JPS60170272A - Thermoelectric transducer - Google Patents
Thermoelectric transducerInfo
- Publication number
- JPS60170272A JPS60170272A JP59026508A JP2650884A JPS60170272A JP S60170272 A JPS60170272 A JP S60170272A JP 59026508 A JP59026508 A JP 59026508A JP 2650884 A JP2650884 A JP 2650884A JP S60170272 A JPS60170272 A JP S60170272A
- Authority
- JP
- Japan
- Prior art keywords
- conversion device
- metal plate
- heat
- thermoelectric conversion
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001721 polyimide Polymers 0.000 claims abstract description 6
- 239000009719 polyimide resin Substances 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 238000006243 chemical reaction Methods 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000004945 silicone rubber Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000013464 silicone adhesive Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 2
- 206010010071 Coma Diseases 0.000 claims 1
- 241000087799 Koma Species 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- 239000011135 tin Substances 0.000 abstract description 2
- 230000002463 transducing effect Effects 0.000 abstract 2
- 238000009434 installation Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 210000002105 tongue Anatomy 0.000 description 3
- 239000012212 insulator Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Electromechanical Clocks (AREA)
Abstract
Description
本発明は、複数の熱雷変１ｇ！素子すなわら熱電変換用
の半導体索子を包有した熱電変換装置に関づる。
従来、この種の熱雷変換装置においでは、Ｎ１１！１熱
電変換索子づなわち熱電変換用のＮへ１！半導ＩＡ ；
＋ｆ子どＰ型熱電変換素子′？ｌなわち熱電変換用の１
）型半導体素子とが交りに配列され月つ前記Ｎバ１１熱
電変換素子と１〕型熱電変換素子とが導電路を介して互
いに電気的に直列に接続されており、更に前記ＮＩ！１
′！熱雷変換累子おＪ、びＰハリ熱電変換素子と導電路
とからなる熱雷変摸索了層の両側に夫々接る剤層を介し
て絶縁体層が配置され１つ前記絶縁体層上に夫々他の接
着剤層を介して金属板が配置され（いたので・、熱源の
形状によっては配設が困難どイＣっでいた。
木ブで明は、熱ｄ≦：の形状にＪ、る配置場所の制限を
軽減ないしThe present invention provides multiple thermal lightning changes in 1g! The present invention relates to a thermoelectric conversion device including an element, that is, a semiconductor cable for thermoelectric conversion. Conventionally, in this type of thermal lightning conversion device, an N11!1 thermoelectric conversion cord connection, that is, an N to 1!1 thermoelectric conversion cable is used. Semiconductor IA;
+f child P-type thermoelectric conversion element'? 1 for thermoelectric conversion
) type semiconductor elements are alternately arranged, and the N type thermoelectric conversion element and the type 1 type thermoelectric conversion element are electrically connected in series to each other via a conductive path, and the NI! 1
