JPS60165725A - ドライエツチング方法 - Google Patents

ドライエツチング方法

Info

Publication number
JPS60165725A
JPS60165725A JP59020995A JP2099584A JPS60165725A JP S60165725 A JPS60165725 A JP S60165725A JP 59020995 A JP59020995 A JP 59020995A JP 2099584 A JP2099584 A JP 2099584A JP S60165725 A JPS60165725 A JP S60165725A
Authority
JP
Japan
Prior art keywords
sample
light
etching
organic
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59020995A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363808B2 (https=
Inventor
Haruo Okano
晴雄 岡野
Yasuhiro Horiike
靖浩 堀池
Makoto Sekine
誠 関根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59020995A priority Critical patent/JPS60165725A/ja
Publication of JPS60165725A publication Critical patent/JPS60165725A/ja
Publication of JPH0363808B2 publication Critical patent/JPH0363808B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Drying Of Semiconductors (AREA)
JP59020995A 1984-02-08 1984-02-08 ドライエツチング方法 Granted JPS60165725A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59020995A JPS60165725A (ja) 1984-02-08 1984-02-08 ドライエツチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59020995A JPS60165725A (ja) 1984-02-08 1984-02-08 ドライエツチング方法

Publications (2)

Publication Number Publication Date
JPS60165725A true JPS60165725A (ja) 1985-08-28
JPH0363808B2 JPH0363808B2 (https=) 1991-10-02

Family

ID=12042699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59020995A Granted JPS60165725A (ja) 1984-02-08 1984-02-08 ドライエツチング方法

Country Status (1)

Country Link
JP (1) JPS60165725A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489519A (en) * 1987-09-30 1989-04-04 Toshiba Corp Dry etching
JPH0480383A (ja) * 1990-07-24 1992-03-13 Sony Corp 銅系材料のパターニング方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194257A (en) * 1981-05-26 1982-11-29 Ibm Dry etching process
JPS58100683A (ja) * 1981-12-12 1983-06-15 Nippon Telegr & Teleph Corp <Ntt> プラズマエツチング方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194257A (en) * 1981-05-26 1982-11-29 Ibm Dry etching process
JPS58100683A (ja) * 1981-12-12 1983-06-15 Nippon Telegr & Teleph Corp <Ntt> プラズマエツチング方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489519A (en) * 1987-09-30 1989-04-04 Toshiba Corp Dry etching
JPH0480383A (ja) * 1990-07-24 1992-03-13 Sony Corp 銅系材料のパターニング方法

Also Published As

Publication number Publication date
JPH0363808B2 (https=) 1991-10-02

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