films can be formed.

Furthermore, the electrification of the substrate brings the substrate into close contact with the deposition roller, allowing the heat received by the substrate to be efficiently transferred to the deposition roller, resulting in the formation of a high-quality thin film with little temperature rise on the substrate itself, which has great industrial effects. be.

[Brief explanation of drawings]

Fig. 1 is a top view of main parts of a conventional vacuum apparatus for forming continuous thin films, Fig. 2 is a side view of a vacuum apparatus for forming continuous thin films according to an embodiment of the present invention, and Fig. 3 is an old view of main parts. , FIG. 4, and FIG. 6 are perspective views of other embodiments of the electron beam accelerator. 12... Vapor deposition roller, 16... Substrate, 22...
...Electron reflector, 23-...Cathode, 24...
··anode. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 3 Figure 4 Figure 5

Claims (5)

[Claims] (1) A vacuum apparatus for continuously forming a thin film on a polymer molded substrate, which comprises an electron beam accelerator for substrate pretreatment installed in a vacuum chamber in addition to a heating source. (2) A vacuum apparatus for forming a continuous thin film according to claim 1, wherein the cathode of the electron beam accelerator faces the polymer molded substrate. (3) Continuous film formation according to claim 1, wherein the cathode of the electron beam accelerator is a wire with a diameter of 1 malt or more, and the length of the wire is longer than the length in the width direction of the polymer molded substrate. vacuum equipment. (4) An anode is provided between the cathode of the electron beam accelerator and the polymer molded substrate, and either or both of an electron reflecting metal plate is provided on the cathode and facing the polymer molded substrate. A vacuum apparatus for forming a continuous thin film according to claim 1. (5) The vacuum apparatus for forming a continuous thin film according to claim 4, wherein the cathode of the electron beam accelerator and the metal plate for electron reflection are at the same potential.