JPS60143417A - Magnetic head device - Google Patents
Magnetic head deviceInfo
- Publication number
- JPS60143417A JPS60143417A JP24780683A JP24780683A JPS60143417A JP S60143417 A JPS60143417 A JP S60143417A JP 24780683 A JP24780683 A JP 24780683A JP 24780683 A JP24780683 A JP 24780683A JP S60143417 A JPS60143417 A JP S60143417A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic head
- magnetic
- board
- head device
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/17—Construction or disposition of windings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は多チャンネル磁気ヘッドを備える磁気ヘッド装
置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a magnetic head device including a multi-channel magnetic head.
背景技術とその問題点
先ず、第１図及び第２図を参照して、従来の磁気効果薄
膜（以下ＭＲ薄膜という）を用いた磁気ヘッド（ＭＲヘ
ッド）の−例について説明する。BACKGROUND ART AND PROBLEMS First, an example of a magnetic head (MR head) using a conventional magnetic effect thin film (hereinafter referred to as MR thin film) will be described with reference to FIGS. 1 and 2.
このＭＲヘッドは、例えば第１図にその要部の拡大断面
図を示し、第２図にその拡大路線的平面図を示すように
、２例えばＮｉ−Ｚｎ系フェライトよｐなる高抵抗の磁
性基体（１）の表面に凹溝（１ａ）が形成され、その凹
溝（１ａ）内にガラス等の絶縁性の非磁性充填部材（２
）が充填される。磁性基体（１）及び充填部材（２）の
各表面は同一面とされる◎そして、充填部材（２）の表
面及び磁性基体（１）の表面に跨がる如く、例えばＮｉ
−Ｆｅ系合金、或いはＮｉ−Ｃｏ・、系合金等よシなる
ＭＲ薄膜（４）が被着形成され、このＭＲ薄膜（４）の
両端から導出される金等の非磁性のリード導電層（１ρ
、（２）が磁性基体（１）の表面上に被着形成される。This MR head is made of a high-resistance magnetic substrate such as Ni--Zn ferrite, as shown in FIG. A groove (1a) is formed on the surface of the groove (1), and an insulating non-magnetic filling member (2) made of glass or the like is formed in the groove (1a).
) is filled. The surfaces of the magnetic substrate (1) and the filling member (2) are the same surface ◎And, for example, Ni
An MR thin film (4) made of a -Fe alloy, a Ni-Co alloy, etc. is deposited, and a non-magnetic lead conductive layer (such as gold) led out from both ends of this MR thin film (4). 1ρ
, (2) are deposited on the surface of the magnetic substrate (1).
そして、このＭＲ薄膜（４）の一端部の上に、磁性基体
（１）、リード導電層（１１） 、（２）及びＭＲ薄膜
（４）の各表面を覆う絶縁層（５）を介してＮｉ−Ｆｅ
系合金等の磁性層よシなる磁気ヨーク（６）が、ＭＲ薄
膜（４）上を横切る方向に形成される。そして、磁気ヨ
ーク（６）の内端部が絶縁層（５）を介してＭＲ薄膜（
４）の一端と磁気的に連結される。磁気ヨーク（６）の
外端部は、非磁性層、即ち絶縁層（５）を介して磁性基
体（１）と対向し、この磁気ヨーク（６）と磁性基体（
１）との間に磁気ギャップｇが形成されるようになされ
る。そして、ＭＲ薄膜（４）、磁気ヨーク（６）を覆っ
て非磁性絶縁性保護層（８）が被覆され、これの上に接
着剤層（９）によって保護基体ａりが接着される。Then, on one end of this MR thin film (4), an insulating layer (5) covering each surface of the magnetic base (1), lead conductive layers (11), (2), and MR thin film (4) is provided. Ni-Fe
A magnetic yoke (6) made of a magnetic layer such as a magnetic alloy is formed in a direction across the MR thin film (4). Then, the inner end of the magnetic yoke (6) is connected to the MR thin film (
4) is magnetically connected to one end of the The outer end of the magnetic yoke (6) faces the magnetic substrate (1) via a non-magnetic layer, that is, an insulating layer (5), and the magnetic yoke (6) and the magnetic substrate (
1) so that a magnetic gap g is formed between the two. Then, the MR thin film (4) and the magnetic yoke (6) are covered with a non-magnetic insulating protective layer (8), and a protective substrate a is adhered thereon by an adhesive layer (9).
そして、両基体（１）及びαＯと磁気ヨーク（６）の前
端側が切削研磨されて磁気媒体との対接面α■が形成さ
れる。かくして、磁性基体（１）−磁気ギャップピー磁
気ヨーク（６） −Ｍ Ｒ薄膜（４）−磁性基体（１）
によって閉磁路が形成される。Then, the front end sides of both base bodies (1), αO, and the magnetic yoke (6) are cut and polished to form a contact surface α■ with the magnetic medium. Thus, magnetic substrate (1) - magnetic gap magnetic yoke (6) - M R thin film (4) - magnetic substrate (1)
A closed magnetic path is formed by this.
しかして、ＭＲ薄膜（４）に電流■を流すことによって
、その各磁気ギャップｇに対接ないしは対向する磁気記
録媒体よりの、これに記録された記録磁化による信号磁
界がＭＲ薄膜（４）に与えられ、これによる抵抗変化に
基ずく電気的信号、即ち再生出力信号がＭＲ薄膜（４）
の両端に得られ、リード導電層α復、（６）を通じて出
力される。By passing a current (2) through the MR thin film (4), a signal magnetic field due to the recorded magnetization from the magnetic recording medium facing or facing each magnetic gap g is applied to the MR thin film (4). The electrical signal based on the resulting resistance change, that is, the reproduction output signal, is transmitted to the MR thin film (4).
and is output through the lead conductive layer α (6).
そして、かかる磁気ヘッドが、磁性基体（１）、その凹
溝（ｌａ） 、非磁性充填部材（２）を共通として、多
数形成されることによＪ、ＰＣＭ信号再生用のマルチチ
ャンネルヘッドが構成される。尚、凹溝（１ａ）の底部
に銅等のバイアス導体を設けることができる。A multi-channel head for reproducing PCM signals is constructed by forming a large number of such magnetic heads with the magnetic substrate (1), its groove (la), and non-magnetic filling member (2) in common. be done. Note that a bias conductor made of copper or the like may be provided at the bottom of the groove (1a).
かかる磁気ヘッドは磁性基体（１）の表面に於いて、Ｍ
Ｒ薄膜（４）と対向する部分に凹溝（１ａ）が形成され
ているため、ＭＲ薄膜（４）の中央付近から磁性基体（
１）へ漏洩する磁束が軽減されるので、磁気的効率が高
いという利点がある。Such a magnetic head has M on the surface of the magnetic substrate (1).
Since the groove (1a) is formed in the part facing the R thin film (4), the magnetic substrate (
Since the magnetic flux leaking to 1) is reduced, there is an advantage that magnetic efficiency is high.
上述の多チャンネルのＭＲヘッドの各ＭＲ薄膜（４）か
ら信号を取出すには氾３図のような回路構成を採る。即
ち、ｎ個のＭＲ薄膜（４）を等測的にｎ個の可変抵抗器
ＲＭ、〜ＲＭｎで示し、これらに夫夫直列接続される定
電流用抵抗器をＲ１−Ｒｎで示す。可変抵抗器ＲＭ１〜
ＲＭｎの固定抵抗値は１０００程度で、外部磁界による
抵抗変化は約１チ程度である。これに対し、定電流用抵
抗器Ｒ１〜Ｒｎは２００〜３０００程度の抵抗値に選ば
れる。To extract signals from each MR thin film (4) of the multi-channel MR head described above, a circuit configuration as shown in Figure 3 is adopted. That is, n MR thin films (4) are isometrically represented by n variable resistors RM, to RMn, and constant current resistors connected in series to these are represented by R1-Rn. Variable resistor RM1~
The fixed resistance value of RMn is about 1000, and the resistance change due to an external magnetic field is about 1 inch. On the other hand, the resistance values of the constant current resistors R1 to Rn are selected to be about 200 to 3000.
