JPS60145266A - 自動半田付け装置 - Google Patents

自動半田付け装置

Info

Publication number
JPS60145266A
JPS60145266A JP24902983A JP24902983A JPS60145266A JP S60145266 A JPS60145266 A JP S60145266A JP 24902983 A JP24902983 A JP 24902983A JP 24902983 A JP24902983 A JP 24902983A JP S60145266 A JPS60145266 A JP S60145266A
Authority
JP
Japan
Prior art keywords
molten solder
opening
printed circuit
circuit board
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24902983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216739B2 (enExample
Inventor
Hachiji Yokota
八治 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP24902983A priority Critical patent/JPS60145266A/ja
Publication of JPS60145266A publication Critical patent/JPS60145266A/ja
Publication of JPS6216739B2 publication Critical patent/JPS6216739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP24902983A 1983-12-30 1983-12-30 自動半田付け装置 Granted JPS60145266A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24902983A JPS60145266A (ja) 1983-12-30 1983-12-30 自動半田付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24902983A JPS60145266A (ja) 1983-12-30 1983-12-30 自動半田付け装置

Publications (2)

Publication Number Publication Date
JPS60145266A true JPS60145266A (ja) 1985-07-31
JPS6216739B2 JPS6216739B2 (enExample) 1987-04-14

Family

ID=17186942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24902983A Granted JPS60145266A (ja) 1983-12-30 1983-12-30 自動半田付け装置

Country Status (1)

Country Link
JP (1) JPS60145266A (enExample)

Also Published As

Publication number Publication date
JPS6216739B2 (enExample) 1987-04-14

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