JPS60165378A - Semicontinuously taking-up type vapor deposition device - Google Patents

Semicontinuously taking-up type vapor deposition device

Info

Publication number
JPS60165378A
JPS60165378A JP2312784A JP2312784A JPS60165378A JP S60165378 A JPS60165378 A JP S60165378A JP 2312784 A JP2312784 A JP 2312784A JP 2312784 A JP2312784 A JP 2312784A JP S60165378 A JPS60165378 A JP S60165378A
Authority
JP
Japan
Prior art keywords
vapor deposition
vacuum
evaporation source
exhaust pipe
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2312784A
Other languages
Japanese (ja)
Inventor
Kazuo Iwaoka
和男 岩岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2312784A priority Critical patent/JPS60165378A/en
Publication of JPS60165378A publication Critical patent/JPS60165378A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To reduce the capacity of a vacuum tank and enhance productivity, by a construction wherein a feeding system for an elongate substrate molded from a high molecular weight substance and a vapor deposition roller are provided in a vacuum tank, a vapor source is provided in an evacuating pipe connected to a lower part of the tank, and is moved vertically by a movable jig. CONSTITUTION:A pay away shaft 8 and a take-up shaft 7 for the elongate substrate 9 molded from a high molecular weight substance and the vapor deposition roller 10 are provided in the vacuum tank 1, and an electron gun 12 for heating a vapor source 14 is provided at a wall of the tank 1. The vapor source 14 is provided in the evacuating pipe 3 connected to a lower part of the tank 1 so that it can be vertically moved by a cylinder 20 through a vacuum shaft seal mechanism 19. In addition, a shielding body 15 is provided for shielding the vapor source 14 and a part or the entire part of the pipe 3 from the roller 10 when the vapor source 14 is located at the lowered position in the pipe 3.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は真空槽内で高分子成形基板を連続的に走行させ
ながら該基板表面に金属や金属酸化物などを真空蒸着す
る半連続巻取式蒸着装置に関するものである。
Detailed Description of the Invention: Industrial Field of Application The present invention relates to semi-continuous winding vapor deposition in which metals, metal oxides, etc. are vacuum evaporated onto the surface of a polymer molded substrate while the substrate is continuously moved in a vacuum chamber. It is related to the device.

従来例の構成とその問題点 真空蒸着法による薄膜の形成技術は近年産業界で多く利
用されるに至った。半導体工業やレンズ。
Conventional Structures and Their Problems Thin film formation techniques by vacuum evaporation have come into widespread use in industry in recent years. semiconductor industry and lenses.

ガラスなどへの反射防止膜や色をつけるための比較的小
型の真空蒸着装置から、装飾用、包装用やコンデンサ用
に紙や高分子フィルム表面に薄膜を形成する比較的大型
の真空蒸着装置まで形状、構成も多くなっている。これ
ら真空蒸着装置にあって長尺の紙や高分子フィルム表面
に薄膜を形成するための真空蒸着装置は、真空槽内に長
尺基板の走行系と蒸着材料を蒸発させる加熱源と蒸発源
を配置して成9、長尺の基板を走行させながら基板表面
に真空蒸着を連続的に行なうもので一般的に半連続巻取
式蒸着装置と云われるものである。
From relatively small vacuum evaporation equipment for applying antireflection coatings and colors to glass, etc., to relatively large vacuum evaporation equipment for forming thin films on paper and polymer film surfaces for decoration, packaging, and capacitors. There are many shapes and configurations. These vacuum evaporation devices, which are used to form a thin film on the surface of a long piece of paper or polymer film, have a running system for the long substrate in a vacuum chamber, a heating source for evaporating the evaporation material, and an evaporation source. This apparatus is generally referred to as a semi-continuous winding type vapor deposition apparatus, which continuously performs vacuum deposition on the surface of a long substrate while running the apparatus.

第1図に半連続巻取式蒸着装置の従来例の構成を示す。FIG. 1 shows the configuration of a conventional semi-continuous winding type vapor deposition apparatus.

真空槽30は遮蔽板37により上室42と下室43に分
離されている。上室は排気管31、下室は排気管32に
よシ真空排気される。長尺基板35は上室42の巻出軸
33にセットされ蒸着ローラ36の外周を蒸着ローラ3
6と同期して走行し巻取軸34に巻取られる。蒸発源4
oは下室43下部に設けられたベース38上の蒸発材料
収納容器39内に納められ加熱源41にて加熱、蒸発し
、蒸発源40上部の蒸着ローラ36上の長尺基板36表
面に蒸着される。蒸着ロー236と蒸発源40間には図
示されてないが開閉のできるシャッターが設けられてい
る。このように従来から用いられている半連続巻取式蒸
着装置は真空槽内に長尺基板搬送系と、蒸着材料の蒸発
源系を配置してそれぞれの系を真空排気装置により真空
排気している。
The vacuum chamber 30 is separated into an upper chamber 42 and a lower chamber 43 by a shielding plate 37. The upper chamber is evacuated through an exhaust pipe 31 and the lower chamber is evacuated through an exhaust pipe 32. The long substrate 35 is set on the unwinding shaft 33 of the upper chamber 42, and the outer periphery of the vapor deposition roller 36 is placed on the vapor deposition roller 3.
6 and is wound onto the winding shaft 34. Evaporation source 4
o is stored in an evaporation material storage container 39 on a base 38 provided at the bottom of the lower chamber 43, heated and evaporated by a heating source 41, and deposited on the surface of the long substrate 36 on the evaporation roller 36 above the evaporation source 40. be done. Although not shown, a shutter that can be opened and closed is provided between the deposition row 236 and the evaporation source 40. In this way, the semi-continuous winding type vapor deposition apparatus that has been used conventionally has a long substrate transport system and a vapor deposition material evaporation source system placed in a vacuum chamber, and each system is evacuated using a vacuum evacuation device. There is.

このような従来の構成によれば、巻出2巻取外径の増加
や蒸着ローラ径の増大に供なって真空槽の容積も増加し
て真空排気装置も大型となシ装置への設備投資額の増加
とともに設置床面積の増加、ランニングコスト増加など
の問題点が生じてきた。
According to such a conventional configuration, as the outer diameter of the unwinding, two-winding, and the evaporating rollers increase, the volume of the vacuum chamber also increases, and the vacuum evacuation equipment also becomes larger, which requires capital investment in equipment. Along with the increase in price, problems such as an increase in installation floor space and an increase in running costs have arisen.

発明の目的 本発明はこれら半連続巻取式蒸着装置の大型化に対し真
空槽の容積を小さくして、かつ生産性を高め、使い勝手
の良い半連続巻取式蒸着装置を提供することを目的とす
るものである。
Purpose of the Invention The purpose of the present invention is to provide an easy-to-use semi-continuous winding type vapor deposition apparatus that reduces the volume of a vacuum chamber in response to the increase in the size of these semi-continuous winding type vapor deposition apparatuses, increases productivity, and improves productivity. That is.

発明の構成 本発明は、真空排気装置により減圧のできる真空槽内に
高分子成形物よ構成る長尺基板の搬送系と蒸着ローラを
配し、蒸発源を真空槽の下部に接続した真空排気管内に
配置したものである。さらにその蒸発源を真空排気管内
に設けられた可動治具により真空排気管内を上下移動で
きるように構・威しだものである。
Structure of the Invention The present invention provides a vacuum evacuation system in which a conveyance system for a long substrate made of a polymer molded product and a deposition roller are placed in a vacuum chamber that can be depressurized by a vacuum evacuation device, and an evaporation source is connected to the bottom of the vacuum chamber. It is placed inside the pipe. Furthermore, the evaporation source is configured so that it can be moved up and down within the vacuum exhaust pipe by a movable jig provided within the vacuum exhaust pipe.

実施例の説明 第2図に本発明の一実施例を示す。真空槽1は従来と同
様遮蔽板6により上室4と下室5に分離され、上室4は
真空排気管2により、下室5は真空排気管3によシそれ
ぞれ所定の真空度まで真空排気される。上室4には厚さ
12μm、幅4001111111長さ10,000 
mのポリエステル基板9が捲回されて巻出軸8にセント
されている、該基板は図示されていないフリーローラ、
エキスパンダーローラを経て蒸着ローラ1oの外周に沿
って蒸着ローラの回転と同期して走行し、再び図示され
ていないフリーローラ、エキスパンダー〇−2を経て巻
取軸7に巻取られる。
DESCRIPTION OF EMBODIMENTS FIG. 2 shows an embodiment of the present invention. The vacuum chamber 1 is separated into an upper chamber 4 and a lower chamber 5 by a shielding plate 6 as in the conventional case, and the upper chamber 4 is evacuated to a predetermined degree of vacuum by the evacuation pipe 2 and the lower chamber 5 by the evacuation pipe 3. Exhausted. The upper chamber 4 has a thickness of 12 μm, a width of 4001111111 and a length of 10,000 mm.
A polyester substrate 9 of m is wound and centered on the unwinding shaft 8, and the substrate is moved by a free roller (not shown),
It travels along the outer periphery of the vapor deposition roller 1o via an expander roller in synchronization with the rotation of the vapor deposition roller, and is again wound onto the winding shaft 7 via a free roller (not shown) and an expander 0-2.

一方蒸発源系は、真空槽1壁に設けられた電子銃12か
ら発せられる加速電子を加熱源とし、耐火レンガよ構成
る長さ600職のルツボ13に蒸着材料であるコバルト
14を入れて電子線を照射して加熱、溶解、蒸発させて
いる。基板への蒸着はコバルト14の蒸発を十分にさせ
た後、基板9を走行させながらシャッター11を閉状態
より開とすることにより行なう、蒸着の終了はシャッタ
ー11を閉とする。従来例ではルツボは真空槽1内の固
定ベース上に置かれているが、本実施例のルツボ13は
、真空軸シール機構19を介してシリンダ20によ如上
下運動が可能な可動軸18上に設けられたルツボ受台2
1上に置かれている。
On the other hand, in the evaporation source system, accelerated electrons emitted from an electron gun 12 installed on the wall of a vacuum chamber 1 are used as a heating source, and cobalt 14, which is an evaporation material, is placed in a crucible 13 made of fireproof bricks with a length of 600 mm. It is heated, melted, and evaporated by irradiating it with radiation. After the cobalt 14 has been sufficiently evaporated, the vapor deposition onto the substrate is performed by opening the shutter 11 from the closed state while the substrate 9 is running.The vapor deposition is completed by closing the shutter 11. In the conventional example, the crucible is placed on a fixed base in the vacuum chamber 1, but the crucible 13 in this embodiment is placed on a movable shaft 18 that can be moved up and down by a cylinder 20 via a vacuum shaft sealing mechanism 19. crucible pedestal 2 installed in
It is placed on top of 1.

ルツボ13位置は、蒸発材料14の加熱、溶解、蒸発工
程では第2図の実線位置であシ、真空蒸着終了後に真空
槽真空破壊をするときは可動軸18を下方移動して破線
で示すルツボ13′の位置まで移動させる。この場合支
点16で固定されている開閉弁15を動作させて実線位
置よシ破線位置(15’)となしてルツボ13′の上部
を遮蔽する。17は真空排気管壁に内設された開閉弁1
6′の受けである0尚該開閉弁15が動作によシ破線位
置となった場合真空排気管の断面の全部もしくは一部を
遮蔽し、さらに受け17との間を密封してルツボ13′
を真空状態にする機能も本発明に含まれるものである。
The position of the crucible 13 is the position indicated by the solid line in FIG. 2 during the heating, melting, and evaporation processes of the evaporation material 14, and when the vacuum chamber is broken after the completion of vacuum evaporation, the movable shaft 18 is moved downward and the crucible 13 is moved to the position indicated by the broken line. Move it to position 13'. In this case, the on-off valve 15, which is fixed at the fulcrum 16, is operated to move from the solid line position to the broken line position (15'), thereby shielding the upper part of the crucible 13'. 17 is an on-off valve 1 installed inside the vacuum exhaust pipe wall.
Furthermore, when the opening/closing valve 15 is moved to the broken line position due to operation, all or part of the cross section of the vacuum exhaust pipe is shielded, and the space between the crucible 13' and the receiver 17 is sealed.
The present invention also includes the function of bringing the material into a vacuum state.

発明の効果 以上のように構成された本発明の半連続巻取式蒸着装置
は、 (1)蒸発源が真空排気管内に配置されていて、真空槽
の容積を小さくできる。
Effects of the Invention The semi-continuous winding type vapor deposition apparatus of the present invention configured as described above has the following features: (1) The evaporation source is disposed within the vacuum exhaust pipe, and the volume of the vacuum chamber can be reduced.

(2)従って真空排気装置容量が小さくてすむ。(2) Therefore, the capacity of the vacuum evacuation device can be small.

(3)真空槽、真空排気装置とも小型化が可能で半連続
巻取式蒸着装置の価格が安価になシ、合せてランニング
コストも低減する。
(3) Both the vacuum chamber and the vacuum evacuation device can be downsized, and the price of the semi-continuous winding type vapor deposition device can be reduced, and running costs can also be reduced.

(4)装置価格、ランニングコストの低減により、蒸着
層を有する製品価格も安価になる。
(4) Due to the reduction in equipment cost and running cost, the price of products with vapor deposited layers also becomes cheaper.

(5)蒸発源系の整備、調整の場合、ルツボを下げ、開
閉弁を閉じることによシ作業スペース及び安全の確保が
できる。
(5) When maintaining or adjusting the evaporation source system, work space and safety can be ensured by lowering the crucible and closing the on-off valve.

などの効果があシ、本発明は半連続巻取式蒸着装置の産
業性を高める効果が大である。
In addition to the above effects, the present invention has a great effect of improving the industrial efficiency of semi-continuous winding type vapor deposition apparatus.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の半連続巻取式蒸着装置の構成図、第2図
は本発明の一実施例の構成図である。 1・・・・・・真空槽、7・・・・・・巻取軸、8・・
・・・・巻出軸、9・・・・・・長尺基板、1o・・・
・・・蒸着ローラ、12・・・・・・電子銃、14・・
・・・・蒸発源、15・・・・・・開閉弁、18・・・
・・・可動軸、2o・・・・・・シリンダ。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第 
1711
FIG. 1 is a block diagram of a conventional semi-continuous winding type vapor deposition apparatus, and FIG. 2 is a block diagram of an embodiment of the present invention. 1... Vacuum chamber, 7... Winding shaft, 8...
...Unwinding shaft, 9...Long board, 1o...
...Vapor deposition roller, 12...Electron gun, 14...
...Evaporation source, 15...Opening/closing valve, 18...
...Movable axis, 2o...Cylinder. Name of agent: Patent attorney Toshio Nakao and 1 other person
1711

Claims (3)

【特許請求の範囲】[Claims] (1)真空槽内に高分子成形長尺基板の搬走系と蒸着ロ
ーラを設け、蒸発源加熱用の電子ビーム発生装置を真空
槽の壁に設け、蒸発源を真空槽の下部に接続した真空排
気管内に配置したことを特徴とする半連続巻取式蒸着装
置。
(1) A transport system for the long polymer molded substrate and a deposition roller were installed in the vacuum chamber, an electron beam generator for heating the evaporation source was installed on the wall of the vacuum chamber, and the evaporation source was connected to the bottom of the vacuum chamber. A semi-continuous winding type vapor deposition device characterized by being placed inside a vacuum exhaust pipe.
(2)蒸着源は、真空排気管内に設けられた上下運動が
可能な支持体上にあって真空排気管内を上下に移動する
構成を有する特許請求の範囲第1項記載の半連続巻取式
蒸着装置。
(2) The evaporation source is a semi-continuous winding type according to claim 1, wherein the vapor deposition source is on a vertically movable support provided in the vacuum exhaust pipe and is configured to move vertically within the vacuum exhaust pipe. Vapor deposition equipment.
(3)蒸発源が真空排気管内で下方移動した位置にある
とき、蒸発源と蒸着ローラ間の真空排気管の一部もしく
は大部分を遮蔽する遮蔽体を設けたことを特徴とする特
許請求の範囲第1項記載の半連続巻取式蒸着装置。
(3) A patent claim characterized in that, when the evaporation source is at a position moved downward within the vacuum exhaust pipe, a shield is provided to shield a part or most of the vacuum exhaust pipe between the evaporation source and the deposition roller. A semi-continuous winding type vapor deposition apparatus according to scope 1.
JP2312784A 1984-02-09 1984-02-09 Semicontinuously taking-up type vapor deposition device Pending JPS60165378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2312784A JPS60165378A (en) 1984-02-09 1984-02-09 Semicontinuously taking-up type vapor deposition device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2312784A JPS60165378A (en) 1984-02-09 1984-02-09 Semicontinuously taking-up type vapor deposition device

Publications (1)

Publication Number Publication Date
JPS60165378A true JPS60165378A (en) 1985-08-28

Family

ID=12101849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2312784A Pending JPS60165378A (en) 1984-02-09 1984-02-09 Semicontinuously taking-up type vapor deposition device

Country Status (1)

Country Link
JP (1) JPS60165378A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5601652A (en) * 1989-08-03 1997-02-11 United Technologies Corporation Apparatus for applying ceramic coatings
JP2000216591A (en) * 1999-01-25 2000-08-04 Matsushita Electric Ind Co Ltd Shielding material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5601652A (en) * 1989-08-03 1997-02-11 United Technologies Corporation Apparatus for applying ceramic coatings
JP2000216591A (en) * 1999-01-25 2000-08-04 Matsushita Electric Ind Co Ltd Shielding material

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