JPS60159167A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To provide a titled device which performs vapor deposition for long time by supplying an evaporating material such as a round bar without breaking the vacuum and improves working efficiency by the constitution in which said material is discontinuously supplied into a vessel for a vapor source by a material supply device provided in a vacuum vessel. CONSTITUTION:A vacuum deposition device forms continuously a thin film on a substrate 9 for vapor deposition such as a polyester film or the like traveling along the outside circumference of a vapor deposition roller 10 by an unwinding shaft 7 and a take-up shaft 8 by heating, melting and evaporating an evaporating material 13 housed in a vessel 12 made of refractory bricks by a heating source 16 in a vacuum vessel 1 consisting of upper and lower chambers 2, 3 provided with vacuum evacuating devices 4, 5 and depositing the evaporate atoms 14 through a shutter 11 held open by evaporation on the above-mentioned substrate. The material supply in such vacuum deposition device is accomplished by stopping the heating according to needs and closing the shutter 11 then lifting a contact point 19 by an operating rod 21 inserted from the outside through a flange 20 to tilt a material supply stand 17 supported at a fulcrum 18 and dropping by gravity the evaporating mateial 22 of a round bar shape placed thereon into the above-mentioned vessel 12.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a vacuum evaporation apparatus for forming a thin metal film on a substrate surface. Vacuum evaporation is a device that heats and melts the evaporation material in a sealed container under reduced pressure to evaporate the material and attach material atoms onto a substrate to obtain a thin film. It is used for vapor deposition of aluminum onto polymer films for decoration, packaging, etc., and in recent years, magnetic recording media have been manufactured in which ferromagnetic materials are entirely vapor-deposited on polymer films. These vacuum evaporation devices are relatively large-sized devices. On the other hand, relatively small devices are used for manufacturing semiconductors, lenses, and forming optical filters and antireflection films obtained by vapor-depositing appropriate materials onto glass surfaces.

Structure of the conventional example and its problems A relatively large-sized vacuum deposition machine to which the present invention is applicable does not run a long paper or polymer film continuously from the unwinding shaft to the winding shaft. A thin film is entirely formed on the substrate between the two axes by vacuum evaporation.

The evaporation source used in these evaporation machines is resistance heating.

It is heated and melted and evaporated by a heating source such as induction heating or electron gun heating. There are two types of evaporation sources: one is to charge a certain amount of evaporation material into a container and evaporate only the charged amount, and the other is to continuously supply the material to perform evaporation over a long period of time. Generally Al, Cu, Fe.

Ni, etc. can be processed into a linear shape and supplied continuously, but Go, Ti, Or, etc. are difficult to process into a linear shape and cannot be continuously supplied. As a method for supplying materials such as Go, Ti, Or, etc., a method has been proposed in which the materials are sequentially melted and supplied using a heating source for supplying the materials (in addition to a heating source for evaporating the materials). These methods have problems such as complicated device configuration and unstable evaporation amount of the evaporation source.

Purpose of the Invention The present invention solves the above-mentioned conventional problems.The heating source is for material evaporation.The material supply is based on material supply after stopping vapor deposition, reheating, melting, evaporation, and then vapor deposition. For this reason, a discontinuous material supply device is used during vacuum evaporation to enable long-term evaporation of evaporation materials that are difficult to process into linear shapes, such as Go, Ti, and Or, without breaking the vacuum. According to the present invention, a vacuum evaporation apparatus is provided with a monthly rate U (feeding device is provided) for supplying evaporation material to an evaporation source container without breaking the vacuum chamber, and is suitable for long-time evaporation. Specifically, the means for supplying the material includes a method in which the shape of the barb is made into a round shape or a round bar shape and the base is sloped to allow it to fall naturally, and a means for supplying the material by a mechanical robot arm.

DESCRIPTION OF THE EMBODIMENTS FIG. 1 shows a first embodiment of the present invention, in which a vacuum chamber 1 is separated into an upper chamber 2 and a lower chamber 3 by a partition plate. The upper chamber 2 is heated to 6×10 (Torr
) i, 2 x 10 in the lower chamber 3 by vacuum exhaust device 6
” (Torr). Using a 9cm long polyester film with a thickness of 20m (11m) as a deposition substrate,
The film is rolled onto the outer periphery of the vapor deposition roller 10 from the unwinding shaft 7, and is wound onto the winding shaft 8 in synchronization with the vapor deposition roller 10. The evaporation source system stores the evaporation material 13 in a refractory brick container 12 on a lower base 15 facing the evaporation roller 1o, heats the evaporation material 13 with a heat source 16, melts it, evaporates it, and collects the evaporated atoms 14. is scattered on the surface of the substrate 9 on the outer periphery of the vapor deposition roller 10.

