JPS6216748B2 - - Google Patents

Info

Publication number
JPS6216748B2
JPS6216748B2 JP59020353A JP2035384A JPS6216748B2 JP S6216748 B2 JPS6216748 B2 JP S6216748B2 JP 59020353 A JP59020353 A JP 59020353A JP 2035384 A JP2035384 A JP 2035384A JP S6216748 B2 JPS6216748 B2 JP S6216748B2
Authority
JP
Japan
Prior art keywords
solder
melting point
high melting
tape
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59020353A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60166192A (ja
Inventor
Kaisuke Shiroyama
Sukeyuki Kikuchi
Keizo Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2035384A priority Critical patent/JPS60166192A/ja
Publication of JPS60166192A publication Critical patent/JPS60166192A/ja
Publication of JPS6216748B2 publication Critical patent/JPS6216748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2035384A 1984-02-07 1984-02-07 高融点ハンダ Granted JPS60166192A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2035384A JPS60166192A (ja) 1984-02-07 1984-02-07 高融点ハンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2035384A JPS60166192A (ja) 1984-02-07 1984-02-07 高融点ハンダ

Publications (2)

Publication Number Publication Date
JPS60166192A JPS60166192A (ja) 1985-08-29
JPS6216748B2 true JPS6216748B2 (enExample) 1987-04-14

Family

ID=12024748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2035384A Granted JPS60166192A (ja) 1984-02-07 1984-02-07 高融点ハンダ

Country Status (1)

Country Link
JP (1) JPS60166192A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10137536B2 (en) 2011-12-27 2018-11-27 Senju Metal Industry Co., Ltd. Sn-Cu-based lead-free solder alloy

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128459A (en) * 1978-03-29 1979-10-05 Keiichirou Ebihara Phosphorrcontaining solder alloy and additive alloy therefor
JPS5838694A (ja) * 1981-08-31 1983-03-07 Toshiba Corp 半導体ダイボンデイング用はんだ

Also Published As

Publication number Publication date
JPS60166192A (ja) 1985-08-29

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