JPH0566727B2 - - Google Patents
Info
- Publication number
- JPH0566727B2 JPH0566727B2 JP1846484A JP1846484A JPH0566727B2 JP H0566727 B2 JPH0566727 B2 JP H0566727B2 JP 1846484 A JP1846484 A JP 1846484A JP 1846484 A JP1846484 A JP 1846484A JP H0566727 B2 JPH0566727 B2 JP H0566727B2
- Authority
- JP
- Japan
- Prior art keywords
- decomposition
- semiconductor thin
- thin film
- liquid
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 43
- 238000000354 decomposition reaction Methods 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000010409 thin film Substances 0.000 claims description 27
- 239000002826 coolant Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 16
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 238000001704 evaporation Methods 0.000 description 7
- 239000000110 cooling liquid Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000005192 partition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010896 thin film analysis Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1846484A JPS60164330A (ja) | 1984-02-06 | 1984-02-06 | 半導体薄膜の分解装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1846484A JPS60164330A (ja) | 1984-02-06 | 1984-02-06 | 半導体薄膜の分解装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60164330A JPS60164330A (ja) | 1985-08-27 |
JPH0566727B2 true JPH0566727B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-22 |
Family
ID=11972354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1846484A Granted JPS60164330A (ja) | 1984-02-06 | 1984-02-06 | 半導体薄膜の分解装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60164330A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5395482A (en) * | 1992-11-13 | 1995-03-07 | Fuji Photo Film Co., Ltd. | Ultra high purity vapor phase treatment |
JP4769439B2 (ja) * | 2004-08-18 | 2011-09-07 | Sumco Techxiv株式会社 | 処理装置 |
-
1984
- 1984-02-06 JP JP1846484A patent/JPS60164330A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60164330A (ja) | 1985-08-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |