JPS60167245A - Sample holding device - Google Patents

Sample holding device

Info

Publication number
JPS60167245A
JPS60167245A JP2176084A JP2176084A JPS60167245A JP S60167245 A JPS60167245 A JP S60167245A JP 2176084 A JP2176084 A JP 2176084A JP 2176084 A JP2176084 A JP 2176084A JP S60167245 A JPS60167245 A JP S60167245A
Authority
JP
Japan
Prior art keywords
wafer
sample
holding
vacuum
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2176084A
Other languages
Japanese (ja)
Other versions
JPH0369138B2 (en
Inventor
Tadashi Otaka
正 大高
Takahiro Ichimura
市村 貴弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Science Systems Ltd
Original Assignee
Hitachi Ltd
Hitachi Measurement Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Measurement Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP2176084A priority Critical patent/JPS60167245A/en
Publication of JPS60167245A publication Critical patent/JPS60167245A/en
Publication of JPH0369138B2 publication Critical patent/JPH0369138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/20Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support

Abstract

PURPOSE:To automatically hold a sample according to a change of pressure in a vacuum by positioning the sample while holding a wafer end face by a displacement means including a metal bellows or the like when holding the sample such as a wafer or the like in a vacuum. CONSTITUTION:When observing a smaple 4 such as a wafer or the like by a scanning type electron microscope or the like, the wafer 4 staying in the air is placed on a sample stand 1 while being introduced into a vacuum to be observed it in the vacuum. Thereby, the wafer 4 is placed on a base stand 1 provided with supporting members 3, on which the wafer 4 is placed, and holding members 2 holding the end face of the wafer 4 while enabling the end face of the wafer 4 to be supported by a displacement means 6 displacing a holder 7 by a differential pressure between the inside and outside. Accordingly, the displacement means 6 does not operate at the atmospheric pressure while holding the wafer 4 end face in the vacuum and making the wafer 4 to slide on the supporting member 3 due to a change of the vacuum pressure so as to enable sure holding to be maintained automatically.

Description

【発明の詳細な説明】 〔発明の利用分野] 本発明は、半導体基板ウェハ(以下ウェハと呼ぶ)等の
試料保持装置に係り、特に真空中において、ウェハ等の
試料を保持するのに好適な試料保持装置に関する。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a sample holding device for a semiconductor substrate wafer (hereinafter referred to as a wafer), and particularly to a device suitable for holding a sample such as a wafer in a vacuum. This invention relates to a sample holding device.

〔発明の背景〕[Background of the invention]

走査形電子顕微i鈍あるいは電子線描画装置等でウェハ
等の試料を観察もしくはウェハ等の試料表面に′成子線
描画する場合には、大気中にあるウェハ等の試料を試料
台に装着してこれを真空中に導入し真空下でウェハ等の
試料金親察もしくは描画する方法が採られている。
When observing a sample such as a wafer with a scanning electron microscope or an electron beam lithography device, or when drawing a ray beam on the surface of a sample such as a wafer, the sample such as a wafer in the atmosphere must be mounted on a sample stage. A method is adopted in which this is introduced into a vacuum and a sample sample of a wafer or the like is inspected or drawn under vacuum.

従来のこの種の試料保持装置としては例えばウェハを保
持する場合には試料保持台に固設された板部に真空ピン
セット等でウェハの円周上の一部を直線状に切り取った
部分(この部分をオリエンテーションフラットと呼ぶ)
の端面を押し当て且つ前記試料保持台に固設された、ウ
ェハの外周部を支持する支持体に対向して該ウェハの外
周部の上面をばね等で押圧することによシウエハを保持
していた。
For example, when holding a wafer, a conventional sample holding device of this type has a plate fixed to the sample holding table, and a part of the wafer's circumference cut out in a straight line (this (This part is called the orientation flat)
The wafer is held by pressing the end surface of the wafer and pressing the upper surface of the outer periphery of the wafer with a spring or the like against a support that supports the outer periphery of the wafer and is fixed to the sample holding table. Ta.

しかし上記した従来の試料保持装置にあっては試料を保
持させる為のセットをビンセット等ヲ用いて手動で行な
う為に、ごみの付着確率が大であシ、またウェハの端面
もしくは上部を、ばね等で押さえる為にウェハに鵠が付
く。更にウェハの位置決めが正確に行なえない等の欠点
を有していた。
However, in the conventional sample holding device described above, since the setting for holding the sample is done manually using a bottle set, etc., there is a high probability that dust will adhere to the sample, and the end surface or upper part of the wafer may be The wafer is held in place by a spring, etc. Furthermore, it has the disadvantage that the wafer cannot be positioned accurately.

〔発明の目的〕[Purpose of the invention]

本発明の目的は試料を損傷することなく正確に試料の位
置決めを行い得る試料保持装置を提供することにある。
An object of the present invention is to provide a sample holding device that can accurately position a sample without damaging the sample.

〔発明の概要〕[Summary of the invention]

本発明は、真空中でウェハ等の試料を保持する試料保持
装置において、基台に固設された支持部材と、基台に固
設され支持部材に載置された試料端面を保持する複数の
保持部材と、支持部材に載置された試料端面を保持する
複数の保持部材と、支持部材に載置された試料端面を前
記保持部材と共に保持するための保持体を先端に有し周
囲の圧力変化によシ変位する手段とからなり、該変位手
段は周囲の圧力が大気圧から真空圧に変化した時に先端
の保持体が試料端面に押圧する位置まで変・位すること
を特徴とするものである。
The present invention provides a sample holding device that holds a sample such as a wafer in a vacuum, including a support member fixed to a base, and a plurality of support members fixed to the base and holding the end surface of the sample placed on the support member. A holding member, a plurality of holding members that hold the end face of the sample placed on the support member, and a holder at the tip for holding the end face of the sample placed on the support member together with the holding member, and the surrounding pressure is reduced. and means for displacing due to change, and the displacing means is characterized in that when the surrounding pressure changes from atmospheric pressure to vacuum pressure, the displacing means displaces to a position where the holder at the tip presses against the end surface of the sample. It is.

〔発明の実施例〕[Embodiments of the invention]

本発明の実施例を図面に基づいて祝明する。第1図には
不発明に係る試料保持装置の一実力市例の構成が示され
ており、同図において1は基台であυ、該基台1には試
料としてのウエノ・4が載置される支持部材3が固設さ
れてお9、更にウニ/・4の端面を保持する保持部材2
が固設ぜれている。
Embodiments of the present invention will be celebrated based on the drawings. FIG. 1 shows the configuration of an example of the sample holding device according to the present invention. In the figure, 1 is a base υ, and Ueno-4 as a sample is placed on the base 1. A supporting member 3 to be placed is fixedly installed 9, and a holding member 2 for holding the end face of the sea urchin/4 is fixed.
is permanently installed.

また基台1には支持部材3に載置されたウェハ4の端面
を保持部材2と共に保持するだめの保持体7を先端に有
する変位手段(本実施例では金属ベローズ)6が固設さ
れている。金属ベローズ6内部には気体または液体が対
人されており、金属ベローズ6は、その内外の圧力差に
よシ保持体7を変位させる。更に5は金属ベローズ6が
周囲圧力の変化により変位した時に保持体7の移動方向
を規制するだめのガイドである。
Further, a displacement means (metal bellows in this embodiment) 6 is fixedly mounted on the base 1 and has a retainer 7 at its tip for retaining the end face of the wafer 4 placed on the support member 3 together with the retainer 2. There is. Gas or liquid is contained inside the metal bellows 6, and the metal bellows 6 displaces the holder 7 due to the pressure difference between the inside and outside of the metal bellows 6. Furthermore, 5 is a guide for regulating the direction of movement of the holder 7 when the metal bellows 6 is displaced due to a change in ambient pressure.

上記構成からなる試料保持装置の動作を第2図及び第3
図により説明する。第2図は動作前の状態を示し、第3
図は動作後の状態を示している。
The operation of the sample holding device with the above configuration is shown in Figures 2 and 3.
This will be explained using figures. Figure 2 shows the state before operation, and Figure 3 shows the state before operation.
The figure shows the state after operation.

金属ベローズ6は周囲の圧力が大気圧になっている時に
は第2図に示す状態にあり、周囲の圧力が真空圧に変化
すると、ウエノ・4を2方向にウェハ4を3箇の支持部
材3上部を滑9ながら進ませ、ウェハ4のオリエンテー
ションフラット部と保持部材202箇が接触し、3箇の
保持部材2と保持体7で保持されるまで伸び方向に変位
し続けることによシウエノ・4を保持する状態に至る(
第3図)。
When the surrounding pressure is atmospheric pressure, the metal bellows 6 is in the state shown in FIG. By sliding the upper part of the wafer 4 and continuing to displace it in the elongation direction until the orientation flat part of the wafer 4 contacts the 202 holding members and is held by the 3 holding members 2 and the holder 7, the wafer 4 (
Figure 3).

本実施例における実験結果は4インチウエノ・中心部で
最大5ミクロン、ウェハ端で15ミクロンのずれを観測
した。この時用いた保持部材2及び保持体7の偏心量は
最大1ミクロンであった。
In the experimental results of this example, a maximum deviation of 5 microns at the center of a 4-inch wafer and a deviation of 15 microns at the edge of the wafer was observed. The eccentricity of the holding member 2 and the holding body 7 used at this time was 1 micron at most.

本実施例によれば、上記したように真壁室中において、
下記のような特徴及び効果を有している。
According to this embodiment, in the Makabe chamber as described above,
It has the following features and effects.

(1)真空室中において、上記保持装置は真空室中の圧
力の変化のみだけで自動的にウエノ・を保持することが
可能である。
(1) In a vacuum chamber, the above-mentioned holding device can automatically hold the wafer only by changing the pressure in the vacuum chamber.

(2)上述第1項において、圧力の低下は徐々に行外+
−1引六ムfカエハをウェハ俣椿位骨に静動的に保持す
ることが可能でおる。
(2) In paragraph 1 above, the pressure decrease gradually goes out of line +
-1 It is possible to statically and dynamically hold the wafer on the wafer.

(3) ウェハを保持する為の保持力は、真空室内部の
圧力変化が大気圧からある任意の圧力までを反復して行
なわれるために保持装置における保持部材がウェハ端面
に与える保持力はほぼ一定であり、しかも上記事項は再
現性に対し非常に効果がちる。
(3) The holding force for holding the wafer is that the pressure inside the vacuum chamber changes repeatedly from atmospheric pressure to a certain arbitrary pressure, so the holding force exerted by the holding member in the holding device on the wafer end surface is approximately Moreover, the above-mentioned matters have a great effect on reproducibility.

第4図は本発明の他の実施例を示すもので、第1図と異
なるのはウェハ4のオリエンテーションフラット部を直
接金属ベローズ6にオリエンテーションフラット押板8
を固定した保持部材でもって、オリエ/テーショ/フラ
ット端部を押圧することによりウニ/・保持位置にウエ
ノヘ4を保持するものである。
FIG. 4 shows another embodiment of the present invention, which differs from FIG.
The Uenohe 4 is held in the holding position by pressing the orientation/station/flat end with a holding member to which the Uenohe 4 is fixed.

本実施例では、保持部材2の数量を第1図に示した実施
例に比して少なく出来ることから、上記 。
In this embodiment, the number of holding members 2 can be reduced compared to the embodiment shown in FIG.

保持装置における保持部材2の偏心が原因で発生するウ
ェハの位置ずれを減少させることが可能でめる。
It is possible to reduce misalignment of the wafer caused by eccentricity of the holding member 2 in the holding device.

また本実施例によれば被保持物体はウエノ・に限らず三
角形以上の多角形形状を有する被保持体をも、オリエン
テーションフラット押板8の形状を相当させることによ
シ真空中において、確実に保持することが可能である。
Furthermore, according to this embodiment, the object to be held is not limited to Ueno, but also objects having a polygonal shape larger than a triangle can be reliably held in a vacuum by making the shape of the orientation flat press plate 8 correspond. It is possible to hold.

第4図において、第1図と同一番号を付した部材は同一
部材を示すものであるので、ここでは説明を省く。
In FIG. 4, members given the same numbers as those in FIG. 1 indicate the same members, so a description thereof will be omitted here.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、ウェハ等の試料を真空室中において、
上記室中の圧力の変化のみでもって自動的かつ静動的に
保持可能であり、しかも再現性が良好であるので、試料
を損傷することなく、所定位置に正確に保持することが
可能となる。
According to the present invention, a sample such as a wafer is placed in a vacuum chamber,
It can be held automatically and statically by changing the pressure in the chamber mentioned above, and has good reproducibility, so it is possible to accurately hold the sample in a predetermined position without damaging it. .

尚、上記実施例においてはウェハの保持について詳述し
たが、これは単にウェハのみに限ることではなく、例え
ば磁気デスク、オーディオデスク等の板材あるいはブロ
ック等であっても同様である。また変位手段として実施
例では金属ベローズを用いているがこれに限らず、ゴム
等の弾性体であってもよい。
Incidentally, in the above embodiments, the holding of the wafer has been described in detail, but this is not limited to just the wafer, and the same holds true for, for example, plates or blocks of magnetic desks, audio desks, etc. Furthermore, although a metal bellows is used in the embodiment as the displacement means, the present invention is not limited to this, and an elastic body such as rubber may be used.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る試料保持装置の一実施例の構成を
示す平面図、第2図及び第3図は第1図に示した試料保
持装置の正面図の要部を示し、第2図は動作前の状態を
、第3図は動作後の状態をそれぞれ示す図、第4図は本
発明に試料保持装置の他の実施例の構成を示す平面図で
おる。 1・・・基台、2・・・保持部材、3・・・支持部材、
4・・・ウェハ、5・・・ガイド、6・・・変位手段、
7・・・保持体、第 1 図 第 2 固 第 3 凶 第、 4 図 1 656s
FIG. 1 is a plan view showing the configuration of an embodiment of the sample holding device according to the present invention, FIGS. 2 and 3 are main parts of the front view of the sample holding device shown in FIG. 3 shows the state before operation, FIG. 3 shows the state after operation, and FIG. 4 is a plan view showing the structure of another embodiment of the sample holding device according to the present invention. 1... Base, 2... Holding member, 3... Supporting member,
4... Wafer, 5... Guide, 6... Displacement means,
7...Holding body, Fig. 1 Fig. 2 Hard No. 3 No. 4 Fig. 1 656s

Claims (1)

【特許請求の範囲】 1、真空中でウェハ等の試料を保持する試料保持装置に
おいて、基台に固設された支持部材と、基台に固設され
支持部材に載置された試料端面を保持する複数の保持部
材と、支持部材に載置された試料端面を保持する複数の
保持部材と、支持部材に載置された試料端面を前記保持
部材と共に保持するための保持体を先端に有し周囲の圧
力変化により変位する手段とからなり、該変位手段は周
囲の圧力が大気圧から真空圧に変化した時に先端の保持
体が試料端面に押圧する位置まで変位することを特徴と
する試料保持装置。 2、前記変位手段は金属ベローズまたはゴム等の弾性体
に気体または液体を封入した博造としたことを特徴とす
る特許請求の範囲第1項記載の試料保持装置。
[Claims] 1. In a sample holding device that holds a sample such as a wafer in a vacuum, a support member fixed to a base and an end face of the sample fixed to the base and placed on the support member are provided. A plurality of holding members to hold, a plurality of holding members to hold the end face of the sample placed on the supporting member, and a holder for holding the end face of the sample placed on the supporting member together with the holding members at the tip. and means for displacing due to changes in surrounding pressure, the displacing means displacing to a position where the holder at the tip presses against the end surface of the sample when the surrounding pressure changes from atmospheric pressure to vacuum pressure. holding device. 2. The sample holding device according to claim 1, wherein the displacement means is a metal bellows or an elastic material such as rubber filled with gas or liquid.
JP2176084A 1984-02-10 1984-02-10 Sample holding device Granted JPS60167245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2176084A JPS60167245A (en) 1984-02-10 1984-02-10 Sample holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2176084A JPS60167245A (en) 1984-02-10 1984-02-10 Sample holding device

Publications (2)

Publication Number Publication Date
JPS60167245A true JPS60167245A (en) 1985-08-30
JPH0369138B2 JPH0369138B2 (en) 1991-10-31

Family

ID=12064019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2176084A Granted JPS60167245A (en) 1984-02-10 1984-02-10 Sample holding device

Country Status (1)

Country Link
JP (1) JPS60167245A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6382935U (en) * 1986-11-19 1988-05-31
JPS6471050A (en) * 1987-05-04 1989-03-16 Varian Associates Wafer holder
US6509564B1 (en) 1998-04-20 2003-01-21 Hitachi, Ltd. Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method
EP1890325A1 (en) * 2005-05-18 2008-02-20 Murata Manufacturing Co., Ltd. Aligning stage, bump forming apparatus and bump forming method using such aligning stage
JP2018026197A (en) * 2016-08-08 2018-02-15 国立研究開発法人産業技術総合研究所 Microscopic observation method and microscopic observation auxiliary device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6382935U (en) * 1986-11-19 1988-05-31
JPS6471050A (en) * 1987-05-04 1989-03-16 Varian Associates Wafer holder
US6509564B1 (en) 1998-04-20 2003-01-21 Hitachi, Ltd. Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method
US6768113B2 (en) 1998-04-20 2004-07-27 Hitachi, Ltd. Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method
EP1890325A1 (en) * 2005-05-18 2008-02-20 Murata Manufacturing Co., Ltd. Aligning stage, bump forming apparatus and bump forming method using such aligning stage
EP1890325A4 (en) * 2005-05-18 2008-09-17 Murata Manufacturing Co Aligning stage, bump forming apparatus and bump forming method using such aligning stage
US7508495B2 (en) 2005-05-18 2009-03-24 Murata Manufacturing Co., Ltd. Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage
JP2018026197A (en) * 2016-08-08 2018-02-15 国立研究開発法人産業技術総合研究所 Microscopic observation method and microscopic observation auxiliary device

Also Published As

Publication number Publication date
JPH0369138B2 (en) 1991-10-31

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