抵抗器Ｒ１ｓ ＲＭ １−Ｒｎ ｒ ＲＭ ｎの各直列
回路は互いに並列接続され、その並列回路の両端に直流
電源Ｅｌが接続されることによシ、各可変抵抗器ＲＭｔ
〜ＲＭｎには略一定の直流電流が流される。Ｃ１ｌ、は
直流電源Ｅ！に並列接続された安定化コンデンサである
。The series circuits of the resistors R1s RM 1-Rn r RM n are connected in parallel with each other, and the DC power supply El is connected to both ends of the parallel circuit, so that each variable resistor RMt
A substantially constant direct current is passed through ~RMn. C1l is the DC power supply E! is a stabilizing capacitor connected in parallel with
抵抗器Ｒ１＊ ＲＭｌ ””’Ｒｎｐ ＲＭ、の各直列
回路の夫々の接続中点よシ可変抵抗器ＲＩＶＩ、〜ＲＭ
の抵抗変化に基づく再生信号が得られ、その各再生信号
が夫々結合コンデンサｃＩ〜Ｃを通じて前置増幅器Ａ１
〜Ａｎに供給され、その各出方が並列−直列変換器（６
）に供給される。Resistor R1* RMl ""'Rnp RM, variable resistor RIVI, ~RM
A reproduction signal is obtained based on the resistance change of
~An, and each output is connected to a parallel-to-serial converter (6
).
Ｅ２は全体としてＩＣ化された増幅器Ａ１〜Ａｎ及び並
列−直列変換器（２）等に接続される直流電源で、ｔは
その出力端子であシ、Ｃ８２はこの直流電源Ｅ２に並列
接続された安定化コンデンサである。E2 is a DC power supply connected to the amplifiers A1 to An and the parallel-to-serial converter (2), which are all integrated into an IC, t is its output terminal, and C82 is connected in parallel to this DC power supply E2. It is a stabilizing capacitor.
第４図にかかる磁気ヘッド装置の機械的構成を示し、０
時はＭＲヘッド（ＭＲ薄膜（４） （［；！ Ｍ＋〜Ｒ
＋１／Ｉｎ）及び抵抗器Ｒ１−Ｒｎを含む）、αＱは上
述のコンデンサＣ，〜ｃ、ｃ、ｃ を含むコ、デ１ ８
１ ８２
ンサアレイ、αりはその保持基板、Ｈは上述の前置増幅
器Ａ、−Ａｎ及び並列−直列変換器（６）等を含むＩＣ
チップ、α優はＩＣＣシフα句に対するヒートシンク、
（２）は信号取出しのだめの出方導線の配線されたソリ
ッドプリント配線基板である。FIG. 4 shows the mechanical configuration of the magnetic head device according to 0
Time is MR head (MR thin film (4) ([;! M+~R
+1/In) and resistors R1-Rn), αQ includes the above-mentioned capacitors C, ~c, c, c.
1 82 sensor array, α is its holding substrate, H is an IC including the above-mentioned preamplifiers A, -An, parallel-to-serial converter (6), etc.
Chip, α Yu is a heat sink for ICC Schiff α clause,
(2) is a solid printed wiring board on which a signal output lead wire is wired.
そして、ＭＲヘッドα転コンデンサアレイ（１１゜ＩＣ
チップα椴及びプリント配線基板（ホ）の谷間が夫夫金
等のワイアｗｌ−ｗｗ３によシ順次電気的に接続（ボン
ディング）されている。Then, the MR head α-turning capacitor array (11° IC
The valleys of the chip α and the printed wiring board (E) are sequentially electrically connected (bonded) by wires wl to ww3 made of metal wires.
ｅυ、に）は上下のモールド体で、上記各部品を一体に
モールドしている。eυ, ni) is an upper and lower molded body, in which the above-mentioned parts are integrally molded.
しかして、このワイヤＷ、％Ｗ３の本数は、夫夫チャン
ネル数×２本十出カ端子用８本十電源ライン用数本で、
合計すると６０本近くになり、ワイヤがンデイングの作
業が煩雑である。Therefore, the number of wires W, %W3 is the number of channels x 2, 8 for output terminals, and several for power supply lines.
There are nearly 60 wires in total, and the work of winding the wires is complicated.
又、コンデンサアレイαＱの保持基板αηは、下面にコ
ンデンサを半田付けし、上面にポンプイングツ母ツドを
設けたスルーホールソリッド基板であ広構成が複り且つ
細かくなる。Further, the holding board αη of the capacitor array αQ is a through-hole solid board with a capacitor soldered to the bottom surface and a pumping pin provided on the top surface, and has a wide and complex configuration.
発明の目的
かかる点に鑑み、本発明は構成簡単、装造容易なこの種
磁気ヘッド装置を提案しようとするものである。OBJECT OF THE INVENTION In view of these points, the present invention seeks to propose a magnetic head device of this type that is simple in structure and easy to install.
発明の概要
本発明による磁気ヘッド装置は、多チャンネル磁気ヘッ
ドと、多チャンネル磁気ヘッドに関連した回数から成る
ＩＣチップとがプリント配線基板の配線導電層に電気的
に接続されて取付けられ、多チャンネル磁気ヘッド、Ｉ
Ｃチップ及びプリント配線基板が一体化されてハウジン
グ内に収納されて成ることを特徴とするものである。か
かる本発明によれば、構成簡単、製造容易なこの種磁気
ヘッド装置を得ることができる。SUMMARY OF THE INVENTION A magnetic head device according to the present invention includes a multi-channel magnetic head and an IC chip consisting of a number of times related to the multi-channel magnetic head, which are electrically connected to and attached to a wiring conductive layer of a printed wiring board. magnetic head, I
It is characterized in that the C chip and the printed wiring board are integrated and housed in a housing. According to the present invention, it is possible to obtain a magnetic head device of this type that is simple in structure and easy to manufacture.
実施例
以下、第５図及び第６図を参照して、本発明の一実施例
を説明する。（２）はプリント配線基板、特にフレキシ
ブルプリント配線基板（フィルムキャリア）で、ポリイ
ミド等の基材から成シ、その上に所定パターンの銅等の
配線導電層が被着形成されている。そして、この基板曽
の例えば同一面の所定導電層上にコンデンサプレイαＱ
の電極を半田付けすると共に、ＩＣチップα呻をワイア
デンＰ（又は半田バンプによる接続も可）によって他の
所定導電層上に接続する。そして、かかる基板（２）の
リード導電層（２３ａ）を、予めモールド体Ｑηに取付
けられた多チャンネル磁気ヘッドの各端子に半田付けす
る。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 5 and 6. (2) is a printed wiring board, particularly a flexible printed wiring board (film carrier), which is made of a base material such as polyimide, on which a wiring conductive layer of copper or the like in a predetermined pattern is deposited. Then, a capacitor plate αQ is placed on a predetermined conductive layer on the same surface of this substrate, for example.
At the same time, the IC chip α is connected to another predetermined conductive layer using Wireden P (or connection by solder bumps is also possible). Then, the lead conductive layer (23a) of the substrate (2) is soldered to each terminal of the multi-channel magnetic head previously attached to the molded body Qη.
そして、取付けめねじ（１９ａつの形成されたヒートシ
ンク（１９’）の埋め込まれたモールド体０没に上述の
各部品の取付けられた基板（ハ）を載置し、その上をポ
ツティングレジン（２２つでモールドｆｆして、全体を
一体化する。かくして、磁気ヘッド装置の信頼性及び強
度が確保できる。Then, place the board (c) on which each of the above-mentioned parts is attached to the molded body in which the heat sink (19') formed with the female mounting screws (19a) is embedded, and then cover it with the potting resin (22'). The magnetic head device is molded ff and the whole is integrated.In this way, the reliability and strength of the magnetic head device can be ensured.
かくして、ＩＣチップに）はヒートシンク（１９つ上に
接触し、コンデンサアレイα→がモールド体０１）の凹
溝内、に配され、ＭＲヘッド（２）がモールド体（２）
の端部に配される。尚、モールド体０１） 、 （２２
’）にてハウジングが構成される。Thus, the IC chip) is placed in the concave groove of the mold body 01, and the capacitor array α is placed in the concave groove of the mold body 01, and the MR head (2) is placed in the mold body 01.
placed at the end of the In addition, mold bodies 01), (22
') the housing is configured.
次に、第７図及び第８図を参照して、本発明の他の実施
例を説明するも、第７図及び第８図に於いて、第５図及
び第６図と対応する部分には同一符号を付して重複説明
を省略する。本実施例に於いては、プリント配線基板■
の上面にＩＣチップＱ時を取付け、下面に２列にコンデ
ンサアレイ（夫夫１３枚のコンデンサから成る）αＱ、
αＱを取付けた場合である。尚、ヒートシンクは、上側
のモールド（２２’）上に配することができる。Next, other embodiments of the present invention will be described with reference to FIGS. 7 and 8. In FIGS. 7 and 8, parts corresponding to FIGS. are given the same reference numerals and repeated explanation will be omitted. In this example, the printed wiring board ■
The IC chip Q is mounted on the top surface, and the capacitor array (consisting of 13 capacitors) αQ is installed in two rows on the bottom surface.
This is the case when αQ is installed. Note that the heat sink can be placed on the upper mold (22').
尚、上述の各実施例に於いて、多チ・ヤンネルＭＲヘッ
ドの代シに、多チヤンネル電磁誘導型薄膜ヘッド等の多
チャンネルヘッド？用いても良い。In each of the above embodiments, instead of the multi-channel MR head, a multi-channel head such as a multi-channel electromagnetic induction thin film head is used. May be used.
上述せる本発明によれば、プリント配線基板に多チャン
ネル磁気ヘッド、これに関連したＩＣチップを取付けた
後、ハウジング内に一体に収納するので、構成簡単、製
造容易な多チャンネル磁気ヘッドを備えた磁気ヘッド装
置を得ることができる。又、製造が容易なことから、装
置の歩留υが向上する。更に、構成の複雑なコンデンサ
アレイの保持板も不要になる。According to the present invention described above, the multi-channel magnetic head and the related IC chip are mounted on the printed wiring board and then housed integrally in the housing, so that the multi-channel magnetic head is provided with a simple structure and easy manufacture. A magnetic head device can be obtained. Furthermore, since manufacturing is easy, the yield υ of the device is improved. Furthermore, the need for a holding plate for a capacitor array having a complicated structure is also eliminated.
発明の効果
上述せる本発明によれば、多チャンネル磁気ヘッドを備
えた構成簡単、製造容易な磁気ヘッド装置を得ることが
できる。又、製造が容易なことから、装置の歩留９が向
上する。Effects of the Invention According to the present invention described above, it is possible to obtain a magnetic head device equipped with a multi-channel magnetic head that is simple in structure and easy to manufacture. Furthermore, since manufacturing is easy, the yield 9 of the device is improved.
