JPS60150637A - Ｉｃ素子の認識方法及びその装置 - Google Patents

Ｉｃ素子の認識方法及びその装置

Info

Publication number
JPS60150637A
JPS60150637A JP59005772A JP577284A JPS60150637A JP S60150637 A JPS60150637 A JP S60150637A JP 59005772 A JP59005772 A JP 59005772A JP 577284 A JP577284 A JP 577284A JP S60150637 A JPS60150637 A JP S60150637A
Authority
JP
Japan
Prior art keywords
camera
deviation angle
recognition
approximate
relative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59005772A
Other languages
English (en)
Japanese (ja)
Other versions
JPH021369B2 (enExample
Inventor
Hideaki Miyoshi
秀明 三好
Seiji Hayashi
誠治 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Marine Instr Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP59005772A priority Critical patent/JPS60150637A/ja
Publication of JPS60150637A publication Critical patent/JPS60150637A/ja
Publication of JPH021369B2 publication Critical patent/JPH021369B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59005772A 1984-01-18 1984-01-18 Ｉｃ素子の認識方法及びその装置 Granted JPS60150637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59005772A JPS60150637A (ja) 1984-01-18 1984-01-18 Ｉｃ素子の認識方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59005772A JPS60150637A (ja) 1984-01-18 1984-01-18 Ｉｃ素子の認識方法及びその装置

Publications (2)

Publication Number Publication Date
JPS60150637A true JPS60150637A (ja) 1985-08-08
JPH021369B2 JPH021369B2 (enExample) 1990-01-11

Family

ID=11620411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59005772A Granted JPS60150637A (ja) 1984-01-18 1984-01-18 Ｉｃ素子の認識方法及びその装置

Country Status (1)

Country Link
JP (1) JPS60150637A (enExample)

Also Published As

Publication number Publication date
JPH021369B2 (enExample) 1990-01-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees