JPS60174889A - Washing device - Google Patents

Abstract

PURPOSE:To prevent leakage of an org. gaseous solvent in a washing device and to condense and recover effectively the org. gaseous solvent in the stage of washing and drying plated products by an org. solvent by providing suction chamber for the org. paseous solvent of particularly a low temp. in the space of a washing and drying chamber. CONSTITUTION:A material subjected to a plating treatment is washed and is then put into an org. solvent liquid 2 such as trichloroethylene or the like contg. a surface active agent in a dewatering tank 1a in a working tank 1. The water on the plating surface is separated by the surface active agent and the material is dipped successively in a washing tank 1b contg. a heated org. solvent and a washing tank 1c contg. an org. solvent kept at a low temp. The material is thereafter pulled up. The cooled plating material having the org. solvent sticking thereto is stagnated above the liquid surface of the heated org. solvent 3 in a washing the drying tank 1d and is exposed to the gas 5 of the org. solvent kept at a high temp., by which the plating surface is dried. The gas 5 of the org. solvent enters the inside of a gas suction chamber 19 cooled to about -5 deg.C where the gas is cooled to condense and is recovered. The leakage of said gas to the outside and the pollusion of the working environment are thus obviated.

Description

DETAILED DESCRIPTION OF THE INVENTION 1. Industrial Application Field The present invention relates to a cleaning device, particularly a cleaning and drying device using an organic solvent.

2. Prior Art Conventionally, for example, the following steps (1) to (4) are carried out in the order of plating technology.

(1) Step of removing deposits such as oil from the surface of the product to be plated (pretreatment step).

(2) The process of immersing the thus cleaned product to be plated in a plating bath and applying plating (plating process)
0 (3), The process of pulling up the plated product from the plating tank and washing it with water (washing process) 0 (4) The process of draining and drying the washed product (drying process) 0 Of the steps (11 to (4)) above, in the pretreatment step (1), deposits must be completely removed and the product to be plated must be prevented from being damaged.

In addition, in the drying step (4), moisture must be dried uniformly and completely, and uneven drying or drying that leaves water droplets must be avoided as much as possible. This is because after the drying process, when the "uneven" areas and water droplets evaporate naturally, they adsorb dust in the atmosphere, and as a result, after the natural evaporation, forge marks and water scales remain.

Therefore, in order to perform cleaning and drying while satisfying the above conditions, cleaning and drying equipment using organic solvents has come to be used.

A conventional example of this type of washing and drying apparatus using an organic solvent will be explained with reference to FIG. According to FIG. 1, the bottom of the working tank 1 containing the organic solvent is divided into a draining tank 1a and a first cleaning tank 1b.
, a second cleaning tank IC, and a cleaning/drying tank 1d. The draining tank 1a contains an organic solvent 2 mixed with a surfactant, and the washing tanks 1b, lc and the washing/drying tank 1d contain an organic solvent 3 free of contaminants. In other words, piping (not shown) is provided so that the organic solvent 2 that has flowed into the draining tank 1a flows out of the tank from a portion near the liquid surface. Further, the organic solvent 3 is purified along the path of cleaning tank 1c→cleaning tank ib→washing/drying tank 1d and is reused. Furthermore, tanks 1a and lb.

A heater 4 is installed on each bottom surface of 1d. This heater heats the organic solvent 2.3 to generate organic solvent gas or vapor 5, and the space in the working tank 1 is filled with this organic solvent gas 5. On the other hand, a cooling pipe 6 is arranged in a coil shape along the inner surface of the side wall of the work tank 1, and cooling water or a cooling gas such as 7 Leon is made to flow inside this pipe.

A solvent recovery gutter 7 is provided below the cooling pipe 6.
Therefore, the organic solvent gas 5 comes into contact with the cooling pipe 6 and is condensed.
The organic solvent condensed into droplets flows down into the recovery gutter 7, is recovered, and is returned to the cleaning tank IC. In this way, leakage of the organic solvent gas 5 from the top opening of the working tank 1 to the outside of the tank is reduced. In addition, as the above-mentioned organic solvent, trichlorethylene, 1. 1. 1-trichloroethane, methylene chloride, trichlorotrifluoroethane, etc. are used.

The series of processes for draining and drying plated products that have already been washed with water using the apparatus shown in Figure 1 are as follows: - (1)
~ (PJ) is carried out.

(I) The plated product 8 with attached water droplets is immersed in the organic solvent 2 in the draining tank 1a. As a result, the water droplets are separated from the plated product by the action of the surfactant and floated to the surface of the liquid. The water droplets are discharged to the outside of the tank together with the organic solvent 2. Thereafter, the plating product is lifted out of the total organic solvent 2, the water droplets are removed, and a plating product is obtained by draining and drying. However, in this case, since the surfactant remains attached to the surface of the plated product, the surfactant is removed by the cleaning step described below.

(9) The drained product is once immersed in the organic solvent 3 in the cleaning tank 1b and then pulled up. Since the organic solvent 3 in the cleaning tank lb is heated to a high temperature by the heater 4,
The surfactant adhering to the product is well dissolved and most of it is washed (■).Next, the product is removed from the cleaning tank 1b and immersed in the organic solvent 3 in the cleaning tank IC. This cleaning tank 1
Since the clean organic solvent 3 flows into the tank c from the recovery gutter 7, further cleaning can be performed with this clean organic solvent 3.

At the same time, the plated product is cooled to below the boiling point of the organic solvent 3. This is a cooling pipe (
This is because the organic solvent 3 in this tank IC is cooled in advance because the tank IC is provided with a tank IC (not shown).

(■) As shown by the dashed line in FIG.
The liquid is allowed to remain above the liquid level of the organic solvent 3 in the cleaning/drying tank 1d for a while and exposed to the organic solvent gas 5 which is at a high temperature.

As a result, the organic solvent gas 5 condenses on the surface of the plated product being cooled, and the organic solvent in the form of droplets flows down one after another along the surface of the plated product and falls. The flow of such droplets allows complete cleaning of the plated product. When the temperature of the plated product eventually reaches a temperature equivalent to the boiling point of the organic solvent, the organic solvent gas 5 no longer condenses on the surface of the plated product and the surface of the plated product dries. When this state is reached, the plated product is pulled up and taken out of the working tank 1.

The above series of operations completes draining, washing and drying of the plated product.

In addition, in the above-mentioned plating pretreatment step for removing deposits such as oil, the above step (I) is omitted, and the step (I) is omitted.
All you have to do is start with step I). In this case as well, deposits such as oil can be removed in the same manner as with the surfactant described above.

However, as a result of the inventor's study of the conventional device described above, he discovered that it has the following defects. That is, if the organic solvent gas 5 is condensed and recovered by the cooling pipe 6 and the recovery gutter 7, leakage of the organic solvent gas 5 from the top opening of the working tank 1 can be reduced to some extent, but this is still not sufficient.

For this reason, there is still a large loss of solvent, which is uneconomical, and there is also a risk that the leaked organic solvent gas 5 may harm the health of workers.

In order to eliminate these drawbacks, it is possible to raise the height of the working tank 1 and further lower the temperature of the cooling pipe 6 to increase the recovery efficiency, but doing so will cause new problems. In the former case, it becomes difficult to immerse the plated products 8 in each tank one after another while suspending them. In the latter case, the temperature inside the work tank 1 will be lower than necessary, so the plated product will become too cold while being lifted from the tank 1d, and the moisture in the air will be cold at the position outside the work tank 1. It is unsuitable because it condenses on the plated product. Therefore, the temperature of the cooling pipe 6 is +10° at most.
The reality is that it can only be set between C and +15°C.

3. OBJECT OF THE INVENTION In view of the above-mentioned circumstances, an object of the present invention is to provide an apparatus that can significantly reduce gas leakage of cleaning liquid while maintaining good working efficiency and cleaning effect.

4. Structure of the invention, that is, the present invention provides cleaning solutions (particularly organic solvents such as those mentioned above).
a storage tank for accommodating the storage tank, a heating means (for example, a heater disposed in the tank) for heating the cleaning liquid in the storage tank, and a side wall of the storage tank for condensing the gas of the cleaning liquid generated in the storage tank. In a cleaning device (particularly a cleaning/drying device) having a cooling means (for example, a cooling pipe as described above) provided along the The cleaning device is characterized in that a cooling space is provided outside the means, and the cooling space is configured to have a lower temperature than the inner space of the storage tank.

5. Examples Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

However, in this embodiment, the same parts as those in the prior art shown in FIG. 1 are denoted by the same reference numerals, and their explanation may be omitted.

2 to 4 show a first embodiment of the present invention.

In Figures 2 and 3, 1 is a working tank, 11L is a draining tank, 1b and 1c are cleaning tanks, 1d is a washing and drying tank, 2 and 3 are organic solvents, 4 is a heater, 5 is an organic solvent gas, and 6 1 is a cooling pipe, and 7 is a solvent recovery gutter, which are the same as the conventional device shown in FIG. The noteworthy structure of this embodiment is that a gas suction tank 18 is attached to the outer circumferential side of the work tank 1, and the gas suction space 19 formed in the gas suction tank 18 is connected to the inner space 17 of the work tank 1. The gas suction tank 1
8, a cooling pipe 20 is arranged in a coil shape. Refrigerants 22a and 22b, which are sent out from a common cooling device 21 and branched into two on the way, are introduced into this cooling pipe addition and the cooling pipe 6, respectively. As shown in FIG. 4, the branched amounts of these refrigerants are controlled by the pulps 24a and 24b, respectively, and supplied to the cooling pipes 2G and 6, thereby adjusting the cooling amount of each cooling pipe.

That is, the temperature (single layer) of the suction space 19 is adjusted to be lower than the temperature (T, ) of the inner space 17 of the work tank 1, especially the upper half space of the work tank l. Specifically, the temperature (T) of the upper half space of the work tank 1 is +10 as before.
°C to +15°C.

This temperature (T2) is designed to avoid the problem of the plated product being excessively cooled when it is pulled up and taken out of the tank, and moisture in the air condensing and adhering to the plated product outside the tank. It is set taking into consideration that the organic solvent gas 5 can be efficiently recovered by the pipe 6. In addition, the temperature (T1) of the suction space 19 is lower than the above-mentioned T2, for example, from -5°C to
Set to 0°C.

Since the temperature of the first suction space 19 is thus low, a large amount of the organic solvent gas 5 is condensed into the cooling pipe 20. As a result, the concentration of the organic solvent gas 5 in the suction space 19 decreases.
The concentration of water also decreases. In other words, since the gas concentration on the working tank 1 side is high and the gas concentration in the suction space 19 is low,
A concentration gradient occurs between the two. Therefore, the organic solvent gas 5 that boils from the solvent surface and fills the working tank 1 flows toward the suction space 19 as shown in the figure, and enters the suction space 19 through between the cooling pipes 6. In this way, suction space 1
The organic solvent gas 5 sucked into the cooling pipe 2o is cooled and condensed. The resulting condensate 3' is collected in a water separator, where it is regenerated into a solvent 3, and then returned to, for example, the washing/drying tank 1d or the washing tank 1b for reuse.

In this way, due to the presence of the gas suction space 19 provided as an additional cooling space, the organic solvent gas 5 is absorbed into the working tank 1.
This sufficiently prevents leakage from the top opening, allowing for efficient recovery and reuse. As a result, cleaning,
Drying work can be performed efficiently and safely.
In particular, there is no need to raise the height of the work tank 1 as mentioned above.
Moreover, the temperature of the cooling pipe 6 can be set to an appropriate value and operated.

In this embodiment, the suction tank 18 is attached to a part of the working tank 1 (the left side in the drawing), but it may be attached to the right side in the drawing (i.e., the tank ld side), or the suction tank 18 K may be provided on the long side of l (upper side and/or lower side in FIG. 3).
Furthermore, the suction tank 18 may be provided all around the prrwtzy working tank 1. In addition, each of the above 1
The configurations of a, lb, lc, and ld may be changed in various ways. For example, the second cleaning tank 1c may be provided with an oscillator for ultrasonic cleaning. Further, the method of inflowing and outflowing the solvent in each calibration is not limited to the above-mentioned method, and may be changed in various ways. Furthermore, when removing deposits such as oil in the plating pre-treatment process, it is recommended that the process is started from the fourth cleaning tank 1b without using (or not providing) the draining tank 1a.

5 and 86 show a second embodiment of the present invention.

In this embodiment, the cooling pipes are arranged in a coiled manner so as to surround the outer periphery of the cooling pipe 6 arranged in a coiled manner, and the cooling pipes are arranged in a coiled manner so as to surround the outer periphery of the cooling pipe 6 arranged in a coiled manner. A net-like cylinder 32 is interposed which also serves to hold 6. For this reason,
The gas suction space 19 and the inner space 17 of the work tank 1 are connected to a cylinder 32.
are connected through the mesh. Further, a solvent recovery gutter 31 is installed below the cooling pipe 20. Note that other parts are substantially the same as in the first embodiment described above. However,
The cooling device and moisture separator described above are not shown.

In this second embodiment, the cooling pipe 20 and the suction space 1
The temperature inside the tank 9 is made lower than the temperature in the inner space 17 of the work tank 1. Therefore, similarly to the first embodiment described above, the organic solvent gas 5 filling the working tank 1 flows toward the suction space 19, and its leakage is prevented.
Work efficiency will also be improved. Since the suction space 19 is provided all around the inner surface of the side wall of the working tank 1, the recovery rate of the solvent can be increased, and the existing working tank 1 itself can be used.

Although the present invention has been illustrated above, the embodiments described above can be further modified based on the technical idea of the present invention.

For example, the number of processing tanks such as cleaning tanks in the working tank 1 may be varied, and depending on the case, processing may be performed such that the above-mentioned washing and drying tank can also be omitted. The cooling means and heating means are not limited to those described above. Furthermore, in the same way as in the second embodiment, a net-like cylinder may be interposed between the spaces 17-19 in the first embodiment. In the example above,
Although the case of cleaning and drying plated products has been described, the same apparatus can also be used to clean and dry other products such as stain parts. The present invention can be applied to all cleaning and drying apparatuses using organic solvents, regardless of the object to be washed or dried.

6. Effects of the Invention As described above, the present invention provides a cooling space at a lower temperature outside the cooling means, so that the gas of the cleaning liquid such as an organic solvent creates a concentration gradient and is efficiently sucked into the cooling space. be done.

Therefore, it is possible to prevent the cleaning liquid from leaking from the upper opening of the tank, thereby reducing the loss of the cleaning liquid. Furthermore, it is possible to prevent workers from inhaling gas.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing a conventional washing and drying apparatus. 2 to 6 show the implementation ρ1 of the present invention, FIG. 2 is a longitudinal cross-sectional view of the washing/drying apparatus according to the first embodiment, and FIG. 3 is the line ■-■ in FIG. 1. Horizontal cross-sectional view Figure 4 is a flow diagram showing the refrigerant supply method, and Figure 5 is a flow diagram showing the refrigerant supply method.
FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 5. In addition, in the symbols shown in the drawings, 1.
Working tank 2.3-・・・・・・・・・・・・・・Organic solvent 4・・・・-・・・・・・・・・・・・・・・・・・・
・・・Heater 5・−・−・・・・・・・・・・・・・・・・
・・・・・・・・・Organic solvent gas 6, addition・・・・・・・・・・
・・・・・・Cooling pipe 7.31・・・・・・・・・・・・
...Recovery gutter 8...
・・・・・・・・・Plating product 1B・・・・・・・・・・・・・・・
・・・・・・－・・・・・・Suction tank 19・・・・・・
・・・・・−・・・・・・・・・・・・Suction space (cooling space) 21 ・・・・・・・・・・・・・・・・・・−
...Cooling devices 22a, 22b - Refrigerant prisoner...
It is a moisture separator.

Claims (1)

[Claims] 1. A storage tank for storing a cleaning liquid, a heating means for heating the cleaning liquid in the storage tank, and a cooling device provided along a side wall of the storage tank to condense the gas of the cleaning liquid generated in the storage tank. In the cleaning device, a cooling space is provided outside the cooling means in communication with the inner space of the storage tank inside the cooling means, and the cooling space is more than the inner space of the storage tank. A cleaning device characterized in that the cleaning device is configured to have a low temperature.