第１図及び第２図は夫々従来のＭＲヘッドを示す断面図
及びその一部の平面図、第３図はＭＲヘッドを備える従
来の磁気ヘッド装置の回路系を示す回路図、第４図は従
来の磁気ヘッド装置を示す断面図、第５図及び第６図は
夫々本発明の一実施例の断面図及びその部分の斜視図、
第７図及び第８図は夫々本発明の他の実施例の上部モー
ルドを除去した状態の平面図及び全体の断面図である。
（ト）は磁気ヘッド、００はコンデンサアレイ、ａ鞭は
ＩＣチップ、（１９’）はヒートシンク、い慢はプリン
ト基板、（ハ）、（２２つはモールド体である。
第１図
１α
第２図
第８図
第４図
第７図
１
第８図
２１ １５1 and 2 are a cross-sectional view and a plan view of a part of a conventional MR head, respectively. FIG. 3 is a circuit diagram showing a circuit system of a conventional magnetic head device equipped with an MR head. A sectional view showing a conventional magnetic head device, FIGS. 5 and 6 are a sectional view and a perspective view of an embodiment of the present invention, respectively,
FIGS. 7 and 8 are a plan view and an overall sectional view, respectively, of another embodiment of the present invention with the upper mold removed. (g) is a magnetic head, 00 is a capacitor array, a is an IC chip, (19') is a heat sink, arrogance is a printed circuit board, (c), (22 is a molded body. Fig. 1 1α 2nd Figure 8 Figure 4 Figure 7 Figure 1 Figure 8 21 15
Claims (1)
に関連した回路から成るＩＣチップとがプリント配線基
板の配線導電層に電気的に接続されて取付けられ、上記
多チャンネル磁気ヘッド、上記ＩＣチップ及び上記プリ
ント配線基板が一体化されてハウジング内に収納されて
成ることを特徴とする磁気ヘッド装置。A multi-channel magnetic head and an IC chip comprising a circuit related to the multi-channel magnetic head are electrically connected and attached to a wiring conductive layer of a printed wiring board, and the multi-channel magnetic head, the IC chip, and the printed circuit board are electrically connected to and mounted on a wiring conductive layer of a printed wiring board. A magnetic head device characterized in that a wiring board is integrated and housed in a housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58247806A JPH071528B2 (en) | 1983-12-29 | 1983-12-29 | Magnetic head device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58247806A JPH071528B2 (en) | 1983-12-29 | 1983-12-29 | Magnetic head device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60143417A true JPS60143417A (en) | 1985-07-29 |
| JPH071528B2 JPH071528B2 (en) | 1995-01-11 |
Family
ID=17168932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58247806A Expired - Lifetime JPH071528B2 (en) | 1983-12-29 | 1983-12-29 | Magnetic head device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071528B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139101A (en) * | 1985-12-12 | 1987-06-22 | Mitsubishi Electric Corp | Rotating head type magnetic recording and reproducing device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610682A (en) * | 1980-02-23 | 1981-02-03 | Kyowa Shinkuu Gijutsu Kk | Vacuum dryer |
| JPS57195625U (en) * | 1981-06-09 | 1982-12-11 | ||
| JPS587221U (en) * | 1981-07-03 | 1983-01-18 | アルプス電気株式会社 | magnetic head |
| JPS5850621A (en) * | 1981-09-18 | 1983-03-25 | Canon Electronics Inc | Thin film magnetic head |
| JPS58224430A (en) * | 1982-06-23 | 1983-12-26 | Canon Inc | Hybrid thin film integrated head |
-
1983
- 1983-12-29 JP JP58247806A patent/JPH071528B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610682A (en) * | 1980-02-23 | 1981-02-03 | Kyowa Shinkuu Gijutsu Kk | Vacuum dryer |
| JPS57195625U (en) * | 1981-06-09 | 1982-12-11 | ||
| JPS587221U (en) * | 1981-07-03 | 1983-01-18 | アルプス電気株式会社 | magnetic head |
| JPS5850621A (en) * | 1981-09-18 | 1983-03-25 | Canon Electronics Inc | Thin film magnetic head |
| JPS58224430A (en) * | 1982-06-23 | 1983-12-26 | Canon Inc | Hybrid thin film integrated head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139101A (en) * | 1985-12-12 | 1987-06-22 | Mitsubishi Electric Corp | Rotating head type magnetic recording and reproducing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071528B2 (en) | 1995-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |