JPH0364463A - Continuous vacuum deposition device - Google Patents
Continuous vacuum deposition deviceInfo
- Publication number
- JPH0364463A JPH0364463A JP19946189A JP19946189A JPH0364463A JP H0364463 A JPH0364463 A JP H0364463A JP 19946189 A JP19946189 A JP 19946189A JP 19946189 A JP19946189 A JP 19946189A JP H0364463 A JPH0364463 A JP H0364463A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- electron gun
- chamber
- vacuum
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001771 vacuum deposition Methods 0.000 title description 3
- 238000007740 vapor deposition Methods 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 11
- 230000006837 decompression Effects 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000007738 vacuum evaporation Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001361 White metal Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は2例えばポリエステル等のプラスチックフィル
ムや各種の非金属材料または金属材料に。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention is applicable to plastic films such as polyester, and various non-metallic materials or metallic materials.
第5図は、プラスチックフィルムにアルミニウムを蒸着
する従来の真空蒸着装置の一例を示す。FIG. 5 shows an example of a conventional vacuum deposition apparatus for depositing aluminum onto a plastic film.
隔板りで仕切られた上室fと下室(蒸着室)gとからた
る真空室aの中で、コイル状に巻いたフィルムbを繰出
機Cから繰出しながら、下室g内のるつぼjから蒸発す
るアルミニウム蒸気を冷却ロール(蒸着ロール)1部で
蒸着し1巻取機eで巻取る。1コイルの蒸着が完了する
と、真空室aを大気に開放し、コイル状に巻かれた新し
いフィルムbを装着し替えた後、再度ポンプd、にで真
空に排気して蒸着する作業を行なう。るつぼa内のアは
、るつぼjの破損防止のため、その都度排出し。In a vacuum chamber a consisting of an upper chamber f and a lower chamber (deposition chamber) g separated by a partition, a film b wound into a coil is fed out from a feeding machine C, while a crucible j in a lower chamber g is fed out. The aluminum vapor evaporated from the aluminum is deposited on one part of the cooling roll (deposition roll) and wound up on one winder e. When the deposition of one coil is completed, the vacuum chamber a is opened to the atmosphere, a new film b wound into a coil is replaced, and then the vacuum is evacuated again using the pump d and the deposition operation is performed. A in crucible A is discharged each time to prevent damage to crucible J.
るつぼj内の手入れを行った後、新しいアルミニウムを
装填する。このように、第5図の真空蒸着装置による蒸
着作業は、フィルムの装着、るつぼの手入れ、新しい蒸
着材の装填、真空引き、加熱。After cleaning the inside of crucible j, load new aluminum. In this way, the vapor deposition work performed by the vacuum vapor deposition apparatus shown in FIG. 5 includes mounting a film, cleaning the crucible, loading a new vapor deposition material, evacuation, and heating.
走行、蒸着、大気開放を繰返すAツチ作業となるので、
極めて非能率的で生産性が悪かった。Since it is a repetitive process of traveling, vapor deposition, and opening to the atmosphere,
It was extremely inefficient and had poor productivity.
そこで生産性を向上させるため、シールロールと隔壁と
によって複数段に仕切られた減圧室を設け、それら減圧
室をそれぞれ排気して、大気圧から真空まで段階的に低
く々る圧力を作シ出し、そこにフィルム等、可撓性の基
板を通すことにより。Therefore, in order to improve productivity, we created a vacuum chamber divided into multiple stages by seal rolls and partition walls, and evacuated each vacuum chamber to create a pressure that gradually decreases from atmospheric pressure to vacuum. , by passing a flexible substrate such as a film through it.
大気中から真空中へ、そして再び大気中へと、基板を連
続的に走行させて真空蒸着を施すことが提案されている
。It has been proposed to carry out vacuum deposition by continuously moving the substrate from the atmosphere to the vacuum and back to the atmosphere.
すなわち、第6図に示されるように、コイル状に巻かれ
たプラスチックフィルム1が大気中に置かれた払い出し
装置(図示せず)から払い出され。That is, as shown in FIG. 6, the plastic film 1 wound into a coil is dispensed from a dispensing device (not shown) placed in the atmosphere.
シールロールS1.82の間を通シ、シールロールS□
、S2.S3と隔壁W□、W2とによって囲まれた減圧
室2aに入る。減圧室はほぼ同様な構造のものが複数段
(6〜7段)直列に配置されておシップラスチックフィ
ルム1はそれらを順次通って、最後の減圧室2bから真
空室(蒸着室)3に入る。上記減圧室2a、・・・、2
bおよび真空室3は、真空排気装置4によりそれぞれ排
気され、大気圧から真空まで順次段階的に圧力が低くな
っている。プラスチックフィルム1は真空室3内で冷却
ロール(蒸着ロール)5に巻付き、電子銃8の電子ビー
ム9によりるつぼ6内で加熱され゛蒸発した蒸着材(ア
ルミニウム)7の蒸気が蒸着された後、シールロールS
2.S3の間を通シ、減圧室2b・・・2aを経て、減
圧室2a上部のシールロールS2.S3の間から、大気
中に搬出され2巻取装置(図示せず)によって巻取られ
る。Pass between seal roll S1.82, seal roll S□
, S2. It enters the decompression chamber 2a surrounded by S3 and partition walls W□ and W2. The decompression chamber has a plurality of stages (6 to 7 stages) of almost the same structure arranged in series, and the plastic film 1 passes through them one after another and enters the vacuum chamber (evaporation chamber) 3 from the last decompression chamber 2b. . The above-mentioned decompression chambers 2a,..., 2
b and the vacuum chamber 3 are each evacuated by an evacuation device 4, and the pressure is gradually lowered from atmospheric pressure to vacuum. The plastic film 1 is wound around a cooling roll (evaporation roll) 5 in a vacuum chamber 3, heated in a crucible 6 by an electron beam 9 of an electron gun 8, and the vapor of the evaporated deposition material (aluminum) 7 is deposited thereon. , seal roll S
2. S3, passes through the vacuum chambers 2b...2a, and passes through the seal roll S2...2a above the vacuum chamber 2a. From between S3, it is carried out into the atmosphere and wound up by a two-winding device (not shown).
つ 七やすく、異状放電がしばしば発生し部品が損傷する。Two Abnormal electrical discharges often occur and parts are damaged.
そうすると、電子銃を交換または修理するために、シー
ル装置を大気開放して電子銃を取出す必要がある。Then, in order to replace or repair the electron gun, it is necessary to open the sealing device to the atmosphere and take out the electron gun.
真空排気を停止して大気開放する場合、るつぼ内の金属
の温度は400℃ないし1800℃であるので。When stopping evacuation and opening the crucible to the atmosphere, the temperature of the metal inside the crucible is between 400°C and 1800°C.
そのまま大気に開放すると酸化して金属寿命が短くなる
。そのため、真空排気しながら金属を徐々に冷却し温度
を下げる必要があり9時間がかかる。If exposed to the atmosphere, it will oxidize and shorten the life of the metal. Therefore, it is necessary to gradually cool down the metal while evacuation to lower the temperature, which takes 9 hours.
また、大気開放により装置内壁の金属表面等に吸着され
た水分等が、メンテナンス終了後の真空排気時に放出さ
れて、いわゆるアウトガスの原因となるので、排気効率
が悪く、ここでも時間を要す真空室内を大気開放するこ
となく電子銃部分のみを大気開放できる装置を提供する
ことを目的とする。In addition, moisture adsorbed on the metal surface of the inner wall of the device due to opening to the atmosphere is released during vacuum evacuation after maintenance, causing so-called outgassing. It is an object of the present invention to provide a device capable of opening only an electron gun portion to the atmosphere without opening the room to the atmosphere.
本発明は、前記従来の課題を解決するために。 The present invention aims to solve the above-mentioned conventional problems.
