JPS60169534A - Composite cu-c fiber material with cu foil containing non-ferrous metal - Google Patents

Abstract

PURPOSE:To provide a titled composite material having high heat resistance by interposing a non-ferrous metal having the m.p. lower than the m.p. of Cu between a net-like compositie Cu-C material consisting of C fibers plated with Cu and Cu foil and hot pressing the same. CONSTITUTION:Brass foil 2 as a non-ferrous metal which has the m.p. lower than the m.p. of Cu and fuses metallurgically to Cu is interposed between a net- shaped composite Cu-C fiber body 1 formed by single twisting and weaving of many C fibers plated with Cu and Cu foil 3 and such combinations are laminated via graphite spacers 4. The laminates are loaded into a hot press die 5 and while a pressure is exerted thereto from the side of an upper electrode pusher bar 6 by a hydraulic device, electricity is conducted between said rod and a lower electrode pusher bar 7. The respective laminated materials are thereby heated and the foil 2 is melted and diffused into the meshes of the net-like Cu- C 1. The highly heat resistant composite Cu-C fiber material with the Cu foil contg. brass to obviate generation of a surface blister, sectional cracking, etc. at a high temp. is thus obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to the production of JCu-C, particularly C+, + foil, net-like Cu-C, and net-like Cu-C, net-like C' This relates to the production of (/u foil-attached C', u-C) suitable for joining IJ-C to each other.

[G-scape of invention]

Conventional Cu l'A E1' Ctl-C is CIJ foil mesh (-, u-C is in close contact but not bonded, so it cannot be silver soldered with other materials or products or heated at high temperature. When used, swelling may occur on the surface or the adhesive may
However, it had drawbacks such as very poor heat resistance, such as the occurrence of cracks.

[Object 1-1 of the invention] An object of the present invention is to provide Cu-C with Cu foil having high heat resistance.

[41M Requirements of the Invention] The present invention is characterized by interposing brass between Cu foil and reticulated Cu-C, or by interposing brass between Cu foil and reticulated Cu-C, or by interposing brass between Cu foil and reticulated Cu-C. Reticulated Cu-C
The Cu foil and the net-like c, u-C: were bonded to each other by using the above method.

and explain.

In Fig. 1, a hole 1 - a graphite spacer 4 in a press mold 5, Cu qq 3, yellow fFH foil 2, reticulated Cu-C1,
Brass foil 2, Cu @ 3, and graphite spacer 4 are stacked and loaded in this order, and an initial pressure of 50 kg/cat is applied using the upper electrode push rod 6 using a hydraulic device.
A current of 15 V-6000 A is applied to the lower electrode push rod 7 to heat each laminated material to make brass fi! Melt f3,
Brass-containing Cu is produced by diffusing it into a mesh of reticulated Cu-C, heating it at 950°C under a predetermined pressure of 250 kg/ca to 1040°C, holding it at 1040°C for 20 minutes, and then cooling it to fit cA. Foil IzJCu-C was manufactured.

The appearance of blistering in the C+i-C with brass-containing Cu foil manufactured in this way and the conventional CuC with Cu foil material.As a result, according to this example, at 400°C, both the invented product and the conventional product exhibited surface blistering. The results were as good as the generation of cracks in the cross section, but when heated to 800°C, the conventional product had a mesh-like surface blistering over the entire surface and many cracks occurred in the cross section. On the other hand, the invented product had no surface blisters or cracks in the cross section, and good results were obtained.

〔Effect of the invention〕

According to the present invention, Cu foil, reticulated Cu-C and reticulated Cυ
-C mesh Ct+-C can be completely joined and integrated with brass, which has a great effect on improving heat resistance.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of materials laminated in a hot press mold, and FIG. 2 is an explanatory diagram of a heat resistance comparison test. l...Reticular Ct+ G, 2...Brass foil, 3...C
U-basin, 4...Graphite spacer, 5...Hot press mold, 6...North electrode push rod, 7...Lower electrode push rod. Agent Patent Attorney Akio Takahashi

Claims (1)

[Claims] ],, a reticulated Cu'-C fiber composite material (hereinafter referred to as reticulated Cu-
In the production of plate-shaped Cu foil (hereinafter referred to as Cu foil 4:1 CII-C) and Cu foil heated and sintered by hot pressing using Cu foil (hereinafter referred to as Cu foil 4:1 CII-C), it has a lower melting point than gradient. , and non-ferrous metal-containing C characterized by intervening non-ferrous gold In which metallically fuses with copper.
u foil 4: j Cu-C fiber, I[[: composite material.