′! An insulator layer is disposed on both sides of the thermoelectric conversion layer consisting of a thermoelectric conversion element and a conductive path through an agent layer in contact with each other, and one layer is placed on the insulator layer. A metal plate was placed on each side through another adhesive layer (because it was difficult to place depending on the shape of the heat source. , reduce the restrictions on the location of
【、１除去し月つ８イ２首作梨を容易化ない
し簡便化してなる新規な熱雷変換装置Ｎを提供づるもの
（・ある。
ノズ下、不発明の熱電変換装置を・図面につい（詳述り
る。
第１図においで、（１）は鉄・銅・アルミニウムステン
レス鋼イｊいしｆ、１これらの合金ぞの他の材料（゛形
成された金り］＝板Ｃ１吸熱作用もしくは放熱ｆ′１用
をｈし１１つ保護作用ないし補強作用をなしている。６
ン属板（１）のＶ♂は、熱１ｔ、１定数イ１いし機械的
強１αにＪ、−） ’（決定されるものであって、例え
ば０．！’＋ｍｍ・〜・３ｍｍの舶が選択される。金属
板（１）の 血には吸熱作用ないしは放熱作用を改善す
るたν）Ｍ複数のフｒンを配設づれば好適である。フィ
ンの配設に伴なって金属板（１）の機械的強度は増大し
延いては保護作用ないしは補強作用の改善もできる。
（２）は比較的熱伝導率の高いポリイミド樹脂のフィル
ムで形成された絶縁膜で、耐熱性のエポキシ樹脂からな
る接着剤層（３）を介して前記金属板（１）の他面に接
合されている。ポリイミド樹脂としては、例えばデコー
ボンネＩｐＡのダブ１〜ン（商品名）が好適である。こ
のケア１−ンの熱伝導率は０，２４ ＸＩＯＷ／Ｃ１１
ｌ・℃稈痕であるので、２０１１ ｍ程度の厚みであっ
ても十分に好適な熱伝導率を呈する。接着剤層（３）の
厚さ゛は、例えば４０μｍ程度であればよい。絶縁膜（
２）おＪ、び接着剤層（３）の熱伝導率を好適とするた
めに高熱伝導性のフィラー材例えばアルミナ粉末等を前
記絶縁膜（２）および接着剤層（３）の少なくとも一方
に適宜の母だけ混入してもよい。フィラー祠のン１を大
川を加減すれば絶縁膜（２）もしくは接着−２
剤ｈ）ｉ （３）の熱伝導率を１ ｘ １０ Ｗ／ｃｍ
−”Ｃ，１ｆｌｕ：丁−Ｃ゛改善きる。
（／Ｉ）は耐熱性のＴボキシ樹１１ｔｊからなる他の接
６剤層て・、前記絶縁膜（２）上に配置されており、前
記絶縁膜＜２） Ｉ−に銅・ニッケル・スズ等からなる
電極Ｐｉ （５）を１８合する作用をなしている。
接ｆ１剤層（／Ｉ）は、厚さが例えば４ａル剤程度であ
ればＪ、く、熱電Ｓ４’を改善Ｊ−るためにアルミナ粉
末等のｒ）熱電々ｆ１のフィラー月を適宜の１４だ（Ｊ
混入（〕（も」、い。これＭより接着剤層（４）の熱電
２
税率はｌＸｌ０ Ｗ／Ｃｌ１１・℃程葭まで改善できる
。
ｊｌＩｉ ｋ Ｒ’ｉ （５） ノｈ ａ ＋ｉ、ｍ
製’７） ’Ａ 金側エバ１００７１ Ｉｌ＋程１αで
・あればＪ、いことも１′１１明している。
（６） ｆＪ、 Ｎ型熱電変ＩＩＪ４索子１なわら熱電
変換用（７） Ｎ ’１’！ ’Ｉ’ ｉ、９体系ｒ（
：、前Ｒｄ雷４４的＜ ５ ） ニ１−Ｊツつハンダ伺
ｔづされている。、（７）はＰう１）熱電変換記電極箔
（５〉に１つづつハンダ付Ｃすされている。
（８）は前記電極箔（５）と同様に形成された他の電極
箔ひ、前記電４４箔（５）のうら隣り合う電極箔（５）
上に配置された異なるタイプの半導体索子（６）（７）
に夫々ハンダ（Ｊ ＋）されてａ−３つ、Ｎ型半導体素
イ〈６）とＰ型半導体素子（７）とを前記９１極箭（５
）と協働して乃いに直列に接続している。
＜９） （１０）は接続端子で、１１′１記電極λへく
５）に接着されており、外部の負荷に接続される。
第２図は、第１図に示した本発明の熱雷変換）ζ置の使
用態様を示している。（１１）は流体を案内Ｊ−る管で
、高熱源もしくは低熱源に接続さねでいる。＜１２）は
耐熱性で且つ絶縁性の接盾剤層で、電極箔（８）を前記
管（１１）に接合している。接着剤層（１２）は、シリ
コンゴム・シリコン樹脂等のシリコン系１ａル剤もしく
は低融開方ラスＴｆで作成りればＪ、く、シリコンゴム
ないしはシリコ１ン樹脂の場合１，２ｘ １（ｌ Ｗ
／ Ｃｍ・℃稈Ｔαの熱伝導率をイｊ−’ Ｌ／また低
融Ｉｊ、′１カラスの場合１．ＯＸ １０ Ｗ／ ｃト
℃程度の熱伝導率をイｊしている。更に接着剤層（１２
）の熱伝導率を改ｉξづるためにはアルミナ粉末舌のフ
ィラー月を混入−リればよいことは明ら／ＪＳ（・あろ
う。シリ」ンゴム・シリコン４”ｉ４１１ｆｔ ’Ｊの
シリ−１ン系接ン″１剤の場合には中空のガラス１本も
しくはＪＪラス粉末笠のフィラー祠を添加づれＩ３【耐
熱特性を改善覆ることがでさることも明らかであろう。
シリ−１ンゴｌ＼・シリコン樹脂等のシリコン系接着剤
は、１受１１１ｊ使用の場合２６０℃程度までの渇Ｉσ
範囲Ｃ・使用（゛さ、知１す１使用の場合３２０℃程度
までの温庶嵯囲て゛使用できることが判明している。低
融点カフス（ま、Ｉ是１１１１使川σ）場合４３０°０
程度までの温度範囲で・使用ぐき短！ＩＪ】使用の揚含
５５０℃Ｖ１度までの温度範囲で使用できることが判明
している。
本発明の熱電変換装置では、ｊ褒１”１剤層（３〉（４
）の少なくとも一方をシリコンゴム・シリコン樹脂・低
融点ガラス等の耐熱性ＪｔＡ籾で形成すれば、上述の１
−ボキシ樹脂に比し耐熱特性が良好であるので、高温熱
源に対しｌ適用でさること【ま明らかであろう。この場
合もシリコンゴｌい・シリ−１ン樹脂等のシリ゛：１ン
系接盾剤に対しアルミリ粉末等のフィラー材を添加混入
すれば熱電導率を改善でき、Ｓｔだ中空のガラス体もし
くはガラス粉末舌のフィラー材を添加混入づれぽ耐熱特
性を改善で・きることは明らかであろう。
本発明の熱電変換装置１ま、上述より明らかな如く、Ｎ
う１！熱電変換累子ｄｊよびＰ型熱電変換累ｒの両側に
配置された電極前の一方が露出されＣいるので、高熱源
６しくはイバ熱源の形状によつＣ説１ｔ１′場所が制限
されることがなく、極めＣ多様の熱源を利用可能とづる
。
、１１ζ１、本発明の熱雷変換装（支）Ｃ（，１，１と
着剤層が耐熱性Ｉ−ボ）ニジ樹脂・シリコン系接摺剤・
低融点）Ｊラス（゛形成さね（おり比較的高湿に耐える
ことが′ｃ′き高熱源を利用可能とされ乙いる。特にシ
リ１ン糸ｊａる剤には〕ｌルミＪ粉末簀のフィフー祠が
添加７１２人され熱伝導率の改善が図られており、中空
のガラス体もしくはガラス粉末等のノイラー材が添加混
入され−（耐熱特性の改善が図られ（いる。1. To provide a new thermoelectric conversion device N that facilitates or simplifies the process by removing 1.8.2. In Fig. 1, (1) indicates iron, copper, aluminum stainless steel, 1) Other materials of these alloys ('formed gold' = plate C1, endothermic action or The heat dissipation f'1 has a protective or reinforcing function.6
The V♂ of the metal plate (1) is determined by the heat 1t, the constant 1, and the mechanical strength 1α. It is preferable to arrange a plurality of flanges on the metal plate (1) in order to improve the heat absorption or heat dissipation effect. As the fins are provided, the mechanical strength of the metal plate (1) increases, and the protective or reinforcing effect can also be improved. (2) is an insulating film made of a polyimide resin film with relatively high thermal conductivity, and is bonded to the other surface of the metal plate (1) via an adhesive layer (3) made of a heat-resistant epoxy resin. has been done. As the polyimide resin, for example, Dove 1-N (trade name) manufactured by Deco Bonnet IpA is suitable. The thermal conductivity of this care 1-n is 0.24 XIOW/C11
Since it is a culm trace of 1°C, it exhibits sufficiently suitable thermal conductivity even with a thickness of about 2011 m. The thickness of the adhesive layer (3) may be, for example, about 40 μm. Insulating film (
2) In order to improve the thermal conductivity of the insulation film (2) and the adhesive layer (3), a highly thermally conductive filler material such as alumina powder is added to at least one of the insulating film (2) and the adhesive layer (3). Only an appropriate mother may be mixed. By adjusting the filler hole's N1 by Okawa, the thermal conductivity of the insulating film (2) or adhesive -2 agent h)i (3) becomes 1 x 10 W/cm.
-"C, 1flu: D-C" can be improved. Insulating film <2) It functions to connect electrode Pi (5) made of copper, nickel, tin, etc. to I-. In order to improve the thermoelectric power S4', filler of the thermoelectric power F1, such as alumina powder, can be added to an appropriate level (J-14).