可撓性の基板を大気中から減圧室を経て真空室内へ連続
的に導入し、上記真空室内において上記基板を冷却ロー
ルに巻付け、電子銃によυるつぼ内で加熱され蒸発した
蒸着材を上記基板に蒸着させた後、上記基板を減圧室を
経て大気中へ連続的に搬出するようにしたものにおいて
、上記電子銃の設置位置近傍の上記真空室壁に設けられ
た開口部により同真空室と連通ずる第2の真空室と、上
記開口部を密閉できかつ開閉自在なシール装置と。A flexible substrate is continuously introduced from the atmosphere into a vacuum chamber via a decompression chamber, and in the vacuum chamber, the substrate is wrapped around a cooling roll, and the evaporation material heated and evaporated in the crucible by an electron gun is heated in the crucible. After the substrate is evaporated, the substrate is continuously transported into the atmosphere through a vacuum chamber, and the vacuum is a second vacuum chamber that communicates with the chamber; and a sealing device that can seal the opening and can be opened and closed.
蒸着装置を提案するものである。This paper proposes a vapor deposition device.
電子銃を取出す必要が生じた時は、電子銃移動装置によ
って電子銃を第2の真空室へ移動させ。When it becomes necessary to take out the electron gun, the electron gun is moved to the second vacuum chamber by the electron gun moving device.
第1の真空室(蒸着室)と第2の真空室との間の開口部
をシール装置により密閉する。その後第2の真空室を大
気圧にし、電子銃を取外して必要な作業を行なう。作業
が終了したら、を子銃を第2の真空室内に組込み、第2
の真空室内を第1の真空室内と同圧力まで真空排気した
後9両真空室の間の開口部を開いて、電子銃を第1の真
空室内の定位置へ移動させる。The opening between the first vacuum chamber (evaporation chamber) and the second vacuum chamber is sealed by a sealing device. Thereafter, the second vacuum chamber is brought to atmospheric pressure, the electron gun is removed, and necessary operations are performed. When the work is completed, install the secondary gun into the second vacuum chamber, and
After the vacuum chamber is evacuated to the same pressure as the first vacuum chamber, the opening between the nine vacuum chambers is opened and the electron gun is moved to a fixed position within the first vacuum chamber.
第1図は本発明の一実施例を示す縦断正面図。 FIG. 1 is a longitudinal sectional front view showing one embodiment of the present invention.
第2図は同じく電子銃が第2の真空室内へ移動した状態
を示す要部縦断正面図、第3図は第2図の■−■縦断平
面図、第4図は第3図の■−■横断側面図である。これ
らの図において、前記第6図により説明した従来のもの
と同様の部分については、同一の符号を付は詳しい説明
を省く。Fig. 2 is a longitudinal sectional front view of the main part showing the electron gun moved into the second vacuum chamber, Fig. 3 is a vertical sectional plan view taken from ■-■ in Fig. 2, and Fig. 4 is a longitudinal sectional plan view taken from Fig. 3 - ■It is a cross-sectional side view. In these figures, the same parts as those of the conventional device explained with reference to FIG. 6 are designated by the same reference numerals, and detailed explanation thereof will be omitted.
11は第2の真空室(副真空室)であって、電子銃8近
傍の(第1の)真空室(蒸着室)3の壁に設けられた開
口部12によって、その(第1の)真空室3と連通して
いる。13は上記開口部12に設けられた開閉自在のゲ
ートバルブであって、その開口部12を密閉シールして
真空室3と副真空室11とを遮断することができる。1
4は副真空室11専用の真空排気ポンプであって、副真
空室11に配管で接続されている。Reference numeral 11 denotes a second vacuum chamber (sub-vacuum chamber), and the (first) It communicates with vacuum chamber 3. Reference numeral 13 denotes a gate valve provided in the opening 12 that can be opened and closed, and can seal the opening 12 to shut off the vacuum chamber 3 and the sub-vacuum chamber 11. 1
Reference numeral 4 denotes a vacuum evacuation pump exclusively for the sub-vacuum chamber 11, which is connected to the sub-vacuum chamber 11 via piping.
15は電子銃取付架台であって、電子銃8を搭載し、下
面は山形レール]6に沿って摺動できるよう山形状(メ
ス形)ベットになっている。この山形レール16は真空
室3内から副真空室11内まで延びているが、ゲートバ
ルブ13との交差部17は部分的に切れている。18は
駆動用ガスシリンダであって。Reference numeral 15 denotes an electron gun mounting stand, on which the electron gun 8 is mounted, and the lower surface thereof has a chevron-shaped (female-shaped) bed so that it can slide along the chevron-shaped rail 6. This chevron-shaped rail 16 extends from the inside of the vacuum chamber 3 to the inside of the sub-vacuum chamber 11, but the intersection 17 with the gate valve 13 is partially cut off. 18 is a driving gas cylinder.
副真空室11の端部に設けられておシ、その軸部19の
先端が電子銃取付架台15の後面に固着されている。It is provided at the end of the sub-vacuum chamber 11, and the tip of its shaft portion 19 is fixed to the rear surface of the electron gun mounting frame 15.
21は電子銃8に接続された高圧の電源ケーブルであっ
て、バネ帯板な上に取付けられた絶縁碍子によって支持
されており、電子銃移動時にはノZネ帯板皐に沿って曲
がる(伸縮する)ようになっている。Reference numeral 21 denotes a high-voltage power cable connected to the electron gun 8, which is supported by an insulator attached to a spring strip, and when the electron gun is moved, it bends (expands and contracts) along the wire strip. ).
なおろはリーク弁、26はヒンジ付きの角7ランジであ
る。Naoro is a leak valve, and 26 is a hinged corner 7 flange.
このような装置において、電子銃8を取替えまたは修理
する必要が生じた時は、まず駆動用ガスシリンダ18を
駆動して電子銃取付架台15を山形レール16に沿って
副真空室11内へ移動させる。次にゲートバルブ13に
より開ロ部12を密閉した後。In such a device, when it is necessary to replace or repair the electron gun 8, first drive the driving gas cylinder 18 to move the electron gun mounting frame 15 along the chevron rail 16 into the sub-vacuum chamber 11. let Next, after the opening portion 12 is sealed by the gate valve 13.
IJ、=り弁るを開いて、副真空室11内を大気圧にす
る。それから角7ランジ届を開放して電子銃8を取出す
。Open the IJ valve to bring the inside of the sub-vacuum chamber 11 to atmospheric pressure. Then open the corner 7 lunge and take out the electron gun 8.
運転を再開する時は上記と逆の順序で、電子銃8を副真
空室11内の電子銃取付架台15に取付け。When restarting operation, attach the electron gun 8 to the electron gun mounting frame 15 in the sub-vacuum chamber 11 in the reverse order as described above.
リーク弁ろおよび角フランジ部を閉じて、真空排気ポン
プ14により副真空室11内を蒸着室3内と同圧力まで
減圧した後、ゲートバルブ13を開いて。After closing the leak valve and the square flange and reducing the pressure inside the sub-vacuum chamber 11 to the same pressure as the inside of the deposition chamber 3 using the evacuation pump 14, the gate valve 13 is opened.
電子銃取付架台15を蒸着室3内の所定の位置まで移動
させる。The electron gun mounting stand 15 is moved to a predetermined position within the deposition chamber 3.
本発明によれば、電子銃のメンテナンスに際して装置全
体を大気圧にする必要が々いから、大気開放後の装置の
真空排気時間が短縮できる。また。According to the present invention, since it is not necessary to bring the entire device to atmospheric pressure during maintenance of the electron gun, the evacuation time of the device after opening to the atmosphere can be shortened. Also.
るつぼ白金属の酸化(劣化)を防止するための徐冷時間
が不要になる。したがって、運転中断時間が大幅に短縮
され生産性が向上する。There is no need for slow cooling time to prevent oxidation (deterioration) of the white metal in the crucible. Therefore, operation interruption time is significantly shortened and productivity is improved.
第1図は本発明の一実施例を示す縦断正面図。
第2図は同じく電子銃が第2の真空室内へ移動した状態
を示す要部縦断正面図、第3図は第2図の■−■縦断平
面図、第4図は第3図の■−■横断側面図である。第5
図および第6図は、いずれも従来の真空蒸着装置を例示
する図である。
a・・・真空室b・・・フィルム
C・・・繰出機 d・・・ポンプe・・・巻
取機 f・・・上室g・・・下室(蒸着室)
h・・・隔板土・・・冷却ロール(蒸着ロール)
3・・・るつぼk・・・ポンプS1.S2.S3・・・
シールロールW□、W2.W3・・・隔壁 1・
・・プラスチックフィルム2a 、 2b・・・減圧室
3・・・真空室(蒸着室)4・・・真空排気装
置 5・・・冷却ロール(蒸着ロール)6・・・
るつぼ 7・・・蒸着材(アルミニウム
)8・・・電子銃 9・・・電子ビーム11
・・・第2の真空室(副真空室)12・・・開口部13
・・・ゲートバルブ 14・・・真空排気ポンプ1
5・・・電子銃取付架台 16・・・山形レール18
・・・駆動用ガスシリンダ 2]・・・電源ケーブルな
・・・/ζネ帯板 る・・・リーク弁部・・・
角フランジFIG. 1 is a longitudinal sectional front view showing one embodiment of the present invention. Fig. 2 is a longitudinal sectional front view of the main part showing the electron gun moved into the second vacuum chamber, Fig. 3 is a vertical sectional plan view taken from ■-■ in Fig. 2, and Fig. 4 is a longitudinal sectional plan view taken from Fig. 3 - ■It is a cross-sectional side view. Fifth
Both FIG. 6 and FIG. 6 are diagrams illustrating a conventional vacuum evaporation apparatus. a... Vacuum chamber b... Film C... Feeding machine d... Pump e... Winding machine f... Upper chamber g... Lower chamber (deposition chamber)
h...Partition board soil...Cooling roll (evaporation roll)
3... Crucible k... Pump S1. S2. S3...
Seal roll W□, W2. W3...Bulkhead 1.
...Plastic films 2a, 2b...Decompression chamber 3...Vacuum chamber (evaporation chamber) 4...Evacuation device 5...Cooling roll (deposition roll) 6...
Crucible 7... Vapor deposition material (aluminum) 8... Electron gun 9... Electron beam 11
...Second vacuum chamber (sub-vacuum chamber) 12...Opening 13
...Gate valve 14...Vacuum pump 1
5... Electron gun mounting stand 16... Chevron rail 18
...Drive gas cylinder 2]...Power cable.../ζ strip plate Ru...Leak valve part...
square flange
Claims (1)
続的に導入し,上記真空室内において上記基板を冷却ロ
ールに巻付け,電子銃によりるつぼ内で加熱され蒸発し
た蒸着材を上記基板に蒸着させた後,上記基板を減圧室
を経て大気中へ連続的に搬出するようにしたものにおい
て,上記電子銃の設置位置近傍の上記真空室壁に設けら
れた開口部により同真空室と連通する第2の真空室と,
上記開口部を密閉できかつ開閉自在なシール装置と,上
記電子銃を上記第2の真空室に移動させる電子銃移動装
置とを備えたことを特徴とする連続真空蒸着装置。A flexible substrate is continuously introduced from the atmosphere into a vacuum chamber via a decompression chamber, and in the vacuum chamber, the substrate is wrapped around a cooling roll, and the evaporation material heated and evaporated in the crucible by an electron gun is transferred to the substrate. After vapor deposition, the substrate is continuously transported into the atmosphere through a reduced pressure chamber, and an opening provided in the wall of the vacuum chamber near the installation position of the electron gun connects the substrate to the vacuum chamber. a second vacuum chamber in communication;
A continuous vacuum evaporation apparatus comprising: a sealing device that can seal the opening and can be opened and closed; and an electron gun moving device that moves the electron gun to the second vacuum chamber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19946189A JPH0364463A (en) | 1989-08-02 | 1989-08-02 | Continuous vacuum deposition device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19946189A JPH0364463A (en) | 1989-08-02 | 1989-08-02 | Continuous vacuum deposition device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0364463A true JPH0364463A (en) | 1991-03-19 |
Family
ID=16408188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19946189A Pending JPH0364463A (en) | 1989-08-02 | 1989-08-02 | Continuous vacuum deposition device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0364463A (en) |
-
1989
- 1989-08-02 JP JP19946189A patent/JPH0364463A/en active Pending
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