JPS60180836A - 熱硬化性樹脂フイルム積層体 - Google Patents
熱硬化性樹脂フイルム積層体Info
- Publication number
- JPS60180836A JPS60180836A JP3748784A JP3748784A JPS60180836A JP S60180836 A JPS60180836 A JP S60180836A JP 3748784 A JP3748784 A JP 3748784A JP 3748784 A JP3748784 A JP 3748784A JP S60180836 A JPS60180836 A JP S60180836A
- Authority
- JP
- Japan
- Prior art keywords
- film
- resin film
- present
- thermosetting resin
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims description 41
- 239000011347 resin Substances 0.000 title claims description 41
- 229920001187 thermosetting polymer Polymers 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- -1 acryl Chemical group 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 8
- 239000001273 butane Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 66
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000000576 coating method Methods 0.000 description 8
- 239000000976 ink Substances 0.000 description 8
- 239000012787 coverlay film Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000013039 cover film Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000003578 releasing effect Effects 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000011088 parchment paper Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3748784A JPS60180836A (ja) | 1984-02-28 | 1984-02-28 | 熱硬化性樹脂フイルム積層体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3748784A JPS60180836A (ja) | 1984-02-28 | 1984-02-28 | 熱硬化性樹脂フイルム積層体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60180836A true JPS60180836A (ja) | 1985-09-14 |
| JPH0553628B2 JPH0553628B2 (enrdf_load_stackoverflow) | 1993-08-10 |
Family
ID=12498875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3748784A Granted JPS60180836A (ja) | 1984-02-28 | 1984-02-28 | 熱硬化性樹脂フイルム積層体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60180836A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367143A (ja) * | 1986-09-09 | 1988-03-25 | 東洋紡績株式会社 | 熱硬化性樹脂フイルム積層体 |
| JPS6369640A (ja) * | 1986-09-11 | 1988-03-29 | 東洋紡績株式会社 | 熱硬化性樹脂フイルム積層体 |
| JPH02177599A (ja) * | 1988-12-28 | 1990-07-10 | Somar Corp | 絶縁層の形成方法及び印刷配線基板の電滋シールド化方法 |
| JPH0379477U (enrdf_load_stackoverflow) * | 1989-12-01 | 1991-08-13 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121070A (en) * | 1977-03-31 | 1978-10-23 | Matsushita Electric Works Ltd | Manufacture of bases for chemical plating |
| JPS58108788A (ja) * | 1981-12-23 | 1983-06-28 | 東芝ケミカル株式会社 | フレキシブル配線板の被覆方法 |
-
1984
- 1984-02-28 JP JP3748784A patent/JPS60180836A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121070A (en) * | 1977-03-31 | 1978-10-23 | Matsushita Electric Works Ltd | Manufacture of bases for chemical plating |
| JPS58108788A (ja) * | 1981-12-23 | 1983-06-28 | 東芝ケミカル株式会社 | フレキシブル配線板の被覆方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367143A (ja) * | 1986-09-09 | 1988-03-25 | 東洋紡績株式会社 | 熱硬化性樹脂フイルム積層体 |
| JPS6369640A (ja) * | 1986-09-11 | 1988-03-29 | 東洋紡績株式会社 | 熱硬化性樹脂フイルム積層体 |
| JPH02177599A (ja) * | 1988-12-28 | 1990-07-10 | Somar Corp | 絶縁層の形成方法及び印刷配線基板の電滋シールド化方法 |
| JPH0379477U (enrdf_load_stackoverflow) * | 1989-12-01 | 1991-08-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0553628B2 (enrdf_load_stackoverflow) | 1993-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |