JPS60174889A - Washing device - Google Patents
Washing deviceInfo
- Publication number
- JPS60174889A JPS60174889A JP59028305A JP2830584A JPS60174889A JP S60174889 A JPS60174889 A JP S60174889A JP 59028305 A JP59028305 A JP 59028305A JP 2830584 A JP2830584 A JP 2830584A JP S60174889 A JPS60174889 A JP S60174889A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- org
- solvent
- gas
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/04—Apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Drying Of Solid Materials (AREA)
Abstract
Description
【発明の詳細な説明】
１、産業上の利用分野
本発明は洗浄装置、特に有機溶剤による洗浄乾燥装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION 1. Industrial Application Field The present invention relates to a cleaning device, particularly a cleaning and drying device using an organic solvent.
２、従来技術
従来、例えばめっき技術社次の（１）〜（４）の工程順
に実施されている。2. Prior Art Conventionally, for example, the following steps (1) to (4) are carried out in the order of plating technology.
（１）、被めっき製品の表面に付着した油等の付着物を
除去する工程（前処理工程）。(1) Step of removing deposits such as oil from the surface of the product to be plated (pretreatment step).
（２）、これによって清浄された被めっき製品をめっき
槽中に浸漬させ、めっきを施す工程（めっき処理工程）
０
（３）、めっきされためシき製品をめっき槽から引き上
げ、これを水洗いする工程（水洗処理工程）０
（４）、水洗いされためりき製品を水切シして乾燥させ
る工程（乾燥工程）０
上記（１１〜（４）の工程のうち、（１）の前処理工程
においては、付着物を完全に除去し、かつ被めっき製品
に損傷を与えないようにしなければならない。(2) The process of immersing the thus cleaned product to be plated in a plating bath and applying plating (plating process)
0 (3), The process of pulling up the plated product from the plating tank and washing it with water (washing process) 0 (4) The process of draining and drying the washed product (drying process) 0 Of the steps (11 to (4)) above, in the pretreatment step (1), deposits must be completely removed and the product to be plated must be prevented from being damaged.
また、（４）の乾燥工程では、水分を均一かつ完全に乾
燥させなければならず、不均一な「むら」のある乾燥や
水滴が残るような乾燥を行なうことは極力避けなけれに
ならない。 これは、乾燥工程後に、「むら」の部分や
水滴が自然蒸発する際に大気中の塵埃を吸着し、このた
めに自然蒸発後に鍛痕状の汚れや水垢が残ってしまうか
らである。In addition, in the drying step (4), moisture must be dried uniformly and completely, and uneven drying or drying that leaves water droplets must be avoided as much as possible. This is because after the drying process, when the "uneven" areas and water droplets evaporate naturally, they adsorb dust in the atmosphere, and as a result, after the natural evaporation, forge marks and water scales remain.
そζで、上記条件を満足しつつ洗浄、乾燥を行なうため
に、有機溶剤を用いた洗浄乾燥装置が用いられるように
なっている。Therefore, in order to perform cleaning and drying while satisfying the above conditions, cleaning and drying equipment using organic solvents has come to be used.
この種の有機溶剤による洗浄乾燥装置の従来例を第１図
について説明する。 第１図によれば、有機溶剤を収容
した作業槽１の底部は、水切槽１ａと、第１洗浄槽１ｂ
と、第２洗浄槽ＩＣと、洗浄乾燥槽１ｄとに分けられて
いる。 水切槽１ａには、界面活性剤を混合した有機溶
剤２が収容されておシ、洗浄槽１ｂ、 ｌｃ及び洗浄乾
燥槽１ｄには、混入物のない有機溶剤３が夫々収容され
ている。 そして、列えば、水切槽１ａに流入した有機
溶剤２が、その液面の近傍部分から槽外に流出するよう
配管（図示せず）が設けられている。 また、有機溶剤
３が、洗浄槽１ｃ→洗浄槽ｉｂ→洗浄乾燥槽１ｄの経路
は浄化され、再使用される。 更に、槽１ａ、ｌｂ。A conventional example of this type of washing and drying apparatus using an organic solvent will be explained with reference to FIG. According to FIG. 1, the bottom of the working tank 1 containing the organic solvent is divided into a draining tank 1a and a first cleaning tank 1b.
, a second cleaning tank IC, and a cleaning/drying tank 1d. The draining tank 1a contains an organic solvent 2 mixed with a surfactant, and the washing tanks 1b, lc and the washing/drying tank 1d contain an organic solvent 3 free of contaminants. In other words, piping (not shown) is provided so that the organic solvent 2 that has flowed into the draining tank 1a flows out of the tank from a portion near the liquid surface. Further, the organic solvent 3 is purified along the path of cleaning tank 1c→cleaning tank ib→washing/drying tank 1d and is reused. Furthermore, tanks 1a and lb.
１ｄの各底面にはヒータ４が設置されている。 このヒ
ータによって、有機溶剤２．３が加熱されて有機溶剤の
ガス又は蒸気５が発生し、この有機溶剤ガス５が作業槽
１内の空間に 充満する。 一方、作業槽１の側壁内面
に沿って冷却管６がコイル状に配設されておシ、この内
部には冷却水若しくは７レオン等の冷却ガスが流通せし
められる。A heater 4 is installed on each bottom surface of 1d. This heater heats the organic solvent 2.3 to generate organic solvent gas or vapor 5, and the space in the working tank 1 is filled with this organic solvent gas 5. On the other hand, a cooling pipe 6 is arranged in a coil shape along the inner surface of the side wall of the work tank 1, and cooling water or a cooling gas such as 7 Leon is made to flow inside this pipe.
冷却管６の下方には溶剤回収樋７が備えられている。
従って、有機溶剤ガス５は冷却管６に接触して凝縮に１
凝縮して液滴となった有機溶剤は、回収樋７内に流下し
て回収され、洗浄槽ＩＣに戻される。 こうして、有機
溶剤ガス５が作業槽１の上面開口から槽外に漏出するこ
とが少なくなるとしている。 なお、上記した有機溶剤
としては、トリクロルエチレン、１． １． １−トリ
クロルエタン、塩化メチレン、トリクロルトリフルオロ
エタン等が用いられる。A solvent recovery gutter 7 is provided below the cooling pipe 6.
Therefore, the organic solvent gas 5 comes into contact with the cooling pipe 6 and is condensed.
The organic solvent condensed into droplets flows down into the recovery gutter 7, is recovered, and is returned to the cleaning tank IC. In this way, leakage of the organic solvent gas 5 from the top opening of the working tank 1 to the outside of the tank is reduced. In addition, as the above-mentioned organic solvent, trichlorethylene, 1. 1. 1-trichloroethane, methylene chloride, trichlorotrifluoroethane, etc. are used.
第１図に示した装置によシ、既に水洗いされためっき製
品を水切、乾燥する一連のプロセスは、 −次の（１）
〜（ＰＪ）のように行なわれる。The series of processes for draining and drying plated products that have already been washed with water using the apparatus shown in Figure 1 are as follows: - (1)
~ (PJ) is carried out.
（Ｉ）、水滴の付着しためつき製品８を水切槽１ａの有
機溶剤２中に浸漬する０ これによって、界面活性剤の
作用で水滴をめっき製品から分離して液面上に浮上させ
、この水滴を有機溶剤２とともに槽外に排出する０ そ
の後、めっき製品全有機溶剤２から引き上げると、水滴
が除去されて水切、乾燥されためつき製品を得る。 し
かし、この場合、めっき製品の表面には界面活性剤が付
着したままであるため、次に述べる洗浄工程によシ界面
活性剤を除去する。(I) The plated product 8 with attached water droplets is immersed in the organic solvent 2 in the draining tank 1a. As a result, the water droplets are separated from the plated product by the action of the surfactant and floated to the surface of the liquid. The water droplets are discharged to the outside of the tank together with the organic solvent 2. Thereafter, the plating product is lifted out of the total organic solvent 2, the water droplets are removed, and a plating product is obtained by draining and drying. However, in this case, since the surfactant remains attached to the surface of the plated product, the surfactant is removed by the cleaning step described below.
（９）、水切されためつき製品を洗浄槽１ｂの有機溶剤
３中に一旦浸漬してから引き上げる。 洗浄槽ｌｂ中の
有機溶剤３は、ヒータ４により高温となっているため、
製品に付着している界面活性剤は、良好に溶けて大部分
が洗浄される０
（■）、次に、洗浄槽１ｂから引き上げためつき製品を
洗浄槽ＩＣの有機溶剤３中に浸漬する０ この洗浄槽１
ｃには、回収樋７から清浄な有機溶剤３を流入させるた
め、この清浄な有機溶剤３により更に洗浄を行なえる。(9) The drained product is once immersed in the organic solvent 3 in the cleaning tank 1b and then pulled up. Since the organic solvent 3 in the cleaning tank lb is heated to a high temperature by the heater 4,
The surfactant adhering to the product is well dissolved and most of it is washed (■).Next, the product is removed from the cleaning tank 1b and immersed in the organic solvent 3 in the cleaning tank IC. This cleaning tank 1
Since the clean organic solvent 3 flows into the tank c from the recovery gutter 7, further cleaning can be performed with this clean organic solvent 3.
これと同時に、めっき製品を冷却し、有機溶剤３の沸
点以下に冷却する。 これは、洗浄槽ＩＣ内に冷却管（
図示せず）を設けているため、この槽ＩＣ内の有機溶剤
３が予め冷却されているからである。At the same time, the plated product is cooled to below the boiling point of the organic solvent 3. This is a cooling pipe (
This is because the organic solvent 3 in this tank IC is cooled in advance because the tank IC is provided with a tank IC (not shown).
（■）、洗浄槽１ｃで冷却された後、同情から引き上げ
られためっき製品８を、第１図に一点鎖線で示す如く、
洗浄乾燥槽１ｄの有機溶剤３の液面上方にしばらくの間
停留せしめ、高温となっている有機溶剤ガス５に曝す。(■) As shown by the dashed line in FIG.
The liquid is allowed to remain above the liquid level of the organic solvent 3 in the cleaning/drying tank 1d for a while and exposed to the organic solvent gas 5 which is at a high temperature.
これによって、冷却されているめっき製品の表面上で
有機溶剤ガス５が凝縮し、液滴となった有機溶剤が次々
とめつき製品の表面に沿って流下し、落下する。 この
ような液滴の流下により、めっき製品を完全に洗浄でき
る。 やがてめっき製品が有機溶剤の沸点と同等の温度
になると、有機溶剤ガス５がめつき製品表面で凝縮しな
くな夛、めっき製品の表面は乾燥する。 この状態にな
った時点でめっき製品を引き上げ、作業槽１の外部に取
出す。As a result, the organic solvent gas 5 condenses on the surface of the plated product being cooled, and the organic solvent in the form of droplets flows down one after another along the surface of the plated product and falls. The flow of such droplets allows complete cleaning of the plated product. When the temperature of the plated product eventually reaches a temperature equivalent to the boiling point of the organic solvent, the organic solvent gas 5 no longer condenses on the surface of the plated product and the surface of the plated product dries. When this state is reached, the plated product is pulled up and taken out of the working tank 1.
以上の一連の操作によシ、めりき製品の水切シ、洗浄並
びに乾燥が完了する。The above series of operations completes draining, washing and drying of the plated product.
なお、油等の付着物を除去するだめの上記しためっき前
処理工程においては、上記（Ｉ）の工程は省略し、（Ｉ
Ｉ）の工程から始めわｉばよい。 この場合も、上記し
た界面活性剤と同様にして油等の付着物を除去できる。In addition, in the above-mentioned plating pretreatment step for removing deposits such as oil, the above step (I) is omitted, and the step (I) is omitted.
All you have to do is start with step I). In this case as well, deposits such as oil can be removed in the same manner as with the surfactant described above.
しかしながら、本発明者が上述した従来の装置に検討を
加えた結果、次の如き欠陥があることを見出した。 即
ち、冷却管−６及び回収樋７によって有機溶剤ガス５を
凝縮、回収すれば、有機溶剤ガス５が作業槽１の上面開
口から漏出することをある程度は少なくできるが、未べ
充分ではない。However, as a result of the inventor's study of the conventional device described above, he discovered that it has the following defects. That is, if the organic solvent gas 5 is condensed and recovered by the cooling pipe 6 and the recovery gutter 7, leakage of the organic solvent gas 5 from the top opening of the working tank 1 can be reduced to some extent, but this is still not sufficient.
このため、溶剤の損失が依然として多く、不経済でアシ
、シかも漏出した有機溶剤ガス５が作業者の健康を害す
る等の恐れもある。For this reason, there is still a large loss of solvent, which is uneconomical, and there is also a risk that the leaked organic solvent gas 5 may harm the health of workers.
こうした欠点を除くには、作業槽１の高さを高くしたシ
、冷却管６の温度を更に低くして回収効率を上げること
が考えられるが、このようにすると新たな問題が発生し
てしまう０ つまシ、前者の場合には、めっき製品８を
吊シ下げながら次々と各槽中に浸漬する作業が行ない難
くなる。 また、後者の場合には、作業槽１内の温度が
必要以上に低くなるため、槽１ｄから引き上げる途中で
めりき製品が冷えすぎ、作業槽１外に出た位置で空気中
の水分が冷たいめっき製品上で凝縮してしまい、不適当
である。 従って、冷却管６の温度はせいぜい＋１０°
Ｃ〜＋１５°Ｃにしか設定できないのが実情である。In order to eliminate these drawbacks, it is possible to raise the height of the working tank 1 and further lower the temperature of the cooling pipe 6 to increase the recovery efficiency, but doing so will cause new problems. In the former case, it becomes difficult to immerse the plated products 8 in each tank one after another while suspending them. In the latter case, the temperature inside the work tank 1 will be lower than necessary, so the plated product will become too cold while being lifted from the tank 1d, and the moisture in the air will be cold at the position outside the work tank 1. It is unsuitable because it condenses on the plated product. Therefore, the temperature of the cooling pipe 6 is +10° at most.
The reality is that it can only be set between C and +15°C.
３、発明の目的
本発明の目的は、上記の状況に鑑み、作業効率及び洗浄
効果を良好に保持しつつ洗浄液のガスの漏出を大幅に減
少させることのできる装置を提供することにある。3. OBJECT OF THE INVENTION In view of the above-mentioned circumstances, an object of the present invention is to provide an apparatus that can significantly reduce gas leakage of cleaning liquid while maintaining good working efficiency and cleaning effect.
４、発明の構成
即ち、本発明は、洗浄液（特に上述した如き有機溶剤）
を収容する収容槽と、この収容槽内の洗浄液を加熱する
加熱手段（例えば槽内に配されたヒータ）と、前記収容
槽内で生じる前記洗浄液のガスを凝縮せしめるために前
記収容槽の側壁に沿って設けられた冷却手段（例えば上
述した如き、冷却管）とを有する洗浄装置（特に洗浄乾
燥装置）において、前記冷却手段よシ内側の前記収容槽
の内空間に連通した状態で前記冷却手段の外側に冷却空
間が設けられ、この冷却空間が前記収容槽の前記内空間
よシも低温度となるように構成されていることを特徴と
する洗浄装置に係るものである。4. Structure of the invention, that is, the present invention provides cleaning solutions (particularly organic solvents such as those mentioned above).
a storage tank for accommodating the storage tank, a heating means (for example, a heater disposed in the tank) for heating the cleaning liquid in the storage tank, and a side wall of the storage tank for condensing the gas of the cleaning liquid generated in the storage tank. In a cleaning device (particularly a cleaning/drying device) having a cooling means (for example, a cooling pipe as described above) provided along the The cleaning device is characterized in that a cooling space is provided outside the means, and the cooling space is configured to have a lower temperature than the inner space of the storage tank.
５、実施例 以下、本発明の実施例を図面について詳細に説明する。5. Examples Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
但、本実施例では、第１図に示した従来技術と同一部
分には同一符号を付し、その説明を省略することがある
。However, in this embodiment, the same parts as those in the prior art shown in FIG. 1 are denoted by the same reference numerals, and their explanation may be omitted.
第２図〜第４図は本発明の第１の実施例を示すものであ
る。2 to 4 show a first embodiment of the present invention.
第２図及び第３図において、１は作業槽、１１Ｌは水切
槽、１ｂ及び１ｃは洗浄槽、１ｄは洗浄乾燥槽、２及び
３は有機溶剤、４はヒータ、５は有機溶剤ガス、６は冷
却管、７は溶剤回収樋であり、これらは第１図の従来装
置と同様である。 本実施列で注目すべき構成は、作業
槽ｌの外周側にガス吸引槽１８が付設されていて、仁の
ガス吸引槽１８内に形成されたガス吸引空間１９が作業
槽１の内空間１７に連通せしめられ、更にガス吸引槽１
８内にはコイル状に冷却管２０が配設されていることで
ある。 この冷却管加及び上記冷却管６には、共通の冷
却装置２１から送出されて途中で二つに分岐された冷媒
２２ａ、 ２２ｂが夫々導入される。 これらの冷媒の
分岐量は第４図に示す如くにパルプ２４ａ、２４ｂで夫
々制御されて冷却管２Ｇ、６に供給され、これによって
各冷却管の冷却量が調整される。In Figures 2 and 3, 1 is a working tank, 11L is a draining tank, 1b and 1c are cleaning tanks, 1d is a washing and drying tank, 2 and 3 are organic solvents, 4 is a heater, 5 is an organic solvent gas, and 6 1 is a cooling pipe, and 7 is a solvent recovery gutter, which are the same as the conventional device shown in FIG. The noteworthy structure of this embodiment is that a gas suction tank 18 is attached to the outer circumferential side of the work tank 1, and the gas suction space 19 formed in the gas suction tank 18 is connected to the inner space 17 of the work tank 1. The gas suction tank 1
8, a cooling pipe 20 is arranged in a coil shape. Refrigerants 22a and 22b, which are sent out from a common cooling device 21 and branched into two on the way, are introduced into this cooling pipe addition and the cooling pipe 6, respectively. As shown in FIG. 4, the branched amounts of these refrigerants are controlled by the pulps 24a and 24b, respectively, and supplied to the cooling pipes 2G and 6, thereby adjusting the cooling amount of each cooling pipe.
即ち、吸引空間１９の温度（１重）が、作業槽１の内空
間１７、特に作業槽ｌの上半部空間の温度（Ｔ、）よシ
も低くなるように調整される。 具体的に言えば、作業
槽１の上半部空間の温度（Ｔ意）は従来と同様に＋１０
°Ｃ〜＋１５°Ｃとなるようにしている。That is, the temperature (single layer) of the suction space 19 is adjusted to be lower than the temperature (T, ) of the inner space 17 of the work tank 1, especially the upper half space of the work tank l. Specifically, the temperature (T) of the upper half space of the work tank 1 is +10 as before.
°C to +15°C.
この温度（Ｔ２）は、めっき製品を引き上げて槽外に取
シ出すときにめっき製品が過度に冷えて槽外で空気中の
水分がめりき製品に凝縮、付着するという問題を回避し
つつ、冷却管６で有機溶剤ガス５を効率良く回収できる
ととを考慮して設定される。 また、吸引空間１９の温
度（Ｔ１）は、上記Ｔ２よシも低温の例えば−５°Ｃ〜
０°Ｃに設定される。This temperature (T2) is designed to avoid the problem of the plated product being excessively cooled when it is pulled up and taken out of the tank, and moisture in the air condensing and adhering to the plated product outside the tank. It is set taking into consideration that the organic solvent gas 5 can be efficiently recovered by the pipe 6. In addition, the temperature (T1) of the suction space 19 is lower than the above-mentioned T2, for example, from -5°C to
Set to 0°C.
このように１吸引空間１９の温度が低くなっているので
、冷却管２０によシ多量の有機溶剤ガス５が凝結される
ことになる。 この結果、吸引空間１９内の有機溶剤ガ
ス５の濃度は、作業槽１の内空間１７の有機溶剤ガス５
の濃度よシも低くなる。 換言すれば、作業槽１側のガ
ス濃度が高く、吸引空間１９内のガス濃度が低いため、
両者間に濃度勾配が発生する。 従って、溶剤液面から
沸騰して作業槽１内に充満した有機溶剤ガス５は、図示
の如くに吸引空間１９に向って流動し、冷却管６の間を
通して吸引空間１９へ侵入する。 こうして吸引空間１
９に吸引された有機溶剤ガス５は冷却管２ｏにょシ冷却
されて凝縮する。 得られた凝縮液３′は水分分離器幻
に回収され、ここで溶剤３に再生されてから、例えば洗
浄乾燥槽１ｄ又は洗浄槽１ｂに戻され、再使用される。Since the temperature of the first suction space 19 is thus low, a large amount of the organic solvent gas 5 is condensed into the cooling pipe 20. As a result, the concentration of the organic solvent gas 5 in the suction space 19 decreases.
The concentration of water also decreases. In other words, since the gas concentration on the working tank 1 side is high and the gas concentration in the suction space 19 is low,
A concentration gradient occurs between the two. Therefore, the organic solvent gas 5 that boils from the solvent surface and fills the working tank 1 flows toward the suction space 19 as shown in the figure, and enters the suction space 19 through between the cooling pipes 6. In this way, suction space 1
The organic solvent gas 5 sucked into the cooling pipe 2o is cooled and condensed. The resulting condensate 3' is collected in a water separator, where it is regenerated into a solvent 3, and then returned to, for example, the washing/drying tank 1d or the washing tank 1b for reuse.
このように、付加的な冷却空間として設けられたガス吸
引空間１９の存在によって、有機溶剤ガス５が作業槽１
の上面開口から漏出することを充二分に防止し、効率良
く回収、再使用することができる。 この結果、洗浄、
乾燥作業を効率良くかつ安全に行なうことができる。
特に、既述した如くに作業槽１を高くする必要はなく、
かつ冷却管６の温度も適切な値に設定して操作す右こと
が−できる。In this way, due to the presence of the gas suction space 19 provided as an additional cooling space, the organic solvent gas 5 is absorbed into the working tank 1.
This sufficiently prevents leakage from the top opening, allowing for efficient recovery and reuse. As a result, cleaning,
Drying work can be performed efficiently and safely.
In particular, there is no need to raise the height of the work tank 1 as mentioned above.
Moreover, the temperature of the cooling pipe 6 can be set to an appropriate value and operated.
なお、この実施例では、作業槽１の一部（図面では左側
部）に吸引槽１８を付設しているが、図面右側部（即ち
槽ｌｄ側）に付設してもよいし、或いは作業槽ｌの長辺
側（第３図の上辺及び／又は下辺）Ｋ設けてもよい。
更には、〆ｐｒｒｗｔｚｙ作業槽１の全周に亘って吸引
槽１８を備えるようにしてもよい。 また、上記各種１
ａ、 ｌｂ、 ｌｃ、 ｌｄの構成は種々変更してよく
、例えば第２洗浄槽１ｃには超音波洗浄用の発振子を設
けてよい。 また、各検量での溶剤の流入、流出方法は
上述したものに限ることなく、種々変更してよい。 更
に、めっきの前処理工程によシ油等の付着物を除去する
ときには、水切槽１ａを使用せず（或いは設けず）、第
４洗浄槽１ｂから処理を開始するとよめ。In this embodiment, the suction tank 18 is attached to a part of the working tank 1 (the left side in the drawing), but it may be attached to the right side in the drawing (i.e., the tank ld side), or the suction tank 18 K may be provided on the long side of l (upper side and/or lower side in FIG. 3).
Furthermore, the suction tank 18 may be provided all around the prrwtzy working tank 1. In addition, each of the above 1
The configurations of a, lb, lc, and ld may be changed in various ways. For example, the second cleaning tank 1c may be provided with an oscillator for ultrasonic cleaning. Further, the method of inflowing and outflowing the solvent in each calibration is not limited to the above-mentioned method, and may be changed in various ways. Furthermore, when removing deposits such as oil in the plating pre-treatment process, it is recommended that the process is started from the fourth cleaning tank 1b without using (or not providing) the draining tank 1a.
第５図及び８６図は本発明の第２の実施例を示すもので
ある。5 and 86 show a second embodiment of the present invention.
本実施例では、コイル状に配設した冷却管６の外周を囲
む如くに冷却管勿がコイル状に配設されておシ、更に冷
却管６と冷却管加との間には、冷却管６の保持も兼ねる
網状の筒体３２が介在せしめられている。 このため、
ガス吸引空間１９と作業槽１の内空間１７とは筒体３２
の網目を介して連通している。 また、冷却管２０の下
方には溶剤回収樋３１が設置されている。 なお、他の
部分は上述した第１の実施例とほぼ同様である。 但、
上述した冷却装置、水分分離器は図示省略し、ている。In this embodiment, the cooling pipes are arranged in a coiled manner so as to surround the outer periphery of the cooling pipe 6 arranged in a coiled manner, and the cooling pipes are arranged in a coiled manner so as to surround the outer periphery of the cooling pipe 6 arranged in a coiled manner. A net-like cylinder 32 is interposed which also serves to hold 6. For this reason,
The gas suction space 19 and the inner space 17 of the work tank 1 are connected to a cylinder 32.
are connected through the mesh. Further, a solvent recovery gutter 31 is installed below the cooling pipe 20. Note that other parts are substantially the same as in the first embodiment described above. However,
The cooling device and moisture separator described above are not shown.
この第２の実施例では、冷却管２０によシ、吸引空間１
９内の温度を作業槽１の内空間１７の温度よシも低くな
るようにしている。 このため、前記した第１の実施例
と同様に、作業槽１内に充満した有機溶剤ガス５が吸引
空間１９に向って流れ、その漏出が防止されると共に、
作業効率等も良好となる。 特忙、吸引空間１９が作業
槽１の側壁内面の全周に亘って設けられているので、溶
剤の回収率を高くできる上に、作業槽１自体は既存のも
のが使用可能である。In this second embodiment, the cooling pipe 20 and the suction space 1
The temperature inside the tank 9 is made lower than the temperature in the inner space 17 of the work tank 1. Therefore, similarly to the first embodiment described above, the organic solvent gas 5 filling the working tank 1 flows toward the suction space 19, and its leakage is prevented.
Work efficiency will also be improved. Since the suction space 19 is provided all around the inner surface of the side wall of the working tank 1, the recovery rate of the solvent can be increased, and the existing working tank 1 itself can be used.
以上、本発明を例示したが、上述の実施例は本発明の技
術的思想に基いて更に変形可能である。Although the present invention has been illustrated above, the embodiments described above can be further modified based on the technical idea of the present invention.
例えば、作業槽１内の洗浄槽等の各処理槽の個数は種々
変えてよいし、場合によっては上述した洗浄乾燥槽も省
略できるような処理を行なってもよい。 冷却手段や加
熱手段は上述したものに限定されない。 また、第２の
実施例と同様に、第１の実施例でも同空間１７−１９間
に網状の筒体を介在せしめてもよい。 上述の例では、
めっき製品を洗浄、乾燥する場合を説明したが、同じ装
置によシミ子部品等の他の製品を洗浄、乾燥することも
できる。゛つまシ、洗浄、乾燥する対象物にかかわらず
、有機溶剤による洗浄、乾燥装置全般について本発明を
適用することができる。For example, the number of processing tanks such as cleaning tanks in the working tank 1 may be varied, and depending on the case, processing may be performed such that the above-mentioned washing and drying tank can also be omitted. The cooling means and heating means are not limited to those described above. Furthermore, in the same way as in the second embodiment, a net-like cylinder may be interposed between the spaces 17-19 in the first embodiment. In the example above,
Although the case of cleaning and drying plated products has been described, the same apparatus can also be used to clean and dry other products such as stain parts. The present invention can be applied to all cleaning and drying apparatuses using organic solvents, regardless of the object to be washed or dried.
６、発明の作用効果
本発明は、上述した如く、冷却手段の外側に更に低温の
冷却空間を設けているので、有機溶剤等の洗浄液のガス
が濃度勾配を生じて冷却空間内へ効率良く吸引される。6. Effects of the Invention As described above, the present invention provides a cooling space at a lower temperature outside the cooling means, so that the gas of the cleaning liquid such as an organic solvent creates a concentration gradient and is efficiently sucked into the cooling space. be done.
従って、槽の上面開口から漏出するのを防止して洗浄
液のロスを低減させることができる。 しかも、作業者
がガスを吸うことも防止できる。Therefore, it is possible to prevent the cleaning liquid from leaking from the upper opening of the tank, thereby reducing the loss of the cleaning liquid. Furthermore, it is possible to prevent workers from inhaling gas.
第１図は従来の洗浄乾燥装置を示す縦断面図である。
第２図〜第６図は本発明の実施ρ１を示すものであって
、
第２図は第１の実施例による洗浄乾燥装置の縦断面図、
第３図は第１図の■−■線横線面断面
図４図は冷媒の供給方式を示すフロー図、第５図は第２
の実施例による洗浄乾燥装置の縦断面図、
第６図は第５図のＶＩ−ＶＩ線横断面図である。
なお、図面に示した符号において、
１・−・・・・・−・・・・−・・・・・・・・・・・
作業槽２．３−・・・・・・・・・・・・・・有機溶剤
４・・・・−・・・・・・・・・・・・・・・・・・・
・・・ヒータ５・−・−・・・・・・・・・・・・・・
・・・・・・・・有機溶剤ガス６、加・・・−・・・・
・・・・・・冷却管７．３１・・・・・・・・・・・・
・・・回収樋８・・・・・・・−・・・・・・・・−・
・・・・・・・・めっき製品１Ｂ・・−・・・・・・・
・・・・・・−・・・・・・・吸引槽１９・・・・・・
・・・・・−・・・・・・・・・・・吸引空間（冷却空
間）２１ ・・・・・・・・・・・・・・・・・・・−
・・・・冷却装置２２ａ、 ２２ｂ ・−冷媒
囚・・・・・・・・・・・・・・・・・・・・・・・・
水分分離器である。FIG. 1 is a longitudinal sectional view showing a conventional washing and drying apparatus. 2 to 6 show the implementation ρ1 of the present invention, FIG. 2 is a longitudinal cross-sectional view of the washing/drying apparatus according to the first embodiment, and FIG. 3 is the line ■-■ in FIG. 1. Horizontal cross-sectional view Figure 4 is a flow diagram showing the refrigerant supply method, and Figure 5 is a flow diagram showing the refrigerant supply method.
FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 5. In addition, in the symbols shown in the drawings, 1.
Working tank 2.3-・・・・・・・・・・・・・・Organic solvent 4・・・・-・・・・・・・・・・・・・・・・・・・
・・・Heater 5・−・−・・・・・・・・・・・・・・・・
・・・・・・・・・Organic solvent gas 6, addition・・・・・・・・・・
・・・・・・Cooling pipe 7.31・・・・・・・・・・・・
...Recovery gutter 8...
・・・・・・・・・Plating product 1B・・・・・・・・・・・・・・・
・・・・・・－・・・・・・Suction tank 19・・・・・・
・・・・・−・・・・・・・・・・・・Suction space (cooling space) 21 ・・・・・・・・・・・・・・・・・・−
...Cooling devices 22a, 22b - Refrigerant prisoner...
It is a moisture separator.
Claims (1)
を加熱する加熱手段と、前記収容槽内で生じる前記洗浄
液のガスを凝縮せしめるために前記収容槽の側壁に沿っ
て設けられた冷却手段とを有する洗浄装置において、前
記冷却手段よシ内側の前記収容槽の内空間に連通した状
態で前記冷却手段の外側に冷却空間が設けられ、この冷
却空間が前記収容槽の前記内空間よりも低温度となるよ
うに構成されていることを特徴とする洗浄装置。1. A storage tank for storing a cleaning liquid, a heating means for heating the cleaning liquid in the storage tank, and a cooling device provided along a side wall of the storage tank to condense the gas of the cleaning liquid generated in the storage tank. In the cleaning device, a cooling space is provided outside the cooling means in communication with the inner space of the storage tank inside the cooling means, and the cooling space is more than the inner space of the storage tank. A cleaning device characterized in that the cleaning device is configured to have a low temperature.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59028305A JPS60174889A (en) | 1984-02-16 | 1984-02-16 | Washing device |
| US06/696,122 US4690158A (en) | 1984-02-16 | 1985-01-29 | Washing apparatus |
| KR1019850000887A KR900003225B1 (en) | 1984-02-16 | 1985-02-13 | Cleaning device |
| EP85101586A EP0152111A3 (en) | 1984-02-16 | 1985-02-14 | Washing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59028305A JPS60174889A (en) | 1984-02-16 | 1984-02-16 | Washing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60174889A true JPS60174889A (en) | 1985-09-09 |
| JPS634638B2 JPS634638B2 (en) | 1988-01-29 |
Family
ID=12244903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59028305A Granted JPS60174889A (en) | 1984-02-16 | 1984-02-16 | Washing device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4690158A (en) |
| EP (1) | EP0152111A3 (en) |
| JP (1) | JPS60174889A (en) |
| KR (1) | KR900003225B1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5102504A (en) * | 1989-10-23 | 1992-04-07 | Tetsuya Saito | Device for solvent recovery in an ultrasonic cleaning device |
| US5090431A (en) * | 1990-06-01 | 1992-02-25 | K & M Electronics, Inc. | Cleaning apparatus with vapor containment system |
| US5082503A (en) * | 1990-10-22 | 1992-01-21 | Baxter International Inc. | Method for removing contaminants from the surfaces of articles |
| US5520204A (en) * | 1995-01-26 | 1996-05-28 | Branson Ultrasonics Corporation | Vapor degreasing apparatus |
| EP2108464A1 (en) * | 2008-04-09 | 2009-10-14 | Dow Global Technologies Inc. | Process for cleaning articles |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1053780A (en) * | 1900-01-01 | |||
| GB383709A (en) * | 1931-10-08 | 1932-11-24 | Bertram Philip Crawshaw | An improved degreasing plant |
| US2057177A (en) * | 1932-08-01 | 1936-10-13 | Wacker Chemie Gmbh | Apparatus for cleaning and degreasing metal articles and the like |
| DE1446573A1 (en) * | 1958-06-13 | 1969-04-10 | Wacker Chemie Gmbh | Method of cleaning rigid material |
| US2930349A (en) * | 1958-10-20 | 1960-03-29 | Du Pont | Hot paint dip tank |
| US3078701A (en) * | 1961-03-07 | 1963-02-26 | Autosonics Inc | Air recirculation system for cleaning apparatus |
| US3111952A (en) * | 1961-07-03 | 1963-11-26 | Baron Ind | Degreasing apparatus |
| US3346413A (en) * | 1964-10-12 | 1967-10-10 | Hooker Chemical Corp | Method and apparatus for coating wire and solvent recovery |
| GB1132970A (en) * | 1965-01-29 | 1968-11-06 | Applied Res And Engineering Lt | Improvements in or relating to evaporators |
| FR1436647A (en) * | 1965-03-02 | 1966-04-29 | Ass Pour La Securite Dans L Em | Method and device for collecting solvent vapors in the degreasing of metal parts |
| GB1105533A (en) * | 1965-04-05 | 1968-03-06 | American Mach & Foundry | Improvements in flash evaporators |
| US3375177A (en) * | 1967-05-05 | 1968-03-26 | Autosonics Inc | Vapor degreasing with solvent distillation and condensation recovery |
| BE759722A (en) * | 1969-12-02 | 1971-05-17 | Riggs & Lombard Inc | METHOD AND APPARATUS FOR PROCESSING KNITTED AND SIMILAR ARTICLES |
| US3904102A (en) * | 1974-06-05 | 1975-09-09 | Western Electric Co | Apparatus and method for soldering, fusing or brazing |
| US4404062A (en) * | 1981-01-15 | 1983-09-13 | Whitehurst Brooks M | Condenser |
| US4389797A (en) * | 1981-06-23 | 1983-06-28 | The Htc Corporation | Continuous vapor processing system |
| US4569727A (en) * | 1983-11-07 | 1986-02-11 | Mccord James W | Vapor generating and recovery apparatus for vaporizing and condensing at least two liquid components having different vaporizing temperatures |
-
1984
- 1984-02-16 JP JP59028305A patent/JPS60174889A/en active Granted
-
1985
- 1985-01-29 US US06/696,122 patent/US4690158A/en not_active Expired - Fee Related
- 1985-02-13 KR KR1019850000887A patent/KR900003225B1/en not_active IP Right Cessation
- 1985-02-14 EP EP85101586A patent/EP0152111A3/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPS634638B2 (en) | 1988-01-29 |
| KR900003225B1 (en) | 1990-05-11 |
| EP0152111A3 (en) | 1987-01-21 |
| KR850006020A (en) | 1985-09-28 |
| US4690158A (en) | 1987-09-01 |
| EP0152111A2 (en) | 1985-08-21 |
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