JPS60164330A - 半導体薄膜の分解装置 - Google Patents
半導体薄膜の分解装置Info
- Publication number
- JPS60164330A JPS60164330A JP1846484A JP1846484A JPS60164330A JP S60164330 A JPS60164330 A JP S60164330A JP 1846484 A JP1846484 A JP 1846484A JP 1846484 A JP1846484 A JP 1846484A JP S60164330 A JPS60164330 A JP S60164330A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- decomposition
- semiconductor thin
- thin film
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000354 decomposition reaction Methods 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 239000010409 thin film Substances 0.000 title claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 53
- 239000002826 coolant Substances 0.000 claims description 4
- 241000257465 Echinoidea Species 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000001704 evaporation Methods 0.000 abstract description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000110 cooling liquid Substances 0.000 abstract description 8
- 239000012535 impurity Substances 0.000 abstract description 7
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 230000008020 evaporation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 8
- 239000010408 film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000218691 Cupressaceae Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010896 thin film analysis Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1846484A JPS60164330A (ja) | 1984-02-06 | 1984-02-06 | 半導体薄膜の分解装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1846484A JPS60164330A (ja) | 1984-02-06 | 1984-02-06 | 半導体薄膜の分解装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60164330A true JPS60164330A (ja) | 1985-08-27 |
JPH0566727B2 JPH0566727B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-22 |
Family
ID=11972354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1846484A Granted JPS60164330A (ja) | 1984-02-06 | 1984-02-06 | 半導体薄膜の分解装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60164330A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5395482A (en) * | 1992-11-13 | 1995-03-07 | Fuji Photo Film Co., Ltd. | Ultra high purity vapor phase treatment |
JP2006059925A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
-
1984
- 1984-02-06 JP JP1846484A patent/JPS60164330A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5395482A (en) * | 1992-11-13 | 1995-03-07 | Fuji Photo Film Co., Ltd. | Ultra high purity vapor phase treatment |
JP2006059925A (ja) * | 2004-08-18 | 2006-03-02 | Komatsu Electronic Metals Co Ltd | 処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0566727B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |