JPS60166192A - 高融点ハンダ - Google Patents

高融点ハンダ

Info

Publication number
JPS60166192A
JPS60166192A JP2035384A JP2035384A JPS60166192A JP S60166192 A JPS60166192 A JP S60166192A JP 2035384 A JP2035384 A JP 2035384A JP 2035384 A JP2035384 A JP 2035384A JP S60166192 A JPS60166192 A JP S60166192A
Authority
JP
Japan
Prior art keywords
solder
melting point
high melting
point solder
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2035384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216748B2 (enExample
Inventor
Kaisuke Shiroyama
城山　魁助
Sukeyuki Kikuchi
菊地　祐行
Keizo Kosugi
小杉　恵三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2035384A priority Critical patent/JPS60166192A/ja
Publication of JPS60166192A publication Critical patent/JPS60166192A/ja
Publication of JPS6216748B2 publication Critical patent/JPS6216748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2035384A 1984-02-07 1984-02-07 高融点ハンダ Granted JPS60166192A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2035384A JPS60166192A (ja) 1984-02-07 1984-02-07 高融点ハンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2035384A JPS60166192A (ja) 1984-02-07 1984-02-07 高融点ハンダ

Publications (2)

Publication Number Publication Date
JPS60166192A true JPS60166192A (ja) 1985-08-29
JPS6216748B2 JPS6216748B2 (enExample) 1987-04-14

Family

ID=12024748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2035384A Granted JPS60166192A (ja) 1984-02-07 1984-02-07 高融点ハンダ

Country Status (1)

Country Link
JP (1) JPS60166192A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099849A1 (ja) 2011-12-27 2013-07-04 千住金属工業株式会社 Ｓｎ－Ｃｕ系鉛フリーはんだ合金

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128459A (en) * 1978-03-29 1979-10-05 Keiichirou Ebihara Phosphorrcontaining solder alloy and additive alloy therefor
JPS5838694A (ja) * 1981-08-31 1983-03-07 Toshiba Corp 半導体ダイボンデイング用はんだ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128459A (en) * 1978-03-29 1979-10-05 Keiichirou Ebihara Phosphorrcontaining solder alloy and additive alloy therefor
JPS5838694A (ja) * 1981-08-31 1983-03-07 Toshiba Corp 半導体ダイボンデイング用はんだ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099849A1 (ja) 2011-12-27 2013-07-04 千住金属工業株式会社 Ｓｎ－Ｃｕ系鉛フリーはんだ合金
KR20140108240A (ko) 2011-12-27 2014-09-05 센주긴조쿠고교 가부시키가이샤 Ｓｎ-Ｃｕ계 납프리 땜납 합금
US10137536B2 (en) 2011-12-27 2018-11-27 Senju Metal Industry Co., Ltd. Sn-Cu-based lead-free solder alloy

Also Published As

Publication number Publication date
JPS6216748B2 (enExample) 1987-04-14

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