JPH0330981B2 - - Google Patents
Info
- Publication number
- JPH0330981B2 JPH0330981B2 JP21810184A JP21810184A JPH0330981B2 JP H0330981 B2 JPH0330981 B2 JP H0330981B2 JP 21810184 A JP21810184 A JP 21810184A JP 21810184 A JP21810184 A JP 21810184A JP H0330981 B2 JPH0330981 B2 JP H0330981B2
- Authority
- JP
- Japan
- Prior art keywords
- decomposition
- semiconductor thin
- hydrofluoric acid
- thin film
- decomposition liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 54
- 238000000354 decomposition reaction Methods 0.000 claims description 44
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000010409 thin film Substances 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 16
- 238000001704 evaporation Methods 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sampling And Sample Adjustment (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21810184A JPS6196736A (ja) | 1984-10-17 | 1984-10-17 | 半導体薄膜の分解装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21810184A JPS6196736A (ja) | 1984-10-17 | 1984-10-17 | 半導体薄膜の分解装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6196736A JPS6196736A (ja) | 1986-05-15 |
JPH0330981B2 true JPH0330981B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-05-01 |
Family
ID=16714646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21810184A Granted JPS6196736A (ja) | 1984-10-17 | 1984-10-17 | 半導体薄膜の分解装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6196736A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2909086B2 (ja) * | 1989-01-20 | 1999-06-23 | 株式会社東芝 | 半導体基板表面の不純物回収方法及び装置 |
JP4516379B2 (ja) * | 2004-08-18 | 2010-08-04 | Sumco Techxiv株式会社 | 処理装置 |
JP4769439B2 (ja) * | 2004-08-18 | 2011-09-07 | Sumco Techxiv株式会社 | 処理装置 |
JP4769440B2 (ja) * | 2004-08-18 | 2011-09-07 | Sumco Techxiv株式会社 | 処理装置 |
-
1984
- 1984-10-17 JP JP21810184A patent/JPS6196736A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6196736A (ja) | 1986-05-15 |
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