In this example, a thin film was formed by continuous vapor deposition using Al as the vapor deposition material and an electron gun as the heating source while the substrate was traveling at f 100 m/min. Numeral 11 is a cap that prevents the evaporated atoms 14 from reaching the surface of the substrate 9, and is kept open during vapor deposition.

The material supply is evaporation material 22' in the shape of a round rod with a diameter of 50ml and a length of 370mm! f- The material supply frame 1a is placed in a position where the evaporated material 22 does not fall toward the firebricks under normal conditions, and the material supply operation is performed by using the operating rod 21 in the atmosphere as the fulcrum 18 of the material supply frame 17 at the flange 20i. The evaporation material 22 in the shape of a round bar is inserted into the vacuum chamber through the evaporation material 22 by raising the contact 19 part in the direction of arrow A and tilting the material supply stand 17.
The materials are stored in the refractory brick container 12 by natural fall, and the material supply is completely completed. Diameter 508. An A1 rod with a length of 370 mm is approximately 1.9 θk (J, and considering the effectiveness of the material supply device, the minimum supply weight is 1 kq. Furthermore, the diameter is 50 mm.
mm, approximately 6.4k for a Co round bar with a length of 370mm.
becomes g.

Next is the evaporation work when supplying the material.When supplying the material, after turning off the heating source 16, the melted evaporation material 13 is left until it becomes a semi-solid state, and then the evaporation material is evaporated by the method described above. Then, the heating source 16 is again supplied with full power to melt and evaporate it. During this time, the evaporator 11 is closed and the evaporation substrate 9 is stopped.

FIG. 2 shows the second implementation. Vacuum chamber, vacuum exhaust system,
The evaporation source system is the same as in FIG. A mechanical robot arm was used as the material supply device. A work arm 311 is connected to a control box 3o provided in the atmosphere, and a work arm 33 is connected to a vacuum chamber via a vacuum shield 36 via a rotary joint 32. The work arm 33 is composed of a hand 34 that grips the vapor deposition material 22 placed on a base 35. There is. Material supply is by hand 34, vapor deposition 42 material 2
2 Refractory brick 13 according to instructions from the gold grip control box.
Store it in. The processes before and after material supply are the same as in the first embodiment. The shape of the evaporation material in the second embodiment may be any shape other than a sphere or a round bar, such as a hexahedron or a square bar.

Effects of the Invention According to the vacuum evaporation apparatus of the present invention, even evaporation material that is relatively difficult to process into a linear shape can be supplied with a simple device.

(1) Since the deposition material can be supplied without breaking the vacuum of the vacuum chamber, there is no loss due to evacuation time.

(2) Therefore, running costs can be reduced.

(3) The actual operation time of the vacuum evaporation process becomes longer and the length of the object to be evaporated increases in one vacuum evacuation process, so it is highly industrially efficient.

(4) By reducing the number of vacuum breaks, the life of the firebrick is extended and costs are reduced.

There are effects such as

[Brief explanation of the drawing]

Figure 1 is a configuration diagram of the first embodiment of the present invention, and Figure 2 is a diagram of the configuration of the first embodiment of the present invention.
It is a block diagram of an Example. 17-... Material supply frame, 18... Fulcrum,
19... Contact, 2o... Furanone, 21.
...Operation rod, 3Q...Control fil box%31...Working arm, 32...Rotating universal joint%33...Working arm, 34.・・・・・・
hand.

Claims (1)

[Claims] (1) A vacuum evaporation apparatus characterized by being provided with a material supply device that discontinuously supplies an evaporation material into an evaporation source container. @) Evaporation material is Al, Cu, Ti, Go, Ni
, Or, Fe, Mg. The vacuum evaporation apparatus according to claim 1, characterized in that the material is Mn or Si, either singly or as an alloy.