Contamination (〕(も」, い. From this M, the thermoelectric 2 tax rate of the adhesive layer (4) can be improved to lXl0 W/Cl11・℃. jlIi k R'i (5) ノha +i, m
Manufactured '7) 'A gold side Eva 10071 If Il+ is about 1α, then J, it is also clear that it is 1'11. (6) fJ, N type thermoelectric transformer IIJ4 cord 1 for thermoelectric conversion (7) N '1'! 'I' i, 9 system r(
:, Previous Rd lightning 44 target < 5) Ni1-J Tsutsu soldering has been done. , (7) is soldered one by one to each of the thermoelectric conversion electrode foils (5). (8) is another electrode foil string formed in the same manner as the electrode foil (5). , an electrode foil (5) adjacent to the back of the electrode 44 foil (5)
Different types of semiconductor cords (6) (7) placed on top
The N-type semiconductor element A (6) and the P-type semiconductor element (7) are each soldered (J+) to the 91-pole wire (5).
) and are connected in series to Noi. <9) (10) is a connection terminal, which is bonded to the electrode 11'1 and connected to an external load. FIG. 2 shows how the thermal lightning conversion (ζ) position of the present invention shown in FIG. 1 is used. (11) is a pipe for guiding fluid, and is connected to a high heat source or a low heat source. <12) is a heat-resistant and insulating shielding agent layer that joins the electrode foil (8) to the tube (11). The adhesive layer (12) is made of a silicone lath such as silicone rubber or silicone resin or a low melting lath Tf; l W
/ Cm・℃ The thermal conductivity of culm Tα is Ij-' L/Also, low melting Ij, '1 In the case of crow 1. It has a thermal conductivity of about OX 10 W/c°C. Furthermore, an adhesive layer (12
It is clear that in order to improve the thermal conductivity of ), it is sufficient to mix a filler of alumina powder tongue. It is also clear that in the case of a one-agent type adhesive, it is possible to improve the heat resistance properties by adding one hollow glass or a filler of JJ lath powder cap. ＼・Silicone adhesive such as silicone resin has a temperature of up to about 260℃ when using 1-piece 111j.
Range C/Usage (It has been found that it can be used at temperatures up to about 320°C in the case of 1 use.In the case of low melting point cuffs (I am 1111 Shikawa σ), 430°0
Temperature range up to 100% and short usage time! IJ] It has been found that it can be used in a temperature range up to 550 degrees Celsius. In the thermoelectric conversion device of the present invention, 1 layer (3〉(4)
) is made of heat-resistant JtA rice grains such as silicone rubber, silicone resin, and low melting point glass.
