JPS60160192A - 混成集積回路基板の製造方法 - Google Patents

混成集積回路基板の製造方法

Info

Publication number
JPS60160192A
JPS60160192A JP19038083A JP19038083A JPS60160192A JP S60160192 A JPS60160192 A JP S60160192A JP 19038083 A JP19038083 A JP 19038083A JP 19038083 A JP19038083 A JP 19038083A JP S60160192 A JPS60160192 A JP S60160192A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
ceramic substrate
circuit board
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19038083A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221669B2 (enrdf_load_stackoverflow
Inventor
関本　秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Powdered Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Powdered Metals Co Ltd filed Critical Hitachi Powdered Metals Co Ltd
Priority to JP19038083A priority Critical patent/JPS60160192A/ja
Publication of JPS60160192A publication Critical patent/JPS60160192A/ja
Publication of JPH0221669B2 publication Critical patent/JPH0221669B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP19038083A 1983-10-12 1983-10-12 混成集積回路基板の製造方法 Granted JPS60160192A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19038083A JPS60160192A (ja) 1983-10-12 1983-10-12 混成集積回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19038083A JPS60160192A (ja) 1983-10-12 1983-10-12 混成集積回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS60160192A true JPS60160192A (ja) 1985-08-21
JPH0221669B2 JPH0221669B2 (enrdf_load_stackoverflow) 1990-05-15

Family

ID=16257205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19038083A Granted JPS60160192A (ja) 1983-10-12 1983-10-12 混成集積回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS60160192A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282427A (ja) * 1986-05-30 1987-12-08 松下電器産業株式会社 積層型セラミツクスの製造方法
WO2004110925A1 (ja) * 2003-06-10 2004-12-23 Asahi Glass Company, Limited 金属水素化物微粒子、その製造方法、金属水素化物微粒子を含有する分散液及び金属質材料

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282427A (ja) * 1986-05-30 1987-12-08 松下電器産業株式会社 積層型セラミツクスの製造方法
WO2004110925A1 (ja) * 2003-06-10 2004-12-23 Asahi Glass Company, Limited 金属水素化物微粒子、その製造方法、金属水素化物微粒子を含有する分散液及び金属質材料
CN100344528C (zh) * 2003-06-10 2007-10-24 旭硝子株式会社 金属氢化物微粒及其制造方法、含有金属氢化物微粒的分散液和金属质材料
US7550513B2 (en) 2003-06-10 2009-06-23 Asahi Glass Company, Limted Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material
JP4747839B2 (ja) * 2003-06-10 2011-08-17 旭硝子株式会社 金属水素化物微粒子を含有する分散液及びその製造方法、並びに金属質材料

Also Published As

Publication number Publication date
JPH0221669B2 (enrdf_load_stackoverflow) 1990-05-15

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