JPS60170594A - クリ−ムはんだ - Google Patents

クリ−ムはんだ

Info

Publication number
JPS60170594A
JPS60170594A JP2417684A JP2417684A JPS60170594A JP S60170594 A JPS60170594 A JP S60170594A JP 2417684 A JP2417684 A JP 2417684A JP 2417684 A JP2417684 A JP 2417684A JP S60170594 A JPS60170594 A JP S60170594A
Authority
JP
Japan
Prior art keywords
acid amide
amide
cream solder
acid
alkyl group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2417684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0464799B2 (OSRAM
Inventor
Toshiaki Ogura
小倉　利明
Masatoshi Sado
佐渡　正俊
Hideo Chagi
茶木　英雄
Koichi Hagio
浩一 萩尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON GENMA KK
Nihon Genma KK
Original Assignee
NIPPON GENMA KK
Nihon Genma KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON GENMA KK, Nihon Genma KK filed Critical NIPPON GENMA KK
Priority to JP2417684A priority Critical patent/JPS60170594A/ja
Publication of JPS60170594A publication Critical patent/JPS60170594A/ja
Publication of JPH0464799B2 publication Critical patent/JPH0464799B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2417684A 1984-02-10 1984-02-10 クリ−ムはんだ Granted JPS60170594A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2417684A JPS60170594A (ja) 1984-02-10 1984-02-10 クリ−ムはんだ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2417684A JPS60170594A (ja) 1984-02-10 1984-02-10 クリ−ムはんだ

Publications (2)

Publication Number Publication Date
JPS60170594A true JPS60170594A (ja) 1985-09-04
JPH0464799B2 JPH0464799B2 (OSRAM) 1992-10-16

Family

ID=12131039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2417684A Granted JPS60170594A (ja) 1984-02-10 1984-02-10 クリ−ムはんだ

Country Status (1)

Country Link
JP (1) JPS60170594A (OSRAM)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165897A (ja) * 1988-12-19 1990-06-26 Nippon Handa Kk クリームはんだ
JPH07144293A (ja) * 1993-11-22 1995-06-06 Fujitsu Ten Ltd 窒素リフロー用低残渣クリームはんだ
JPH07164180A (ja) * 1993-12-17 1995-06-27 Nippon Genma:Kk クリームはんだ
JPH07241695A (ja) * 1994-03-07 1995-09-19 Nippon Genma:Kk クリームはんだ
JP2002263884A (ja) * 2001-03-09 2002-09-17 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
WO2009013210A1 (en) * 2007-07-23 2009-01-29 Henkel Limited Solder flux
WO2014057846A1 (ja) * 2012-10-11 2014-04-17 株式会社ダイセル 電気デバイス製造用溶剤組成物
JP2015080814A (ja) * 2013-10-24 2015-04-27 住友金属鉱山株式会社 はんだ用フラックスおよびはんだペースト

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165897A (ja) * 1988-12-19 1990-06-26 Nippon Handa Kk クリームはんだ
JPH07144293A (ja) * 1993-11-22 1995-06-06 Fujitsu Ten Ltd 窒素リフロー用低残渣クリームはんだ
JPH07164180A (ja) * 1993-12-17 1995-06-27 Nippon Genma:Kk クリームはんだ
JPH07241695A (ja) * 1994-03-07 1995-09-19 Nippon Genma:Kk クリームはんだ
JP2002263884A (ja) * 2001-03-09 2002-09-17 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
WO2009013210A1 (en) * 2007-07-23 2009-01-29 Henkel Limited Solder flux
US8348135B2 (en) 2007-07-23 2013-01-08 Henkel Limited Solder flux
WO2014057846A1 (ja) * 2012-10-11 2014-04-17 株式会社ダイセル 電気デバイス製造用溶剤組成物
JP2015080814A (ja) * 2013-10-24 2015-04-27 住友金属鉱山株式会社 はんだ用フラックスおよびはんだペースト

Also Published As

Publication number Publication date
JPH0464799B2 (OSRAM) 1992-10-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term