- It has better heat resistance properties than boxy resin, so it is useful when applied to high-temperature heat sources. In this case as well, thermal conductivity can be improved by adding a filler material such as aluminum powder to a silicone shielding agent such as silicone rubber or silicone resin. It is clear that the heat resistance properties of glass powder tongues can be improved by adding filler materials. As is clear from the above, the thermoelectric conversion device 1 of the present invention has N
U1! Since one side in front of the electrodes placed on both sides of the thermoelectric converter dj and the P-type thermoelectric converter r is exposed, the location of C theory 1t1' is limited by the shape of the high heat source 6 or the heat source. It is said that an extremely wide variety of heat sources can be used without any problems. , 11ζ 1, Thermal lightning converter (support) C of the present invention (, 1, 1 and the adhesive layer are heat-resistant I-BO) resin/silicon adhesive/
Low melting point) J lass (forming tongue) can withstand relatively high humidity and can utilize a high heat source.In particular, as a silicone thread coating agent, Lumi J powder can be used. 712 fifu shrines were added to improve thermal conductivity, and hollow glass bodies or Noiler materials such as glass powder were added to improve heat resistance characteristics.
第１図は本発明の熱雷変換装置の実施例で、第２図は第
１図の実施例装置の使用態様である。
１・・・金１ｍ板 ２・・・絶縁膜
３．４・・・接着剤にη ５，８・・・電極箔６・・・
Ｎ型熱電変換素子
７・・何）型熱電変換素子
９．１０・・・接続端子
第１図
第２図FIG. 1 shows an embodiment of the thermal lightning conversion device of the present invention, and FIG. 2 shows how the embodiment device of FIG. 1 is used. 1... Gold 1m plate 2... Insulating film 3.4... η for adhesive 5,8... Electrode foil 6...
N-type thermoelectric conversion element 7...What) type thermoelectric conversion element 9.10... Connection terminal Fig. 1 Fig. 2
Claims (1)
Ｊ＆ Ｉ＆剤層を介しＣ−面が接合された絶縁膜と、前
記絶縁膜の他面に耐熱性の第２の接着剤層を介して 面
が夫々接合された複数の電極箔と、前１ｚ複数の電極的
の他面に夫々１つづつ接合された複数のＮ型熱電変換素
子と、前記複数の電極箔の他面に大々１′）づ′）接合
された複数のＰ型熱電変換素子と、前記複数の電１か箔
のうらｎいに隣り合う電１４１が１に接合されたＮ型熱
電変１１ＪＩ素子および１） ！１１７熱雷変換累了に
夫々が接合されｉｌｆ記複数の熱電安模んｒと前８ｄ複
数の熱雷ゆ換素了どを互いに直列に接続づる複数の他の
電極箔とを備えてなることを狛１１りどＪ−る熱雷変換
装置。 （２） 第１第２の接着剤層の少なくとｂ−７ノが耐熱
性エポキシ樹脂からなることを特徴とする特許請求の範
囲第（１）項記載の熱雷変換装置。 （３） 絶縁膜がポリイミド樹脂からイ「ることを特徴
とする特許請求の範囲第（１）項ｂｔ、＜は第（２）項
記載の熱雷変換装置。 （４） 金属板がアルミニウム製て゛あることを特徴と
する特許請求の範囲第（１）項イー１いし第（３）項の
いずれか一項記載の熱雷変換装置。 （５） 金属板が鉄製であることを特徴とする特ｒ「請
求の範囲第（１） １１’Ｊないし第（３）項のいずれ
か一項記載の熱雷変換装置。 （６） 金属板が銅製であることを特徴どＪる特￥’Ｆ
請求の範囲第（１）項ないし第（３）項のいり゛れか
一項記載の熱雷変換装置。 ゛。 （７） 金属板の他面にフィンが配向されてなることを
特徴とする特許請求の範囲第（１）項ないし第（６）項
のいヂれが一項記載の熱雷変換装置。 （８） 耐熱す１１−ｒ′、ボ“１−シ樹脂にアルミナ
粉末・中空のガラス体・ガラス粉末等のフィラー材が添
加混入されｌ’ ＜７ることを特徴とする特許請求の範
囲第（２）項イＴいし第（７）項のいずれが一項記載の
熱電変換菰ｉａｉ ａ （９） 第１第２の接着剤層の少なくとし一方かシリロ
ンゴム・シリコン樹脂等のシリコン糸上６剤からイＣる
ことを特徴とする特許請求の範囲第＜ １ ’） Ｊｉ
’ｊ記載の熱雷変換装置。 （１０） 絶縁膜がポリイミド樹脂からなること’ａ−
４：Ｉｍ トｔＪ ６ｆｉ ｎ’ｌ晶求ノ１４）間第（
９） Ｊｉ￥記Ｍ（ｉ’）熱電変換装置。 （１１） 金属板がアルミニウム製であることを特徴ど
する待δ′１品求の範囲第（９）項もしくは第（１０）
項記載の熱電変換装置。 特許請求の範囲第（９）項もしくは第（１０）項記載の
熱雷変換波＋ｔＴ７ 。 ＜１３） 金属板が銅製であることを特徴とする特許請
求の範囲第（９）項もしくは第（１ｏ）項記載の熱電変
換装置。 （１４） 金属板の他面にフィンが配置されてなること
を特徴とする特許請求の範囲第（９）項＜ｉいし第（１
３）項のいずれが一項記載の熱雷変換装置。 （１５） シリコン系接着剤にアルミナ粉末・中空のガ
ラス体・ガラス粉末等のフィラー材が添加混入されて＜
ｒることを特徴とする特許請求の範囲第（９）項ないし
第（１４）項のいずれが一項記載の熱雷変換装置。 （１６） 第１第２の接着剤層の少なくとも一方が低融
点ガラスで形成されてなることを特徴とする特許請求の
範囲第（１）項記載の熱雷変換装置。 （１７） 絶１＆１０がポリイミド樹脂からなることを
特徴とする特許請求の範囲第（１６）項記載の熱電ゆ換
装品。 （１８） 金属板がアルミニウム製であることを特徴と
する特許請求の範囲第（１６）項もしくは第（１ｙ＞Ｊ
ｃ７記載の熱雷変換装置。 （１９） 金属板が鉄製であることを特徴どづる４６ｉ
許請求の範囲第（１６）項もしくは第（１７）項記載の
熱電変換装置。 （２０） 金属板が銅製であることを特徴どする１°！
；′ｌ請求の範囲第（１６）項もしくは第（１１）項記
載の熱雷変換装置。 （２１） 金属板の他面にフィンが配置されてなること
を特徴とする特許請求の範囲第（１（ｉ＞ＩＮないし第
（２０）項のいずれか一項記載の熱雷変換装置を。 （２２） 複数の他の電極箔が耐熱性エポキシ樹脂を介
して高熱源に接合されてなることを特徴とする特許請求
の範囲第（１）項ないし第（２１）項のいずれか一項記
載の熱電変換装置。 （２３） 複数の他の電極箔が耐熱性エポキシ樹脂を介
して４１℃熱源に接合されてなることを特徴とする特許
請求の範囲第＜１）ＴｒＪ’：ｉいし第（２１）項のい
ずれか一１’ｆｌ記載の熱電変換’ＪＡ ｆｌ”７゜＜
２４） 複数の他の電極箔に接合された耐熱ｆｌエポキ
シ樹脂にアルミナ粉末・中空のガラス体・ガラス粉末等
のフィラー材が添加混入されてなることを特徴とする特
許請求の範囲第＜２２＞ＩＵｂシ（は第（２３）項のい
ずれか一項記載の熱電変換装置。 （２５） 複数の他の電極箔がシリコ１ンゴム・シリコ
ン樹脂等のシリコン系接着剤を介して高熱源に接合され
てなることを特徴とする特許請求の範間第（１）項ない
し第（２１）項のいずれか一項記載の熱電変換装置６゜ （２６） 複数の他の電極箔がシリコンゴム・シリ−１
ン樹脂等のシリコンゴムる剤を介して低熱源に接合され
てなることを特徴とする特許請求の範ｆｌｌＨ’＞ （
１） ＩＮ＜；イシ第＜２１） Ｍノイスｔｔカー項記
載の熱電変換装置。 （２７） 複数の他の電極箔に接合されたシリ−１ン系
接着剤にアルミナ粉末・中空のガラス体・ガラス粉末等
のフィラー材が添加混入されてなることを特徴どりるＱ
ｊｒ Ｙｌ請求の範囲第（２５）項もしく１、ｉ第（２
６）項記載の熱雷変換装置。 （２８） 複数の他の電８Ａ箔が低融点ガラスを介しく
高熱ｉｌ≦ｉ ＋： ｌ１ｍ合されてなることを特徴と
する特ｉｉ’ｌ 請求の範囲第（１）頂ないし第（２１
）項のいずれか一項記載の熱電変換装置。 （２９） 複数の他の電極的が低融点ガラスを介して低
熱源に接合されてなることを特徴とする特許請求の範囲
第（１）項ないし第（２１）項のいずれか一項記載の熱
雷変換則Ｌ[Scope of Claims] (1) An insulating film, such as a metal plate, having a C-plane bonded to one side of the metal plate through a heat-resistant first J&I& agent layer, and a heat-resistant insulating film on the other side of the insulating film. a plurality of electrode foils whose surfaces are respectively bonded via a second adhesive layer; a plurality of N-type thermoelectric conversion elements, one of which is bonded to the other surface of the plurality of electrodes; A plurality of P-type thermoelectric conversion elements are joined to the other surface of a plurality of electrode foils, and a plurality of electrodes 141 adjacent to the electrodes 141 are joined to the other side of the foil. N-type thermoelectric transformer 11JI element and 1)! 117 A plurality of other electrode foils are connected in series to each other in series with a plurality of thermoelectric conductors and a plurality of thermoelectric conductors connected in series to each other. Koma 11 Rido J-ru thermal lightning conversion device. (2) The thermal lightning conversion device according to claim (1), wherein at least b-7 of the first and second adhesive layers is made of a heat-resistant epoxy resin. (3) The thermal lightning conversion device according to claim (1) bt, < means (2), wherein the insulating film is made of polyimide resin. (4) The metal plate is made of aluminum. The thermal lightning conversion device according to any one of claims 1 to 3, characterized in that: (5) the metal plate is made of iron; Special feature: The thermal lightning converter according to any one of claims (1) to (3). (6) A special feature where the metal plate is made of copper.
A thermal lightning conversion device according to any one of claims (1) to (3).゛. (7) A thermal lightning conversion device according to any one of claims (1) to (6), characterized in that fins are oriented on the other surface of the metal plate. (8) Filler materials such as alumina powder, hollow glass body, glass powder, etc. are added to the heat-resistant resin 11-r' and the body resin, and l'< 7. Any of (2) A to (7) may be used for thermoelectric conversion according to one of the above (9) At least one of the first and second adhesive layers is made of silicone thread such as silylon rubber or silicone resin 6 Claim No. <1') Ji
The thermal lightning conversion device described in 'j. (10) The insulating film is made of polyimide resin'a-
4: Im totJ 6fin'l crystal search 14)
9) Ji¥ki M(i') thermoelectric conversion device. (11) The range of item (9) or (10) of the waiting δ′1 item characterized in that the metal plate is made of aluminum.
The thermoelectric conversion device described in Section 1. Thermal lightning conversion wave +tT7 according to claim (9) or (10). <13) The thermoelectric conversion device according to claim (9) or (1o), wherein the metal plate is made of copper. (14) Claims (9) <i-th (1), characterized in that fins are arranged on the other surface of the metal plate.
The thermal lightning conversion device according to any one of item 3). (15) Filler materials such as alumina powder, hollow glass bodies, and glass powder are added to silicone adhesives.
A thermal lightning conversion device according to any one of claims (9) to (14), characterized in that: (16) The thermal lightning conversion device according to claim (1), wherein at least one of the first and second adhesive layers is formed of low melting point glass. (17) The thermoelectric conversion equipment as set forth in claim (16), characterized in that resistors 1 & 10 are made of polyimide resin. (18) Claim (16) or (1y>J) characterized in that the metal plate is made of aluminum.
The thermal lightning conversion device described in c7. (19) 46i characterized by the metal plate being made of iron
A thermoelectric conversion device according to claim (16) or (17). (20) 1° characterized by the metal plate being made of copper!
;'l A thermal lightning conversion device according to claim (16) or (11). (21) The thermal lightning conversion device according to any one of claims 1 (i>IN to (20)), characterized in that a fin is arranged on the other surface of the metal plate. (22) The invention according to any one of claims (1) to (21), characterized in that a plurality of other electrode foils are bonded to a high heat source via a heat-resistant epoxy resin. (23) A thermoelectric conversion device characterized in that a plurality of other electrode foils are bonded to a 41° C. heat source via a heat-resistant epoxy resin. Thermoelectric conversion described in any one of paragraph 21) 'JA fl''7゜<
24) Claim No. 22, characterized in that a filler material such as alumina powder, a hollow glass body, or glass powder is added to a heat-resistant fl epoxy resin bonded to a plurality of other electrode foils. (25) A plurality of other electrode foils are bonded to a high heat source via a silicone adhesive such as silicone rubber or silicone resin. Thermoelectric conversion device 6° (26) according to any one of claims (1) to (21), characterized in that the plurality of other electrode foils are made of silicone rubber series. 1
Claims characterized in that the product is bonded to a low heat source via a silicone rubber agent such as a silicone resin.
1) IN<;Ishi<21) The thermoelectric conversion device described in M Noyce tt Kerr. (27) Q characterized in that a filler material such as alumina powder, hollow glass body, glass powder, etc. is added to the silicone adhesive bonded to a plurality of other electrode foils.
jr Yl Claim (25) or 1st, i-th (2nd
6) The thermal lightning conversion device described in item 6). (28) Feature ii'l characterized in that a plurality of other electric 8A foils are bonded together via a low melting point glass.
) The thermoelectric conversion device according to any one of the above items. (29) The device according to any one of claims (1) to (21), characterized in that a plurality of other electrodes are connected to a low heat source via a low melting point glass. Heat lightning conversion law L
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59026508A JPS60170272A (en) | 1984-02-15 | 1984-02-15 | Thermoelectric transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59026508A JPS60170272A (en) | 1984-02-15 | 1984-02-15 | Thermoelectric transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60170272A true JPS60170272A (en) | 1985-09-03 |
Family
ID=12195420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59026508A Pending JPS60170272A (en) | 1984-02-15 | 1984-02-15 | Thermoelectric transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60170272A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000511351A (en) * | 1996-05-20 | 2000-08-29 | ハイ―ゼット・テクノロジー，インコーポレイテッド | Thermoelectric module with gapless rectangular grid |
-
1984
- 1984-02-15 JP JP59026508A patent/JPS60170272A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000511351A (en) * | 1996-05-20 | 2000-08-29 | ハイ―ゼット・テクノロジー，インコーポレイテッド | Thermoelectric module with gapless rectangular grid |
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